KR100891419B1 - 탄성파 디바이스의 제조 방법 - Google Patents

탄성파 디바이스의 제조 방법 Download PDF

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Publication number
KR100891419B1
KR100891419B1 KR20070121027A KR20070121027A KR100891419B1 KR 100891419 B1 KR100891419 B1 KR 100891419B1 KR 20070121027 A KR20070121027 A KR 20070121027A KR 20070121027 A KR20070121027 A KR 20070121027A KR 100891419 B1 KR100891419 B1 KR 100891419B1
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KR
South Korea
Prior art keywords
conductive pattern
acoustic wave
electrode
forming
wave element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR20070121027A
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English (en)
Korean (ko)
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KR20080048404A (ko
Inventor
순이찌 아이까와
죠우지 기무라
게이지 쯔다
가즈노리 이노우에
다까시 마쯔다
Original Assignee
후지쓰 메디아 데바이스 가부시키가이샤
후지쯔 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 후지쓰 메디아 데바이스 가부시키가이샤, 후지쯔 가부시끼가이샤 filed Critical 후지쓰 메디아 데바이스 가부시키가이샤
Publication of KR20080048404A publication Critical patent/KR20080048404A/ko
Application granted granted Critical
Publication of KR100891419B1 publication Critical patent/KR100891419B1/ko
Assigned to 다이요 유덴 가부시키가이샤 reassignment 다이요 유덴 가부시키가이샤 권리지분의 전부이전등록 Assignors: 후지쯔 가부시끼가이샤
Assigned to 다이요 유덴 가부시키가이샤 reassignment 다이요 유덴 가부시키가이샤 권리지분의 전부이전등록 Assignors: 후지쓰 메디아 데바이스 가부시키가이샤
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
KR20070121027A 2006-11-28 2007-11-26 탄성파 디바이스의 제조 방법 Expired - Fee Related KR100891419B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006320892A JP2008135999A (ja) 2006-11-28 2006-11-28 弾性波デバイスおよびその製造方法
JPJP-P-2006-00320892 2006-11-28

Publications (2)

Publication Number Publication Date
KR20080048404A KR20080048404A (ko) 2008-06-02
KR100891419B1 true KR100891419B1 (ko) 2009-04-02

Family

ID=39462935

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20070121027A Expired - Fee Related KR100891419B1 (ko) 2006-11-28 2007-11-26 탄성파 디바이스의 제조 방법

Country Status (4)

Country Link
US (1) US7721411B2 (https=)
JP (1) JP2008135999A (https=)
KR (1) KR100891419B1 (https=)
CN (1) CN101192816B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5714361B2 (ja) * 2011-03-01 2015-05-07 日本碍子株式会社 端子電極形成方法及びそれを用いた圧電／電歪素子の製造方法
JP5848079B2 (ja) * 2011-09-26 2016-01-27 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP5882053B2 (ja) * 2011-12-28 2016-03-09 太陽誘電株式会社 弾性波デバイスの製造方法
WO2013114919A1 (ja) 2012-01-30 2013-08-08 株式会社村田製作所 電子部品の製造方法
WO2014087752A1 (ja) * 2012-12-05 2014-06-12 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
JP5713224B1 (ja) * 2013-08-20 2015-05-07 株式会社村田製作所 弾性表面波デバイス及びその製造方法
CN104241518B (zh) * 2014-08-29 2017-03-15 北京长峰微电科技有限公司 一种声表面波器件晶圆钝化方法
GB2571361B (en) 2018-03-02 2020-04-22 Novosound Ltd Ultrasound array transducer manufacturing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141762A (ja) * 2000-11-02 2002-05-17 Murata Mfg Co Ltd 弾性表面波フィルタの製造方法
JP2003188669A (ja) * 2001-12-18 2003-07-04 Matsushita Electric Ind Co Ltd Ｓａｗデバイスの製造方法及びｓａｗデバイス

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03293808A (ja) * 1990-04-11 1991-12-25 Fujitsu Ltd 弾性表面波素子の製造方法
JP3329696B2 (ja) 1997-07-08 2002-09-30 株式会社東芝 半導体装置の製造方法
JP3368885B2 (ja) * 2000-03-15 2003-01-20 株式会社村田製作所 弾性表面波装置の製造方法
WO2003005577A1 (en) * 2001-07-02 2003-01-16 Matsushita Electric Industrial Co., Ltd. Method for manufacturing surface acoustic wave device
JP2004056036A (ja) 2002-07-24 2004-02-19 Sony Corp 半導体装置の製造方法
JP2004080221A (ja) * 2002-08-13 2004-03-11 Fujitsu Media Device Kk 弾性波デバイス及びその製造方法
JP3892370B2 (ja) * 2002-09-04 2007-03-14 富士通メディアデバイス株式会社 弾性表面波素子、フィルタ装置及びその製造方法
JP4177233B2 (ja) * 2003-01-28 2008-11-05 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141762A (ja) * 2000-11-02 2002-05-17 Murata Mfg Co Ltd 弾性表面波フィルタの製造方法
JP2003188669A (ja) * 2001-12-18 2003-07-04 Matsushita Electric Ind Co Ltd Ｓａｗデバイスの製造方法及びｓａｗデバイス

Also Published As

Publication number Publication date
US20080122318A1 (en) 2008-05-29
JP2008135999A (ja) 2008-06-12
KR20080048404A (ko) 2008-06-02
CN101192816B (zh) 2010-06-23
CN101192816A (zh) 2008-06-04
US7721411B2 (en) 2010-05-25

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