JP2008135999A - 弾性波デバイスおよびその製造方法 - Google Patents

弾性波デバイスおよびその製造方法 Download PDF

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Publication number
JP2008135999A
JP2008135999A JP2006320892A JP2006320892A JP2008135999A JP 2008135999 A JP2008135999 A JP 2008135999A JP 2006320892 A JP2006320892 A JP 2006320892A JP 2006320892 A JP2006320892 A JP 2006320892A JP 2008135999 A JP2008135999 A JP 2008135999A
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JP
Japan
Prior art keywords
acoustic wave
conductive pattern
electrode
wave element
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006320892A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008135999A5 (https=
Inventor
Shunichi Aikawa
俊一 相川
Joji Kimura
丈児 木村
Keiji Tsuda
慶二 津田
Kazunori Inoue
和則 井上
Takashi Matsuda
隆志 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Fujitsu Media Devices Ltd
Original Assignee
Fujitsu Ltd
Fujitsu Media Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Fujitsu Media Devices Ltd filed Critical Fujitsu Ltd
Priority to JP2006320892A priority Critical patent/JP2008135999A/ja
Priority to KR20070121027A priority patent/KR100891419B1/ko
Priority to US11/987,175 priority patent/US7721411B2/en
Priority to CN2007101960361A priority patent/CN101192816B/zh
Publication of JP2008135999A publication Critical patent/JP2008135999A/ja
Publication of JP2008135999A5 publication Critical patent/JP2008135999A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2006320892A 2006-11-28 2006-11-28 弾性波デバイスおよびその製造方法 Pending JP2008135999A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006320892A JP2008135999A (ja) 2006-11-28 2006-11-28 弾性波デバイスおよびその製造方法
KR20070121027A KR100891419B1 (ko) 2006-11-28 2007-11-26 탄성파 디바이스의 제조 방법
US11/987,175 US7721411B2 (en) 2006-11-28 2007-11-28 Method of manufacturing an acoustic wave device
CN2007101960361A CN101192816B (zh) 2006-11-28 2007-11-28 制造声波器件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006320892A JP2008135999A (ja) 2006-11-28 2006-11-28 弾性波デバイスおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2008135999A true JP2008135999A (ja) 2008-06-12
JP2008135999A5 JP2008135999A5 (https=) 2009-03-19

Family

ID=39462935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006320892A Pending JP2008135999A (ja) 2006-11-28 2006-11-28 弾性波デバイスおよびその製造方法

Country Status (4)

Country Link
US (1) US7721411B2 (https=)
JP (1) JP2008135999A (https=)
KR (1) KR100891419B1 (https=)
CN (1) CN101192816B (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182288A (ja) * 2011-03-01 2012-09-20 Ngk Insulators Ltd 端子電極形成方法及びそれを用いた圧電／電歪素子の製造方法
JP2013070347A (ja) * 2011-09-26 2013-04-18 Taiyo Yuden Co Ltd 弾性波デバイス及びその製造方法
JP2013138362A (ja) * 2011-12-28 2013-07-11 Taiyo Yuden Co Ltd 弾性波デバイスの製造方法
WO2014087752A1 (ja) * 2012-12-05 2014-06-12 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
WO2015025618A1 (ja) * 2013-08-20 2015-02-26 株式会社 村田製作所 弾性表面波デバイス及びその製造方法
US9644282B2 (en) 2012-01-30 2017-05-09 Murata Manufacturing Co., Ltd. Manufacturing method of electronic component

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241518B (zh) * 2014-08-29 2017-03-15 北京长峰微电科技有限公司 一种声表面波器件晶圆钝化方法
GB2571361B (en) 2018-03-02 2020-04-22 Novosound Ltd Ultrasound array transducer manufacturing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188669A (ja) * 2001-12-18 2003-07-04 Matsushita Electric Ind Co Ltd Ｓａｗデバイスの製造方法及びｓａｗデバイス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03293808A (ja) * 1990-04-11 1991-12-25 Fujitsu Ltd 弾性表面波素子の製造方法
JP3329696B2 (ja) 1997-07-08 2002-09-30 株式会社東芝 半導体装置の製造方法
JP3368885B2 (ja) * 2000-03-15 2003-01-20 株式会社村田製作所 弾性表面波装置の製造方法
JP2002141762A (ja) * 2000-11-02 2002-05-17 Murata Mfg Co Ltd 弾性表面波フィルタの製造方法
WO2003005577A1 (en) * 2001-07-02 2003-01-16 Matsushita Electric Industrial Co., Ltd. Method for manufacturing surface acoustic wave device
JP2004056036A (ja) 2002-07-24 2004-02-19 Sony Corp 半導体装置の製造方法
JP2004080221A (ja) * 2002-08-13 2004-03-11 Fujitsu Media Device Kk 弾性波デバイス及びその製造方法
JP3892370B2 (ja) * 2002-09-04 2007-03-14 富士通メディアデバイス株式会社 弾性表面波素子、フィルタ装置及びその製造方法
JP4177233B2 (ja) * 2003-01-28 2008-11-05 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188669A (ja) * 2001-12-18 2003-07-04 Matsushita Electric Ind Co Ltd Ｓａｗデバイスの製造方法及びｓａｗデバイス

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182288A (ja) * 2011-03-01 2012-09-20 Ngk Insulators Ltd 端子電極形成方法及びそれを用いた圧電／電歪素子の製造方法
JP2013070347A (ja) * 2011-09-26 2013-04-18 Taiyo Yuden Co Ltd 弾性波デバイス及びその製造方法
JP2013138362A (ja) * 2011-12-28 2013-07-11 Taiyo Yuden Co Ltd 弾性波デバイスの製造方法
US9644282B2 (en) 2012-01-30 2017-05-09 Murata Manufacturing Co., Ltd. Manufacturing method of electronic component
WO2014087752A1 (ja) * 2012-12-05 2014-06-12 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
JP6044643B2 (ja) * 2012-12-05 2016-12-14 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
US10320355B2 (en) 2012-12-05 2019-06-11 Murata Manufacturing Co., Ltd. Method of manufacturing elastic wave device
US20190260341A1 (en) * 2012-12-05 2019-08-22 Murata Manufacturing Co., Ltd. Elastic wave device
US10644669B2 (en) * 2012-12-05 2020-05-05 Murata Manufacturing Co., Ltd. Elastic wave device
WO2015025618A1 (ja) * 2013-08-20 2015-02-26 株式会社 村田製作所 弾性表面波デバイス及びその製造方法
US10374142B2 (en) 2013-08-20 2019-08-06 Murata Manufacturing Co., Ltd. Surface acoustic wave device and manufacturing method therefor

Also Published As

Publication number Publication date
US20080122318A1 (en) 2008-05-29
KR20080048404A (ko) 2008-06-02
KR100891419B1 (ko) 2009-04-02
CN101192816B (zh) 2010-06-23
CN101192816A (zh) 2008-06-04
US7721411B2 (en) 2010-05-25

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