JP2007532798A - アラミド紙ブレンド - Google Patents
アラミド紙ブレンド Download PDFInfo
- Publication number
- JP2007532798A JP2007532798A JP2007508603A JP2007508603A JP2007532798A JP 2007532798 A JP2007532798 A JP 2007532798A JP 2007508603 A JP2007508603 A JP 2007508603A JP 2007508603 A JP2007508603 A JP 2007508603A JP 2007532798 A JP2007532798 A JP 2007532798A
- Authority
- JP
- Japan
- Prior art keywords
- paper
- aramid
- floc
- pulp
- aramid paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003235 aromatic polyamide Polymers 0.000 title claims abstract description 132
- 239000004760 aramid Substances 0.000 title claims abstract description 113
- 239000000203 mixture Substances 0.000 title claims description 34
- 239000002131 composite material Substances 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 38
- 229920005596 polymer binder Polymers 0.000 claims abstract description 13
- 239000002491 polymer binding agent Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000002002 slurry Substances 0.000 claims description 10
- 244000144992 flock Species 0.000 claims description 7
- 238000003490 calendering Methods 0.000 claims description 4
- 238000000280 densification Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 229920000889 poly(m-phenylene isophthalamide) Polymers 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 3
- 239000012777 electrically insulating material Substances 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 claims 1
- 239000006185 dispersion Substances 0.000 description 24
- 229920000784 Nomex Polymers 0.000 description 10
- 239000000835 fiber Substances 0.000 description 10
- 239000004763 nomex Substances 0.000 description 10
- 229920000271 Kevlar® Polymers 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 241000264877 Hippospongia communis Species 0.000 description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 description 6
- 229920006231 aramid fiber Polymers 0.000 description 5
- 239000004761 kevlar Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 239000011343 solid material Substances 0.000 description 5
- 239000011162 core material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 3
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- -1 polycaproamide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920001131 Pulp (paper) Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920003261 Durez Polymers 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 241000243142 Porifera Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H13/26—Polyamides; Polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/005—Mechanical treatment
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/04—Physical treatment, e.g. heating, irradiating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/826,530 US20050230072A1 (en) | 2004-04-16 | 2004-04-16 | Aramid paper blend |
| PCT/US2005/012996 WO2005103376A1 (en) | 2004-04-16 | 2005-04-15 | Aramid paper blend |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011161010A Division JP5686688B2 (ja) | 2004-04-16 | 2011-07-22 | アラミド紙ブレンド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007532798A true JP2007532798A (ja) | 2007-11-15 |
| JP2007532798A5 JP2007532798A5 (enExample) | 2008-02-21 |
Family
ID=34967398
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007508603A Pending JP2007532798A (ja) | 2004-04-16 | 2005-04-15 | アラミド紙ブレンド |
