JP2008073633A5 - - Google Patents

Download PDF

Info

Publication number
JP2008073633A5
JP2008073633A5 JP2006257124A JP2006257124A JP2008073633A5 JP 2008073633 A5 JP2008073633 A5 JP 2008073633A5 JP 2006257124 A JP2006257124 A JP 2006257124A JP 2006257124 A JP2006257124 A JP 2006257124A JP 2008073633 A5 JP2008073633 A5 JP 2008073633A5
Authority
JP
Japan
Prior art keywords
plate
treatment agent
forming member
film forming
pressing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006257124A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008073633A (ja
JP4867548B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006257124A priority Critical patent/JP4867548B2/ja
Priority claimed from JP2006257124A external-priority patent/JP4867548B2/ja
Priority to CN200710161811.XA priority patent/CN101164705B/zh
Publication of JP2008073633A publication Critical patent/JP2008073633A/ja
Publication of JP2008073633A5 publication Critical patent/JP2008073633A5/ja
Application granted granted Critical
Publication of JP4867548B2 publication Critical patent/JP4867548B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006257124A 2006-09-22 2006-09-22 塗布装置、実装装置及び電子部品の製造方法 Active JP4867548B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006257124A JP4867548B2 (ja) 2006-09-22 2006-09-22 塗布装置、実装装置及び電子部品の製造方法
CN200710161811.XA CN101164705B (zh) 2006-09-22 2007-09-24 涂敷装置、安装装置、涂敷方法、电子零件的制造方法及电子零件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006257124A JP4867548B2 (ja) 2006-09-22 2006-09-22 塗布装置、実装装置及び電子部品の製造方法

Publications (3)

Publication Number Publication Date
JP2008073633A JP2008073633A (ja) 2008-04-03
JP2008073633A5 true JP2008073633A5 (ru) 2009-11-05
JP4867548B2 JP4867548B2 (ja) 2012-02-01

Family

ID=39333638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006257124A Active JP4867548B2 (ja) 2006-09-22 2006-09-22 塗布装置、実装装置及び電子部品の製造方法

Country Status (2)

Country Link
JP (1) JP4867548B2 (ru)
CN (1) CN101164705B (ru)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5082358B2 (ja) * 2006-09-22 2012-11-28 ソニー株式会社 塗布装置、実装装置及び電子部品の製造方法
KR101352574B1 (ko) * 2008-08-18 2014-01-17 삼성테크윈 주식회사 감지부재를 갖는 플럭스 디핑장치
KR101352573B1 (ko) * 2008-08-18 2014-01-17 삼성테크윈 주식회사 플럭스 디핑장치
CN102698938B (zh) * 2012-06-07 2015-03-11 珠海格力电器股份有限公司 稳压块涂覆散热膏用盛放设备
CN102784745B (zh) * 2012-08-06 2015-08-19 昆山微容电子企业有限公司 自动涂装机的溢粉回收系统
JP5785576B2 (ja) * 2013-03-11 2015-09-30 株式会社東芝 ペースト供給ユニット
JP5360323B1 (ja) * 2013-04-26 2013-12-04 富士ゼロックス株式会社 粘性剤厚調整装置、搭載装置、基板装置の製造方法
JP6171613B2 (ja) * 2013-06-21 2017-08-02 日亜化学工業株式会社 発光装置の製造方法及び発光装置
JP6322807B2 (ja) * 2013-12-12 2018-05-16 パナソニックＩｐマネジメント株式会社 ペースト転写装置及び電子部品実装機
JP6375628B2 (ja) * 2014-01-27 2018-08-22 三菱電機株式会社 樹脂供給装置
CN105674115B (zh) * 2014-09-28 2019-06-07 嘉兴山蒲照明电器有限公司 Led直管灯
CN108475644A (zh) * 2016-02-03 2018-08-31 富士胶片株式会社 有机半导体膜的制造方法
EP3520906A4 (en) * 2016-09-27 2019-08-28 FUJIFILM Corporation METHOD FOR PRODUCING A FILM
JP7343982B2 (ja) * 2019-01-29 2023-09-13 株式会社Fuji 成膜装置
KR102225058B1 (ko) * 2020-11-27 2021-03-09 주식회사 에스에프이 솔더볼 플럭스 도포 장치
KR102302956B1 (ko) 2021-06-01 2021-09-16 주식회사 에스에프이 플럭스 도포 장치
DE112021007973T5 (de) * 2021-07-15 2024-04-25 Fuji Corporation Vorrichtung zur Zuführung eines viskosen Fluids
CN115213057B (zh) * 2022-07-25 2023-12-22 加百裕(南通)电子有限公司 一种电子元器件高效涂胶装置
CN116967559B (zh) * 2023-09-21 2023-12-08 微网优联科技(成都)有限公司 一种在摄像头用pcb板上快速精密焊接接线头的装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031376A (ja) * 1983-07-29 1985-02-18 Sony Corp 映像信号再生装置
SE447545B (sv) * 1985-06-12 1986-11-24 Inventing Ab Sett och anordning vid bladbestrykning av en lopande materialbana
JPS63164222A (ja) * 1986-12-25 1988-07-07 Hitachi Electronics Eng Co Ltd Ｃｖｄ装置用ガスヘツド
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
JPH0819752A (ja) * 1994-07-08 1996-01-23 Matsushita Electric Ind Co Ltd 薄膜形成装置
JPH10209208A (ja) * 1997-01-23 1998-08-07 Hitachi Ltd 半導体製造方法および装置
JP2001345543A (ja) * 2000-05-31 2001-12-14 Sanyo Electric Co Ltd フラックス転写装置
JP4263347B2 (ja) * 2000-11-02 2009-05-13 パナソニック株式会社 電子部品実装装置におけるペースト供給装置

Similar Documents

Publication Publication Date Title
JP2008073633A5 (ru)
FR2933155B1 (fr) Ensemble de connexion et procede de connexion d'un tel ensemble
US8978577B2 (en) Waxing device
JP2009522448A5 (ru)
JP2013001117A5 (ru)
EP2600210A3 (en) Image heating apparatus
JP2011123181A5 (ru)
JP2007268654A5 (ru)
TW200730663A (en) Reeling type plasma CVD device
JP2009014517A5 (ru)
JP2009532114A5 (ru)
JP2009286562A5 (ru)
RU2008120297A (ru) Устройство для щелевого нанесения покрытий
JP2010042531A5 (ru)
JP2010176129A5 (ru)
JP2006224255A5 (ru)
RU2010100435A (ru) Устройство для обработки заготовок из пластмасс
JP2008261908A5 (ru)
JP2011148134A5 (ru)
DE502007001637D1 (de) Prägefolieneinrichtung
JP2007327960A5 (ru)
JP2011237468A5 (ru)
ATE439983T1 (de) Verarbeitungsvorrichtung
JP2008198667A5 (ru)
JP2013008068A5 (ru)