JPH0292927U - - Google Patents
Info
- Publication number
- JPH0292927U JPH0292927U JP185789U JP185789U JPH0292927U JP H0292927 U JPH0292927 U JP H0292927U JP 185789 U JP185789 U JP 185789U JP 185789 U JP185789 U JP 185789U JP H0292927 U JPH0292927 U JP H0292927U
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- conductive foil
- bare chip
- mounting
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 2
- 230000002265 prevention Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
Description
第１図は本考案のマイクロ波集積回路のベアチ
ツプ付近の要部拡大図である。第２図は従来のマ
イクロ波集積回路のベアチツプ付近の要部拡大図
である。 ２……部品装着用導電箔、３……第１の接続用
導電箔、４……第２の接続用導電箔、５……ベア
チツプ、６，７，８，９，１２，１３……導電性
リード線、１０，１１……リード線接続部分、１
４……導電性接着剤、１５……拡散防止用スリツ
ト部、Ｇ１，Ｇ２……ゲート電極、Ｄ１，Ｄ２…
…ドレイン電極、Ｓ１，Ｓ２……ソース電極。
ツプ付近の要部拡大図である。第２図は従来のマ
イクロ波集積回路のベアチツプ付近の要部拡大図
である。 ２……部品装着用導電箔、３……第１の接続用
導電箔、４……第２の接続用導電箔、５……ベア
チツプ、６，７，８，９，１２，１３……導電性
リード線、１０，１１……リード線接続部分、１
４……導電性接着剤、１５……拡散防止用スリツ
ト部、Ｇ１，Ｇ２……ゲート電極、Ｄ１，Ｄ２…
…ドレイン電極、Ｓ１，Ｓ２……ソース電極。
Claims (1)
- ＦＥＴ等のベアチツプが導電性接着剤で装着さ
れる部品装着用導電箔と、この部品装着用導電箔
と所定の間隔を設けて形成される複数個の接続用
導電箔と、前記ベアチツプの各電極と前記部品装
着用導電箔および前記接続用導電箔とを接続する
導電性リード線と、この導電性リード線にて互い
に前記ベアチツプの前記電極部分と前記部品装着
用導電箔上の接続部分とが接続される際、その両
接続部分の間隔内において、ベアチツプの外周縁
に沿つて前記部品装着用導電箔に設けられる前記
接着剤の拡散防止用スリツト部とを備えるマイク
ロ波集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP185789U JPH0292927U (ja) | 1989-01-11 | 1989-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP185789U JPH0292927U (ja) | 1989-01-11 | 1989-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292927U true JPH0292927U (ja) | 1990-07-24 |
Family
ID=31202112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP185789U Pending JPH0292927U (ja) | 1989-01-11 | 1989-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292927U (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| JP2002314138A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| JP2007329502A (ja) * | 2007-08-16 | 2007-12-20 | Toshiba Corp | 発光装置 |
| JP2008112966A (ja) * | 2006-10-05 | 2008-05-15 | Nichia Chem Ind Ltd | 発光装置 |
| JP2009065199A (ja) * | 2008-11-17 | 2009-03-26 | Toshiba Corp | 発光装置 |
-
1989
- 1989-01-11 JP JP185789U patent/JPH0292927U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| JP2002314138A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| JP2008112966A (ja) * | 2006-10-05 | 2008-05-15 | Nichia Chem Ind Ltd | 発光装置 |
| JP2007329502A (ja) * | 2007-08-16 | 2007-12-20 | Toshiba Corp | 発光装置 |
| JP2009065199A (ja) * | 2008-11-17 | 2009-03-26 | Toshiba Corp | 発光装置 |