| JP2011161010A Expired - Lifetime JP5686688B2 (ja) | 2004-04-16 | 2011-07-22 | アラミド紙ブレンド |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011161010A Expired - Lifetime JP5686688B2 (ja) | 2004-04-16 | 2011-07-22 | アラミド紙ブレンド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20050230072A1 (enExample) |
| EP (1) | EP1756360B1 (enExample) |
| JP (2) | JP2007532798A (enExample) |
| CN (1) | CN1942629B (enExample) |
| BR (1) | BRPI0509409B8 (enExample) |
| CA (1) | CA2561329C (enExample) |
| WO (1) | WO2005103376A1 (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008503662A (ja) * | 2004-06-25 | 2008-02-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | メタ−およびパラ−アラミドパルプならびにその製造方法 |
| JP2011505277A (ja) * | 2007-11-30 | 2011-02-24 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 高機械的強度を有するハニカムおよびそれから作製された物品 |
| JP2011508106A (ja) * | 2007-12-21 | 2011-03-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ジアミノジフェニルスルホンから誘導されたフロックを含有する紙 |
| JP2011513096A (ja) * | 2008-02-26 | 2011-04-28 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 高剪断強度を有するコア及びそれから作製された物品 |
| KR101515307B1 (ko) * | 2013-12-30 | 2015-04-24 | 도레이케미칼 주식회사 | 고평량 메타 아라미드 페이퍼 및 그 제조방법 |
| KR101524788B1 (ko) * | 2013-12-30 | 2015-06-01 | 도레이케미칼 주식회사 | 저평량 메타 아라미드 페이퍼 및 그 제조방법 |
| JP2015518437A (ja) * | 2012-04-18 | 2015-07-02 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 多層シート |
| JP2015520685A (ja) * | 2012-04-18 | 2015-07-23 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 多層シート |
| KR20160141882A (ko) * | 2015-05-28 | 2016-12-12 | 코오롱인더스트리 주식회사 | 적층 아라미드 종이 및 그 제조방법 |
| WO2016190694A3 (ko) * | 2015-05-28 | 2017-01-19 | 코오롱인더스트리 주식회사 | 아라미드 페이퍼, 그의 제조방법 및 용도 |
| JP2017534486A (ja) * | 2014-10-03 | 2017-11-24 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 高圧縮強度を有するハニカムコア |
| KR20180022751A (ko) * | 2018-02-22 | 2018-03-06 | 코오롱인더스트리 주식회사 | 전기 절연지용 전방향족 아라미드 종이 및 그의 제조방법 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006040942A1 (ja) * | 2004-10-08 | 2006-04-20 | Matsushita Electric Industrial Co., Ltd. | 多層回路基板の製造方法 |
| EP1963570A2 (en) * | 2005-12-21 | 2008-09-03 | E.I. Du Pont De Nemours And Company | Paper comprising pipd pulp and a process for making same |
| WO2007076364A2 (en) * | 2005-12-21 | 2007-07-05 | E.I. Du Pont De Nemours And Company | Pipd paper and components made therefrom |
| EP1969181A2 (en) * | 2005-12-21 | 2008-09-17 | E.I. Du Pont De Nemours And Company | Paper comprising pipd floc and process for making the same |
| US7740741B2 (en) | 2005-12-21 | 2010-06-22 | E.I. Du Pont De Nemours And Company | Para-aramid pulp including meta-aramid fibrids and processes of making same |
| US7771811B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from controlled porosity paper |
| US7815993B2 (en) * | 2006-12-15 | 2010-10-19 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having flame retardant thermoplastic binder |
| US8025949B2 (en) * | 2006-12-15 | 2011-09-27 | E.I. Du Pont De Nemours And Company | Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom |
| US20080145602A1 (en) * | 2006-12-15 | 2008-06-19 | Gary Lee Hendren | Processes for making shaped honeycomb and honeycombs made thereby |
| US7771810B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having a high melt point thermoplastic fiber |
| US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| JP5886320B2 (ja) | 2011-01-04 | 2016-03-16 | テイジン・アラミド・ビー.ブイ. | 電気絶縁紙 |
| CN102174770A (zh) * | 2011-01-27 | 2011-09-07 | 深圳昊天龙邦复合材料有限公司 | 包含芳族合成纤维纸的半固化片和由其制得的印刷电路板 |
