JP2008047765A - ラミネート装置 - Google Patents
ラミネート装置 Download PDFInfo
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- JP2008047765A JP2008047765A JP2006223307A JP2006223307A JP2008047765A JP 2008047765 A JP2008047765 A JP 2008047765A JP 2006223307 A JP2006223307 A JP 2006223307A JP 2006223307 A JP2006223307 A JP 2006223307A JP 2008047765 A JP2008047765 A JP 2008047765A
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- Prior art keywords
- heater
- heater panel
- solar cell
- cell module
- laminating apparatus
- Prior art date
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- Pending
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- 238000010030 laminating Methods 0.000 title claims abstract description 90
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 239000000945 filler Substances 0.000 description 9
- 238000003475 lamination Methods 0.000 description 7
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229920006266 Vinyl film Polymers 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10816—Making laminated safety glass or glazing; Apparatus therefor by pressing
- B32B17/10871—Making laminated safety glass or glazing; Apparatus therefor by pressing in combination with particular heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Pens And Brushes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
【解決手段】被ラミネート体を加熱及び挟圧するラミネート装置1が、内圧調整が可能な第1の空間と、前記第1の空間とダイアフラムで仕切られ、内圧調整が可能な第2の空間15と、前記第2の空間の内部に設けたヒータ盤35と、前記ヒータ盤35の内部に設けられた1又は2以上の長孔40と、前記長孔40の内部に挿入された1又は2以上の長手形状のヒータ41と、を有するように構成する。前記長孔40を密閉し、前記1又は2の長手形状のヒータ41の長手方向Xの長さの総和が前記長孔40の長手方向Xの長さよりも短くなるように設定する。
【選択図】図5
Description
2 ラミネート部
3 ラミネートユニット
5 搬送シート
6 供給コンベア
7 搬出コンベア
10 上ケース
12 下ケース
13 上チャンバ
15 下チャンバ
16 基台
17 支柱
21 ブラケット
22 シリンダ
23 ピストンロッド
30 ダイアフラム
30a、30b ダイアフラムの位置
31、37 吸排気口
35 ヒート盤
36 金属板
40、40A〜40C 長孔
41、41A〜41C ヒータ
42 補助用ヒータ
43 ヒートパイプ
45 ヒータの加熱部
46 ヒータのフランジ部
50 金属管
51 コア
52 絶縁粉末
55 金属円板
60 リード線の一端
61 リード線の他端
62 固定具
65 環状溝
66 Oリング
70 搬送シート移動機構
72、73 回転ロール
75、76 ガイドロール
80 カバーガラス
81 保護材
82、83 充填材
84 ストリング
85、86 電極
87 太陽電池セル
88 リード線
100 温度センサ
L リード線
M 太陽電池モジュール
P コアの根元部分
Q コアの先端部分
X ヒータ盤の長手方向(長孔の長手方向)
Y ヒータ盤の幅方向
Claims (9)
- 被ラミネート体を加熱及び挟圧するラミネート装置であって、
内圧調整が可能な第1の空間と、
前記第1の空間と膨張自在なダイアフラムで仕切られた、内圧調整が可能な第2の空間と、
前記第2の空間の内部に設けられたヒータ盤と、
前記ヒータ盤の内部に設けられた1又は2以上の長孔と、
前記長孔の内部に挿入された1又は2以上の長手形状のヒータと、を有し、
前記長孔は密閉されていることを特徴とする、ラミネート装置。 - 前記1又は2以上の長手形状のヒータの長手方向の長さの総和が、前記長孔の長手方向の長さよりも短く設定されていることを特徴とする、請求項1に記載のラミネート装置。
- 前記被ラミネート体が太陽電池モジュールであることを特徴とする、請求項1又は2に記載のラミネート装置。
- 前記長手形状のヒータは、カートリッジヒータであることを特徴とする、請求項1〜3のいずれかに記載のラミネート装置。
- 前記長孔は、前記ヒータ盤を貫通する長孔を含むことを特徴とする、請求項1〜4のいずれかに記載のラミネート装置。
- 前記貫通する長孔の両端から前記長手形状のヒータが挿入され、これらのヒータの先端同士の間に空間ができるように配置されていることを特徴とする、請求項5に記載のラミネート装置。
- 前記長孔は、長手方向の一端部が開放され且つ他端部が閉じた長孔を含むことを特徴とする、請求項1〜6のいずれかに記載のラミネート装置。
- 前記ヒータ盤の下面において前記1又は2以上の長孔の長手方向の両端部の位置に補助用のヒータを各々設けることを特徴とする、請求項1〜7のいずれかに記載のラミネート装置。
- 前記ヒータ盤の下面において前記1又は2以上の長孔の長手方向に沿って1又は2以上のヒートパイプを設けることを特徴とする、請求項1〜8のいずれかに記載のラミネート装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006223307A JP2008047765A (ja) | 2006-08-18 | 2006-08-18 | ラミネート装置 |
TW096129843A TWI430455B (zh) | 2006-08-18 | 2007-08-13 | 積層裝置 |
KR1020070081773A KR101125675B1 (ko) | 2006-08-18 | 2007-08-14 | 라미네이트 장치 |
US11/889,489 US20080041531A1 (en) | 2006-08-18 | 2007-08-14 | Laminating apparatus |
EP07016285A EP1890339B1 (en) | 2006-08-18 | 2007-08-20 | Laminating apparatus |
ES07016285T ES2343440T3 (es) | 2006-08-18 | 2007-08-20 | Aparato de laminacion. |
DE602007006114T DE602007006114D1 (de) | 2006-08-18 | 2007-08-20 | Laminiervorrichtung |
AT07016285T ATE466380T1 (de) | 2006-08-18 | 2007-08-20 | Laminiervorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006223307A JP2008047765A (ja) | 2006-08-18 | 2006-08-18 | ラミネート装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008047765A true JP2008047765A (ja) | 2008-02-28 |
