CN1942629B - 芳纶纸掺合物 - Google Patents
芳纶纸掺合物 Download PDFInfo
- Publication number
- CN1942629B CN1942629B CN2005800111380A CN200580011138A CN1942629B CN 1942629 B CN1942629 B CN 1942629B CN 2005800111380 A CN2005800111380 A CN 2005800111380A CN 200580011138 A CN200580011138 A CN 200580011138A CN 1942629 B CN1942629 B CN 1942629B
- Authority
- CN
- China
- Prior art keywords
- paper
- aramid fiber
- aramid
- fiber paper
- floccule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H13/26—Polyamides; Polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/005—Mechanical treatment
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/04—Physical treatment, e.g. heating, irradiating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Paper (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/826,530 | 2004-04-16 | ||
| US10/826,530 US20050230072A1 (en) | 2004-04-16 | 2004-04-16 | Aramid paper blend |
| PCT/US2005/012996 WO2005103376A1 (en) | 2004-04-16 | 2005-04-15 | Aramid paper blend |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1942629A CN1942629A (zh) | 2007-04-04 |
| CN1942629B true CN1942629B (zh) | 2010-04-07 |
Family
ID=34967398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005800111380A Expired - Lifetime CN1942629B (zh) | 2004-04-16 | 2005-04-15 | 芳纶纸掺合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20050230072A1 (enExample) |
| EP (1) | EP1756360B1 (enExample) |
| JP (2) | JP2007532798A (enExample) |
| CN (1) | CN1942629B (enExample) |
| BR (1) | BRPI0509409B8 (enExample) |
| CA (1) | CA2561329C (enExample) |
| WO (1) | WO2005103376A1 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7455750B2 (en) * | 2004-06-25 | 2008-11-25 | E.I. Du Pont De Nemours And Company | Meta- and para-aramid pulp and processes of making same |
| KR100755795B1 (ko) * | 2004-10-08 | 2007-09-05 | 마쯔시다덴기산교 가부시키가이샤 | 다층 회로 기판의 제조 방법 |
| US8137506B2 (en) * | 2005-12-21 | 2012-03-20 | E. I. Du Pont De Nemours And Company | Paper comprising PIPD pulp and process for making same |
| JP2009521621A (ja) * | 2005-12-21 | 2009-06-04 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Pipdフロックを含んでなる紙およびその製造方法 |
| EP1963567B1 (en) * | 2005-12-21 | 2010-10-27 | E.I. Du Pont De Nemours And Company | Pipd paper and components made therefrom |
| US7740741B2 (en) * | 2005-12-21 | 2010-06-22 | E.I. Du Pont De Nemours And Company | Para-aramid pulp including meta-aramid fibrids and processes of making same |
| US8025949B2 (en) * | 2006-12-15 | 2011-09-27 | E.I. Du Pont De Nemours And Company | Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom |
| US7771810B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having a high melt point thermoplastic fiber |
| US7771811B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from controlled porosity paper |
| US7815993B2 (en) * | 2006-12-15 | 2010-10-19 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having flame retardant thermoplastic binder |
| US20080145602A1 (en) * | 2006-12-15 | 2008-06-19 | Gary Lee Hendren | Processes for making shaped honeycomb and honeycombs made thereby |
| US8268434B2 (en) * | 2007-11-30 | 2012-09-18 | E I Du Pont De Nemours And Company | Honeycomb having a high compression strength and articles made from same |
| US7803247B2 (en) * | 2007-12-21 | 2010-09-28 | E.I. Du Pont De Nemours And Company | Papers containing floc derived from diamino diphenyl sulfone |
| US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US20090214818A1 (en) * | 2008-02-26 | 2009-08-27 | E. I. Du Pont De Nemours And Company | Core having a high shear strength and articles made from same |
| EP2661457B1 (en) * | 2011-01-04 | 2018-03-28 | Teijin Aramid B.V. | Electrical insulating paper |