| US9666848B2 (en) | 2011-05-20 | 2017-05-30 | Dreamweaver International, Inc. | Single-layer lithium ion battery separator |
| WO2013117462A1 (en) | 2012-02-07 | 2013-08-15 | Teijin Aramid B.V. | Aramid paper having increased strength and process for manufacturing thereof |
| WO2013158700A1 (en) * | 2012-04-18 | 2013-10-24 | E. I. Du Pont De Nemours And Company | Multilayered sheet |
| US8936878B2 (en) | 2012-11-20 | 2015-01-20 | Dreamweaver International, Inc. | Methods of making single-layer lithium ion battery separators having nanofiber and microfiber components |
| RU2656226C2 (ru) * | 2012-11-23 | 2018-06-04 | Тейджин Арамид Б.В. | Электроизоляционная бумага |
| JP6217894B2 (ja) * | 2013-02-08 | 2017-10-25 | デュポン帝人アドバンスドペーパー株式会社 | 着色アラミド紙及びその製造方法 |
| CN105579641B (zh) * | 2013-07-18 | 2018-12-18 | 帝人芳纶有限公司 | 阻燃片材 |
| KR101547776B1 (ko) | 2014-11-24 | 2015-09-07 | 한국섬유개발연구원 | 허니컴용 아라미드 습식부직포 및 그 제조방법 |
| JP6405583B2 (ja) * | 2014-12-26 | 2018-10-17 | 特種東海製紙株式会社 | 絶縁紙 |
| US10245804B2 (en) | 2015-10-16 | 2019-04-02 | Hexcel Corporation | Fire retarded aramid fiber-based honeycomb |
| US10767316B2 (en) * | 2017-11-01 | 2020-09-08 | Dupont Safety & Construction, Inc. | Paper comprising aramid pulp and a friction paper made therefrom |
| KR102629653B1 (ko) * | 2018-05-28 | 2024-01-29 | 데이진 아라미드 비.브이. | 개선된 성질들을 갖는 아라미드-기반 페이퍼 |
| US11078627B2 (en) | 2018-08-14 | 2021-08-03 | Dupont Safety & Construction, Inc. | High tensile strength paper suitable for use in electrochemical cells |
| JP7466565B2 (ja) * | 2019-04-05 | 2024-04-12 | アールストローム オーワイジェイ | 燃焼ガスろ過媒体 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1072752A (ja) * | 1996-05-15 | 1998-03-17 | Matsushita Electric Ind Co Ltd | プリント配線板用不織布基材とこれを用いたプリプレグ |
| JPH10212688A (ja) * | 1997-01-20 | 1998-08-11 | Shin Kobe Electric Mach Co Ltd | 積層板用基材の製造法及びその製造に用いる混抄不織布 |
| JPH1121784A (ja) * | 1997-07-02 | 1999-01-26 | Oji Paper Co Ltd | 積層板基材用原料の処理方法 |
| JP2000226789A (ja) * | 1999-02-08 | 2000-08-15 | Teijin Ltd | 芳香族ポリアミド繊維紙 |
| JP2004031277A (ja) * | 2002-06-28 | 2004-01-29 | Du Pont Teijin Advanced Paper Kk | コーティングセパレータ、その製造方法およびそれを用いた電気電子部品 |
| JP2005200545A (ja) * | 2004-01-15 | 2005-07-28 | Yokohama Rubber Co Ltd:The | ホース補強層間ゴム組成物およびこれを用いたホース |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL246230A (enExample) * | 1958-12-09 | |||
| US3756908A (en) * | 1971-02-26 | 1973-09-04 | Du Pont | Synthetic paper structures of aromatic polyamides |
| US4729921A (en) * | 1984-10-19 | 1988-03-08 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| US4698267A (en) * | 1985-09-17 | 1987-10-06 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| US5026456A (en) * | 1990-06-14 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Aramid papers containing aramid paper pulp |
| WO1995014815A1 (en) * | 1993-11-29 | 1995-06-01 | Akzo Nobel N.V. | Process for preparing para-aromatic polyamide paper |
| DE69408170T2 (de) * | 1993-12-21 | 1998-08-20 | Du Pont | Aramidpapier mit hoher widerstandsfaehigkeit und bedruckbarkeit und einer glatten schichtenfoermigen oberflaeche |
| JP3340549B2 (ja) * | 1994-03-01 | 2002-11-05 | 帝人株式会社 | 多孔性アラミド成形物の製造方法 |
| EP0739707B1 (en) * | 1995-04-28 | 2000-06-14 | Showa Aircraft Industry Co., Ltd. | Honeycomb core |
| JPH10131017A (ja) * | 1996-02-21 | 1998-05-19 | Shin Kobe Electric Mach Co Ltd | 積層板用基材及びその製造法ならびにプリプレグ及び積層板 |
