JP2008103548A5 - - Google Patents

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Publication number
JP2008103548A5
JP2008103548A5 JP2006285140A JP2006285140A JP2008103548A5 JP 2008103548 A5 JP2008103548 A5 JP 2008103548A5 JP 2006285140 A JP2006285140 A JP 2006285140A JP 2006285140 A JP2006285140 A JP 2006285140A JP 2008103548 A5 JP2008103548 A5 JP 2008103548A5
Authority
JP
Japan
Prior art keywords
conductive layer
conductive paste
via hole
wiring board
blind via
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006285140A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008103548A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006285140A priority Critical patent/JP2008103548A/ja
Priority claimed from JP2006285140A external-priority patent/JP2008103548A/ja
Priority to CNA2007800389997A priority patent/CN101530014A/zh
Priority to PCT/JP2007/069976 priority patent/WO2008047718A1/ja
Priority to KR1020097006805A priority patent/KR20090068227A/ko
Priority to TW096138824A priority patent/TWI406619B/zh
Publication of JP2008103548A publication Critical patent/JP2008103548A/ja
Publication of JP2008103548A5 publication Critical patent/JP2008103548A5/ja
Pending legal-status Critical Current

Links

JP2006285140A 2006-10-19 2006-10-19 多層プリント配線板及びその製造方法 Pending JP2008103548A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006285140A JP2008103548A (ja) 2006-10-19 2006-10-19 多層プリント配線板及びその製造方法
CNA2007800389997A CN101530014A (zh) 2006-10-19 2007-10-12 多层印刷线路板及其制造方法
PCT/JP2007/069976 WO2008047718A1 (fr) 2006-10-19 2007-10-12 Tableau de connexions imprimées multicouche et procédé de fabrication de celui-ci
KR1020097006805A KR20090068227A (ko) 2006-10-19 2007-10-12 다층 프린트 배선판 및 그 제조 방법
TW096138824A TWI406619B (zh) 2006-10-19 2007-10-17 多層印刷配線板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006285140A JP2008103548A (ja) 2006-10-19 2006-10-19 多層プリント配線板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011031759A Division JP5429646B2 (ja) 2011-02-17 2011-02-17 両面プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JP2008103548A JP2008103548A (ja) 2008-05-01
JP2008103548A5 true JP2008103548A5 (enrdf_load_stackoverflow) 2010-09-02

Family

ID=39313949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006285140A Pending JP2008103548A (ja) 2006-10-19 2006-10-19 多層プリント配線板及びその製造方法

Country Status (5)

Country Link
JP (1) JP2008103548A (enrdf_load_stackoverflow)
KR (1) KR20090068227A (enrdf_load_stackoverflow)
CN (1) CN101530014A (enrdf_load_stackoverflow)
TW (1) TWI406619B (enrdf_load_stackoverflow)
WO (1) WO2008047718A1 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4763813B2 (ja) * 2009-03-03 2011-08-31 住友電気工業株式会社 多層プリント配線板およびその製造方法
WO2012011165A1 (ja) * 2010-07-20 2012-01-26 住友電気工業株式会社 多層プリント配線板およびその製造方法
KR101895416B1 (ko) 2011-12-23 2018-09-06 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
JP5793113B2 (ja) * 2012-06-08 2015-10-14 住友電気工業株式会社 フレキシブルプリント配線板
CN103002673B (zh) * 2012-12-21 2015-11-04 景旺电子科技(龙川)有限公司 一种铝基和线路层导通板的制作方法
CN105307405A (zh) * 2014-05-29 2016-02-03 景硕科技股份有限公司 利用聚亚酰胺蚀刻的线路板制作方法
US10237983B2 (en) 2014-12-23 2019-03-19 Sanmina Corporation Method for forming hole plug
WO2016106428A1 (en) 2014-12-23 2016-06-30 Sanmina Corporation Hole plug for thin laminate
JP6416093B2 (ja) * 2015-02-16 2018-10-31 日本メクトロン株式会社 フレキシブルプリント配線板の製造方法
CN109803490A (zh) * 2019-03-13 2019-05-24 盐城维信电子有限公司 一种导电银浆连接上下层的双面柔性线路板及其制备方法
JP7004921B2 (ja) * 2019-04-26 2022-01-21 日亜化学工業株式会社 発光モジュールの製造方法及び発光モジュール
CN114980521A (zh) * 2022-06-06 2022-08-30 北京梦之墨科技有限公司 一种电子结构及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199782A (ja) * 1990-11-29 1992-07-20 Sharp Corp フレキシブル基板のスルーホール作成方法
JP2001024323A (ja) * 1999-07-12 2001-01-26 Ibiden Co Ltd 導電性ペーストの充填方法および多層プリント配線板用の片面回路基板の製造方法
JP3892209B2 (ja) * 2000-06-22 2007-03-14 大日本印刷株式会社 プリント配線板およびその製造方法
WO2003009660A1 (fr) * 2001-07-18 2003-01-30 Matsushita Electric Industrial Co., Ltd. Procede et materiau de fabrication d'un substrat forme de circuits
JP2003031917A (ja) * 2001-07-19 2003-01-31 Fujikura Ltd 回路基板の有底穴への導電性ペースト埋込構造
JP4468081B2 (ja) * 2004-06-10 2010-05-26 三菱樹脂株式会社 多層配線基板用導電性ペースト組成物
JP2006287019A (ja) * 2005-04-01 2006-10-19 Hitachi Metals Ltd 貫通電極付基板およびその製造方法

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