Family
ID=38730999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006223307A Pending JP2008047765A (ja) | 2006-08-18 | 2006-08-18 | ラミネート装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20080041531A1 (ja) |
EP (1) | EP1890339B1 (ja) |
JP (1) | JP2008047765A (ja) |
KR (1) | KR101125675B1 (ja) |
AT (1) | ATE466380T1 (ja) |
DE (1) | DE602007006114D1 (ja) |
ES (1) | ES2343440T3 (ja) |
TW (1) | TWI430455B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140705A1 (ja) * | 2009-06-05 | 2010-12-09 | 日清紡メカトロニクス株式会社 | ラミネート装置 |
WO2011136132A1 (ja) * | 2010-04-30 | 2011-11-03 | 日清紡メカトロニクス株式会社 | ラミネート装置用熱板およびその熱板を用いたラミネート装置 |
JP2012080120A (ja) * | 2009-09-10 | 2012-04-19 | Kitagawa Elaborate Mach Co Ltd | ラミネートプレス装置、キャリアプレート、ラミネート加工システム及びラミネート方法 |
WO2013046979A1 (ja) * | 2011-09-29 | 2013-04-04 | 日清紡メカトロニクス株式会社 | ラミネート方法及びラミネート装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101109550B1 (ko) * | 2009-08-19 | 2012-02-06 | (주)리드 | 태양 전지 모듈 제조를 위한 라미네이트 챔버 |
KR100981794B1 (ko) * | 2009-10-29 | 2010-09-10 | 주식회사 톱텍 | 태양열 전지판용 라미네이팅 장치 |
KR20150066513A (ko) * | 2012-10-12 | 2015-06-16 | 신토고교 가부시키가이샤 | 감압 지그 및 감압 지그를 이용한 피가압물의 가압 방법 |
KR101385533B1 (ko) * | 2013-09-13 | 2014-04-30 | 주식회사 제우스 | 라미네이트 장치 |
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JPH0592991U (ja) * | 1991-09-18 | 1993-12-17 | 株式会社八光電機製作所 | カートリッジヒータ群 |
JPH11204811A (ja) * | 1998-01-07 | 1999-07-30 | Npc:Kk | ラミネート装置 |
JP2001183063A (ja) * | 1999-12-24 | 2001-07-06 | Aisin Seiki Co Ltd | ホットプレート装置 |
JP2005152913A (ja) * | 2003-11-21 | 2005-06-16 | Meiki Co Ltd | ホットプレスおよびホットプレスの熱板の加熱冷却方法 |
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2006
- 2006-08-18 JP JP2006223307A patent/JP2008047765A/ja active Pending
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2007
- 2007-08-13 TW TW096129843A patent/TWI430455B/zh active
- 2007-08-14 US US11/889,489 patent/US20080041531A1/en not_active Abandoned
- 2007-08-14 KR KR1020070081773A patent/KR101125675B1/ko active IP Right Grant
- 2007-08-20 ES ES07016285T patent/ES2343440T3/es active Active
- 2007-08-20 DE DE602007006114T patent/DE602007006114D1/de active Active
- 2007-08-20 EP EP07016285A patent/EP1890339B1/en active Active
- 2007-08-20 AT AT07016285T patent/ATE466380T1/de not_active IP Right Cessation
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140705A1 (ja) * | 2009-06-05 | 2010-12-09 | 日清紡メカトロニクス株式会社 | ラミネート装置 |
JP2012080120A (ja) * | 2009-09-10 | 2012-04-19 | Kitagawa Elaborate Mach Co Ltd | ラミネートプレス装置、キャリアプレート、ラミネート加工システム及びラミネート方法 |
DE112010003621T5 (de) | 2009-09-10 | 2012-08-23 | Kitagawa Seiki K.K. | Laminatpressvorrichtung, aushärtungsprozessvorrichtung, trägerplatte,laminiersystem und laminierverfahren |
DE112010005538T5 (de) | 2009-09-10 | 2013-03-14 | Kitagawa Seiki K.K. | Laminatpressvorrichtung, Aushärtungsvorrichtung, Trägerplatte, Laminiersystem und Laminierverfahren |
US8540000B2 (en) | 2009-09-10 | 2013-09-24 | Kitagawa Seiki Kabushiki Kaisha | Curing processing device and laminating system |
WO2011136132A1 (ja) * | 2010-04-30 | 2011-11-03 | 日清紡メカトロニクス株式会社 | ラミネート装置用熱板およびその熱板を用いたラミネート装置 |
WO2013046979A1 (ja) * | 2011-09-29 | 2013-04-04 | 日清紡メカトロニクス株式会社 | ラミネート方法及びラミネート装置 |
JP2013071387A (ja) * | 2011-09-29 | 2013-04-22 | Nisshinbo Mechatronics Inc | ラミネート方法及びラミネート装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200826306A (en) | 2008-06-16 |
EP1890339A1 (en) | 2008-02-20 |
KR101125675B1 (ko) | 2012-03-27 |
KR20080016474A (ko) | 2008-02-21 |
TWI430455B (zh) | 2014-03-11 |
ES2343440T3 (es) | 2010-07-30 |
EP1890339B1 (en) | 2010-04-28 |
DE602007006114D1 (de) | 2010-06-10 |
ATE466380T1 (de) | 2010-05-15 |
US20080041531A1 (en) | 2008-02-21 |
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