| US5833807A (en) * | 1997-04-17 | 1998-11-10 | E. I. Du Pont De Nemours And Company | Aramid dispersions and aramid sheets of increased uniformity |
| JP3869559B2 (ja) * | 1998-09-28 | 2007-01-17 | 新神戸電機株式会社 | 電気絶縁用不織布ならびにプリプレグ及び積層板 |
| JP3631385B2 (ja) * | 1998-11-18 | 2005-03-23 | 王子製紙株式会社 | 積層板用基材およびその製造方法 |
| JP2000273788A (ja) * | 1999-01-21 | 2000-10-03 | Toray Ind Inc | パラ系芳香族ポリアミド繊維紙およびその製造方法 |
| CN1078645C (zh) * | 1999-01-22 | 2002-01-30 | 四川省对外经济贸易总公司 | 特种合成纤维纸及其生产方法 |
| US6120643A (en) * | 1999-10-27 | 2000-09-19 | E. I. Du Pont De Nemours And Company | Aramid and glass fiber absorbent papers |
| JP3321141B2 (ja) * | 2000-04-03 | 2002-09-03 | 昭和飛行機工業株式会社 | アラミドハニカムおよびその製造方法 |
| US6592963B1 (en) * | 2000-06-16 | 2003-07-15 | E. I. Du Pont De Nemours And Company | Honeycomb structure |
| US6303221B1 (en) * | 2000-12-07 | 2001-10-16 | E. I. Du Pont De Nemours And Company | Two-component pulp reinforcement |
| US20020142689A1 (en) * | 2001-01-23 | 2002-10-03 | Levit Mikhail R. | Non-woven sheet of aramid floc |
| US6436236B1 (en) * | 2001-03-05 | 2002-08-20 | E. I. Du Pont De Nemours & Company | Electrically-conductive para-aramid pulp |
| US7459044B2 (en) * | 2002-08-26 | 2008-12-02 | E. I. Du Pont De Nemours And Company | Sheet material especially useful for circuit boards |
| US20040071952A1 (en) * | 2002-10-01 | 2004-04-15 | Anderson David Wayne | Aramid paper laminate |
| US20050284595A1 (en) * | 2004-06-25 | 2005-12-29 | Conley Jill A | Cellulosic and para-aramid pulp and processes of making same |
| US20060266486A1 (en) * | 2005-05-26 | 2006-11-30 | Levit Mikhail R | Electroconductive aramid paper |
-
2004
- 2004-04-16 US US10/826,530 patent/US20050230072A1/en not_active Abandoned
-
2005
- 2005-04-15 CN CN2005800111380A patent/CN1942629B/zh not_active Expired - Lifetime
- 2005-04-15 EP EP05739774A patent/EP1756360B1/en not_active Expired - Lifetime
- 2005-04-15 CA CA2561329A patent/CA2561329C/en not_active Expired - Lifetime
- 2005-04-15 BR BRPI0509409A patent/BRPI0509409B8/pt active IP Right Grant
- 2005-04-15 JP JP2007508603A patent/JP2007532798A/ja active Pending
- 2005-04-15 WO PCT/US2005/012996 patent/WO2005103376A1/en not_active Ceased
-
2011
- 2011-07-22 JP JP2011161010A patent/JP5686688B2/ja not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1072752A (ja) * | 1996-05-15 | 1998-03-17 | Matsushita Electric Ind Co Ltd | プリント配線板用不織布基材とこれを用いたプリプレグ |
| JPH10212688A (ja) * | 1997-01-20 | 1998-08-11 | Shin Kobe Electric Mach Co Ltd | 積層板用基材の製造法及びその製造に用いる混抄不織布 |
| JPH1121784A (ja) * | 1997-07-02 | 1999-01-26 | Oji Paper Co Ltd | 積層板基材用原料の処理方法 |
| JP2000226789A (ja) * | 1999-02-08 | 2000-08-15 | Teijin Ltd | 芳香族ポリアミド繊維紙 |
| JP2004031277A (ja) * | 2002-06-28 | 2004-01-29 | Du Pont Teijin Advanced Paper Kk | コーティングセパレータ、その製造方法およびそれを用いた電気電子部品 |
| JP2005200545A (ja) * | 2004-01-15 | 2005-07-28 | Yokohama Rubber Co Ltd:The | ホース補強層間ゴム組成物およびこれを用いたホース |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008503662A (ja) * | 2004-06-25 | 2008-02-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | メタ−およびパラ−アラミドパルプならびにその製造方法 |
| JP2011505277A (ja) * | 2007-11-30 | 2011-02-24 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 高機械的強度を有するハニカムおよびそれから作製された物品 |
| JP2011508106A (ja) * | 2007-12-21 | 2011-03-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ジアミノジフェニルスルホンから誘導されたフロックを含有する紙 |
| JP2011513096A (ja) * | 2008-02-26 | 2011-04-28 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 高剪断強度を有するコア及びそれから作製された物品 |
