JP2008112966A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2008112966A JP2008112966A JP2007194018A JP2007194018A JP2008112966A JP 2008112966 A JP2008112966 A JP 2008112966A JP 2007194018 A JP2007194018 A JP 2007194018A JP 2007194018 A JP2007194018 A JP 2007194018A JP 2008112966 A JP2008112966 A JP 2008112966A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- emitting element
- lead terminal
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
【解決手段】本発明に係る発光装置の製造方法は、内壁と底面とを有する凹部を備えるパッケージと、該凹部の底面に露出されるとともにパッケージ外部に突出されるリード端子とを有し、前記凹部の底面に露出されるリード端子は、半導体発光素子載置領域と、半導体発光素子からの導電性ワイヤが接続されるワイヤ接続領域とを有する発光装置であって、前記半導体発光素子載置領域と前記ワイヤ接続領域との間、前記半導体発光素子載置領域間、の少なくとも1つの領域に溝部を有し、前記溝部は、前記リード端子の凹部底面における露出部端から離間するよう設けられることを特徴とする。
【選択図】図1A
Description
これにより、素子載置領域とワイヤ接続領域とを分離することができるため、ダイボンド部材が流動するのを阻止することができ、載置不良やワイヤボンド不良を防止することができる。
これにより、溝部内にパッケージ樹脂が流入するのを防ぐことができ、工程内において不良が発生するのを防止することができる。
また、図5に示すように、3つの半導体発光素子107が搭載されているのみで、保護素子が搭載されていない発光装置であってもよい。
本発明において、リード端子に設けられる溝部は、半導体発光素子や保護素子をリード端子上に接続させているダイボンド部材が流動するのを阻止するためのものであり、これにより近接する半導体発光素子や保護素子の接続に影響を与えることを防止するものである。したがって溝部106、206、306A〜306C、506A、506B、506C、606A、606B、706A、706Bが設けられる位置としては、図1Aに示すように半導体発光素子107の載置領域と保護素子108の載置領域との間や、図2Aに示すように保護素子208の載置領域と、半導体発光素子207からのワイヤ205の接続領域との間、図3に示すように半導体発光素子載置領域と、半導体発光素子からのワイヤの接続領域との間や、半導体発光素子307の載置領域と、保護素子308からのワイヤ305の接続領域や、図5に示すように半導体発光素子107の載置領域間、図6に示すように半導体発光素子507の載置領域と、保護素子508からのワイヤ505の接続領域や、半導体発光素子載置領域と、半導体発光素子からのワイヤの接続領域との間、図7示すように半導体発光素子載置領域と、半導体発光素子607からのワイヤ605の接続領域との間や、半導体発光素子607の載置領域と、保護素子608からのワイヤ605の接続領域、図8に示すように半導体発光素子707の載置領域間に設けることができる。このような位置に溝部を設けることで、ダイボンド部材の流動を阻止することができる。また、溝を形成することによって、ダイボンド部材の流動を所定の方向(溝部の方向)に促すことができるため、実装精度及び実装密度を向上させることがきるとともに、ワイヤを短くすることができるために、短絡等の問題を最小限にとどめ、高品質の発光装置を得ることができる。さらに、このような溝部を設けることにより、過度のダイボンド部材の広がりを確実に防止することができるために、ダイボンド部材の使用量を多少多くして、半導体発光素子、任意に保護素子を強固に固定することが可能となる。
加えて、ダイボンド部材によって、接続に影響しないリード端子の領域を最大限に被覆することができるために、例えば、リード端子が銀等で形成されている場合においても、酸化や硫化等の反応性を防止することができる。
このとき、押圧する加重や回数などは任意に選択することができ、また、角度なども任意に選択することができる。また、加工器具の先端形状を変更することで、溝部の形状(平面視形状や深さ方向の形状)や深さなどを変更することができる。図1Cでは、断面がV字状(三角形)になるように形成しているがこれに限るものではなく、四角形、長方形、台形などの多角形や、側面や溝部底面が曲面となるような形状とすることもできる。
なお、溝部を後述するように複数個設ける場合、特に、図7及び図8のように、向きの異なる溝部を設ける場合、両者を交差させないように配置することが好ましい。向きの異なる溝部を交差させると、上述した盛り上がり状態が過度になり、これによって、パッケージの形成の際に、金型との間に隙間が形成され、パッケージ樹脂がその隙間に流れ込むことがあるからである。従って、溝部の深さ、溝部間の距離等を考慮して、基準平面よりも高い領域がオーバーラップしないように配置することが好ましい。
リード端子の形状は、特に限定されるものではない。半導体発光素子と電気的に接続可能で、かつ、一部が基体に内包されるとともに基体の外部から突出するように延設され、この延設部によって外部と電気的な接続がとれるような機能を有していればよい。また、凹部の底面に露出されるリード端子は、貫通孔を有していてもよい。例えば、図1Aではリード端子102Aはパッケージ101と同一の樹脂で形成された露出部101Aが形成されているが、この部分はリード端子の開口部であり、射出成形時に樹脂が開口部内に充填されることで形成されるものである。この露出部によって凹部底面においてリード端子102Aは分離されているが、パッケージ内部では連続している。このように半導体発光素子107の載置領域と、半導体発光素子107からのワイヤ105の接合領域との間に、広いスペースがある場合は溝部ではなく、貫通孔を設けることでダイボンド部材の流動を阻止することができる。また、この露出部101Aは、さらに突起部101A‘を設けることもでき、これによりダイボンド部材の流動をより確実に阻止することができる。突起部は図1Aのようにパッケージの露出部101Aの幅よりも小さくてもよく、あるいは図2に示すように露出部全体を突起部201A’としてもよい。
