JP2013162295A5 - - Google Patents
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- Publication number
- JP2013162295A5 JP2013162295A5 JP2012022061A JP2012022061A JP2013162295A5 JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5 JP 2012022061 A JP2012022061 A JP 2012022061A JP 2012022061 A JP2012022061 A JP 2012022061A JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting surface
- base substrate
- electrode
- hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012022061A JP2013162295A (ja) | 2012-02-03 | 2012-02-03 | ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012022061A JP2013162295A (ja) | 2012-02-03 | 2012-02-03 | ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013162295A JP2013162295A (ja) | 2013-08-19 |
| JP2013162295A5 true JP2013162295A5 (https=) | 2015-03-26 |
Family
ID=49174220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012022061A Withdrawn JP2013162295A (ja) | 2012-02-03 | 2012-02-03 | ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013162295A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6591747B2 (ja) * | 2014-12-26 | 2019-10-16 | 京セラ株式会社 | 圧電デバイスの製造方法 |
| JP6852569B2 (ja) * | 2017-05-30 | 2021-03-31 | セイコーエプソン株式会社 | Ｍｅｍｓ素子、電子機器および移動体 |
| US12028042B2 (en) | 2018-12-27 | 2024-07-02 | Daishinku Corporation | Piezoelectric resonator device having a through hole and through electrode for conduction with an external electrode terminal |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009225218A (ja) * | 2008-03-18 | 2009-10-01 | Citizen Holdings Co Ltd | 電極構造、電子デバイス、及び電極構造の製造方法 |
| JP5108579B2 (ja) * | 2008-03-21 | 2012-12-26 | シチズンファインテックミヨタ株式会社 | 電子部品パッケージの製造方法および電子部品パッケージ |
| US8129888B2 (en) * | 2008-08-05 | 2012-03-06 | Daishinku Corporation | Sealing member of piezoelectric resonator device and manufacturing method therefor |
| JP2011124752A (ja) * | 2009-12-10 | 2011-06-23 | Seiko Epson Corp | 圧電デバイスおよびその封止方法 |
-
2012
- 2012-02-03 JP JP2012022061A patent/JP2013162295A/ja not_active Withdrawn
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