| JP2015518437A (ja) * | 2012-04-18 | 2015-07-02 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 多層シート |
| JP2015520685A (ja) * | 2012-04-18 | 2015-07-23 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 多層シート |
| KR101515307B1 (ko) * | 2013-12-30 | 2015-04-24 | 도레이케미칼 주식회사 | 고평량 메타 아라미드 페이퍼 및 그 제조방법 |
| KR101524788B1 (ko) * | 2013-12-30 | 2015-06-01 | 도레이케미칼 주식회사 | 저평량 메타 아라미드 페이퍼 및 그 제조방법 |
| JP2017534486A (ja) * | 2014-10-03 | 2017-11-24 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 高圧縮強度を有するハニカムコア |
| KR20160141882A (ko) * | 2015-05-28 | 2016-12-12 | 코오롱인더스트리 주식회사 | 적층 아라미드 종이 및 그 제조방법 |
| KR101700827B1 (ko) | 2015-05-28 | 2017-01-31 | 코오롱인더스트리 주식회사 | 적층 아라미드 종이 및 그 제조방법 |
| WO2016190694A3 (ko) * | 2015-05-28 | 2017-01-19 | 코오롱인더스트리 주식회사 | 아라미드 페이퍼, 그의 제조방법 및 용도 |
| JP2018515697A (ja) * | 2015-05-28 | 2018-06-14 | コーロン インダストリーズ インク | アラミド紙、その製造方法及び用途 |
| US10407829B2 (en) | 2015-05-28 | 2019-09-10 | Kolon Industries, Inc. | Aramid paper, manufacturing method therefor, and use thereof |
| KR20180022751A (ko) * | 2018-02-22 | 2018-03-06 | 코오롱인더스트리 주식회사 | 전기 절연지용 전방향족 아라미드 종이 및 그의 제조방법 |
| KR102201806B1 (ko) * | 2018-02-22 | 2021-01-11 | 코오롱인더스트리 주식회사 | 전기 절연지용 전방향족 아라미드 종이 및 그의 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2561329A1 (en) | 2005-11-03 |
| CN1942629A (zh) | 2007-04-04 |
| US20050230072A1 (en) | 2005-10-20 |
| EP1756360B1 (en) | 2012-08-15 |
| JP5686688B2 (ja) | 2015-03-18 |
| BRPI0509409B1 (pt) | 2015-12-22 |
| JP2011219913A (ja) | 2011-11-04 |
| CN1942629B (zh) | 2010-04-07 |
| BRPI0509409A (pt) | 2007-09-04 |
| BRPI0509409B8 (pt) | 2023-01-31 |
| EP1756360A1 (en) | 2007-02-28 |
| CA2561329C (en) | 2014-07-15 |
| WO2005103376A1 (en) | 2005-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5686688B2 (ja) | アラミド紙ブレンド | |
| US6042936A (en) | Microsphere containing circuit board paper | |
| JP2006509661A (ja) | 雲母シートおよびテープ | |
| US11686048B2 (en) | Aramid-based paper with improved properties | |
| CN101965425A (zh) | 具有高剪切强度的芯及由其制成的制品 | |
| KR20080024144A (ko) | 전기전도성 아라미드지 | |
| JP2012500864A (ja) | 高圧縮率を有する折り畳みコアおよびそれから製造された物品 | |
| JP5144767B2 (ja) | ジアミノジフェニルスルホンから誘導されたフロックを含有する紙 | |
| JP2012500735A (ja) | 高圧縮強度を有するハニカムコアおよびそれから製造される物品 | |
| US20110281080A1 (en) | Folded Core Based on Carbon Fiber Paper and Articles Made from Same | |
| US6120643A (en) | Aramid and glass fiber absorbent papers | |
| KR20040030845A (ko) | 저마찰 베어링 표면을 위한 부직포 재료 | |
| CN101341292B (zh) | Pipd纸及由其制造的组件 | |
| US20110244193A1 (en) | Folded Core Having a High Compression Modulus and Articles Made from the Same | |
| JPS6241400A (ja) | 含浸用シ−ト | |
| HK1105102A (en) | Aramid paper blend |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071221 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071221 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20080303 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20080917 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20080917 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20090221 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100518 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100524 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100823 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100830 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100915 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110322 |