パッケージは半導体発光素子や保護素子などの電子部品を保護するとともに、これら電子部品に外部からの電流を供給するための導電部材を備えているものである。パッケージの形状は、平面視において四角形又はこれに近い形状を有するものが好ましいが、特にこれに限定されるものではなく、平面視において三角形、四角形、多角形又はこれらに近い形状とすることができる。
封止部材は、凹部を有するパッケージに載置された半導体発光素子や保護素子などを、塵芥、水分や外力などから保護する部材であり、半導体発光素子からの光を透過可能な透光性を有するものが好ましい。具体的な材料としては、シリコーン樹脂、エポキシ樹脂やユリア樹脂を挙げることができる。このような材料に加え、所望に応じて着色剤、光拡散剤、フィラー、色変換部材(蛍光部材)などを含有させることもできる。
ダイボンド部材は、基体や導電部材に半導体発光素子や保護素子などを載置させるための接合部材であり、載置する素子の基板によって導電性ダイボンド部材又は縁性ダイボンド部材のいずれかを選択することができる。例えば、絶縁性基板であるサファイア上に窒化物半導体層を積層させた半導体発光素子の場合、ダイボンド部材は絶縁性でも導電性でも用いることができ、SiC基板などの導電性基板を用いる場合は、導電性ダイボンド部材を用いることで導通を図ることができる。絶縁性ダイボンド部材としては、エポキシ樹脂、シリコーン樹脂等を用いることができる。これらの樹脂を用いる場合は、半導体発光素子からの光や熱による劣化を考慮して、半導体発光素子裏面にAl膜などの反射率の高い金属層を設けることができる。この場合、蒸着やスパッタあるいは薄膜を接合させるなどの方法を用いることができる。また、導電性ダイボンド部材としては、銀、金、パラジウムなどの導電性ペーストや、Au−Sn共晶などの半田、低融点金属等のろう材を用いることができる。さらに、これらダイボンド部材のうち、特に透光性のダイボンド部材を用いる場合は、その中に半導体発光素子からの光を吸収して異なる波長の光を発光する蛍光部材を含有させることもできる。
半導体発光素子の電極と、パッケージに設けられる導電部材とを接続する導電性ワイヤは、導電部材とのオーミック性、機械的接続性、電気伝導性及び熱伝導性が良いものが求められる。熱伝導度としては0.01cal/(s)(cm2)(℃/cm)以上が好ましく、より好ましくは0.5cal/(s)(cm2)(℃/cm)以上である。また、作業性などを考慮して導電性ワイヤの直径は、好ましくは、Φ10μm以上、Φ45μm以下である。このような導電性ワイヤとして具体的には、金、銅、白金、アルミニウム等の金属及びそれらの合金を用いた導電性ワイヤが挙げられる。
上記透光性部材中に、波長変換部材として半導体発光素子からの光の少なくとも一部を吸収して異なる波長を有する光を発する蛍光部材を含有させることもできる。
本発明においては、半導体発光素子として発光ダイオード(LED)を用いるのが好ましい。これにより、導光部材に効率良く光を導入することができる。
101、201、301、501、601、701・・・パッケージ
102A、102B、201A、202B、302A、302B、502A、502B、602A、602B、702A、702B・・・リード端子
103、203、303・・・凹部
104・・・封止部材
105、205、305、505、605、705・・・導電性ワイヤ
106、206、306A、306B、306B、406、506A、506B、506C、606A、606B、706A、706B・・・溝部
107、207、307、507、607、707・・・半導体発光素子
108、208、308、508、608・・・保護素子
409A、409B・・・リード端子の基準平面よりも高い領域
Claims (3)
- 内壁と底面とを有する凹部を備えるパッケージと、該凹部の底面に露出されるとともにパッケージ外部に突出されるリード端子とを有し、
前記凹部の底面に露出されるリード端子は、半導体発光素子載置領域と、半導体発光素子からの導電性ワイヤが接続されるワイヤ接続領域とを有する発光装置であって、
前記半導体発光素子載置領域と前記ワイヤ接続領域との間、前記半導体発光素子載置領域間、の少なくとも1つの領域に溝部を有し、
前記溝部は、前記リード端子の凹部底面における露出部端から離間するよう設けられることを特徴とする発光装置。 - 内壁と底面とを有する凹部を備えるパッケージと、該凹部の底面に露出されるとともにパッケージ外部に突出されるリード端子とを有し、
前記凹部の底面に露出されるリード端子は、半導体発光素子載置領域と、保護素子素子載置領域と、半導体発光素子又は保護素子からの導電性ワイヤが接続されるワイヤ接続領域とを有する発光装置であって、
前記半導体発光素子載置領域と前記保護素子載置領域との間、前記半導体発光素子載置領域と前記ワイヤ接続領域との間、前記保護素子載置領域と前記ワイヤ接続領域との間、前記半導体発光素子載置領域間、の少なくとも1つの領域に溝部を有し、
前記溝部は、前記リード端子の凹部底面における露出部端から離間するよう設けられることを特徴とする発光装置。 - 前記溝部は、その周囲に前記リード端子の基準平面よりも高い領域を有する請求項1又は2に記載の発光装置。
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US10008651B2 (en) | 2015-09-24 | 2018-06-26 | Nichia Corporation | Light emitting device and wiring board thereof |
JP2017063112A (ja) * | 2015-09-24 | 2017-03-30 | 日亜化学工業株式会社 | 発光装置 |
JP2017135420A (ja) * | 2017-04-26 | 2017-08-03 | ローム株式会社 | Ledモジュール |
JP2019083350A (ja) * | 2019-03-04 | 2019-05-30 | ローム株式会社 | Ledモジュール |
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