| CN102174770A (zh) * | 2011-01-27 | 2011-09-07 | 深圳昊天龙邦复合材料有限公司 | 包含芳族合成纤维纸的半固化片和由其制得的印刷电路板 |
| US9666848B2 (en) | 2011-05-20 | 2017-05-30 | Dreamweaver International, Inc. | Single-layer lithium ion battery separator |
| WO2013117462A1 (en) | 2012-02-07 | 2013-08-15 | Teijin Aramid B.V. | Aramid paper having increased strength and process for manufacturing thereof |
| CA2868327A1 (en) * | 2012-04-18 | 2013-10-24 | E. I. Du Pont De Nemours And Company | Multilayered sheet |
| EP2838722B1 (en) * | 2012-04-18 | 2020-12-02 | E. I. du Pont de Nemours and Company | Multilayered sheet |
| CA2868103A1 (en) * | 2012-04-18 | 2013-10-24 | E. I. Du Pont De Nemours And Company | Multilayered sheet |
| US8936878B2 (en) | 2012-11-20 | 2015-01-20 | Dreamweaver International, Inc. | Methods of making single-layer lithium ion battery separators having nanofiber and microfiber components |
| JP6194008B2 (ja) * | 2012-11-23 | 2017-09-06 | テイジン・アラミド・ビー.ブイ. | 電気絶縁紙 |
| JP6217894B2 (ja) * | 2013-02-08 | 2017-10-25 | デュポン帝人アドバンスドペーパー株式会社 | 着色アラミド紙及びその製造方法 |
| KR102303317B1 (ko) * | 2013-07-18 | 2021-09-24 | 데이진 아라미드 비.브이. | 난연성 시트 재료 |
| KR101524788B1 (ko) * | 2013-12-30 | 2015-06-01 | 도레이케미칼 주식회사 | 저평량 메타 아라미드 페이퍼 및 그 제조방법 |
| KR101515307B1 (ko) * | 2013-12-30 | 2015-04-24 | 도레이케미칼 주식회사 | 고평량 메타 아라미드 페이퍼 및 그 제조방법 |
| US9976258B2 (en) * | 2014-10-03 | 2018-05-22 | E I Du Pont De Nemours And Company | Honeycomb core having a high compression strength |
| KR101547776B1 (ko) | 2014-11-24 | 2015-09-07 | 한국섬유개발연구원 | 허니컴용 아라미드 습식부직포 및 그 제조방법 |
| JP6405583B2 (ja) * | 2014-12-26 | 2018-10-17 | 特種東海製紙株式会社 | 絶縁紙 |
| US10407829B2 (en) | 2015-05-28 | 2019-09-10 | Kolon Industries, Inc. | Aramid paper, manufacturing method therefor, and use thereof |
| KR101700827B1 (ko) * | 2015-05-28 | 2017-01-31 | 코오롱인더스트리 주식회사 | 적층 아라미드 종이 및 그 제조방법 |
| US10245804B2 (en) | 2015-10-16 | 2019-04-02 | Hexcel Corporation | Fire retarded aramid fiber-based honeycomb |
| US10767316B2 (en) * | 2017-11-01 | 2020-09-08 | Dupont Safety & Construction, Inc. | Paper comprising aramid pulp and a friction paper made therefrom |
| KR102201806B1 (ko) * | 2018-02-22 | 2021-01-11 | 코오롱인더스트리 주식회사 | 전기 절연지용 전방향족 아라미드 종이 및 그의 제조방법 |
| US11686048B2 (en) * | 2018-05-28 | 2023-06-27 | Teijin Aramid B.V. | Aramid-based paper with improved properties |
| US11078627B2 (en) | 2018-08-14 | 2021-08-03 | Dupont Safety & Construction, Inc. | High tensile strength paper suitable for use in electrochemical cells |
| CN113811377B (zh) * | 2019-04-05 | 2023-06-20 | 奥斯龙-明士克公司 | 烟气过滤介质 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4729921A (en) * | 1984-10-19 | 1988-03-08 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| CN1222604A (zh) * | 1999-01-22 | 1999-07-14 | 四川省对外经济贸易总公司 | 特种合成纤维纸及其生产方法 |
| EP1152084A2 (en) * | 2000-04-03 | 2001-11-07 | Showa Aircraft Industry Co., Ltd. | Aramid Honeycombs and a method for producing the same |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL246230A (enExample) * | 1958-12-09 | |||
| US3756908A (en) * | 1971-02-26 | 1973-09-04 | Du Pont | Synthetic paper structures of aromatic polyamides |
| US4698267A (en) * | 1985-09-17 | 1987-10-06 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| US5026456A (en) * | 1990-06-14 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Aramid papers containing aramid paper pulp |
| US6942757B1 (en) * | 1993-11-29 | 2005-09-13 | Teijin Twaron B.V. | Process for preparing para-aromatic polyamide paper |
| JP3673277B2 (ja) * | 1993-12-21 | 2005-07-20 | イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー | 高い強度及び印刷適性を有し且つ平滑な表面を有する、層をなしたアラミド紙 |
| JP3340549B2 (ja) * | 1994-03-01 | 2002-11-05 | 帝人株式会社 | 多孔性アラミド成形物の製造方法 |
| US5789059A (en) * | 1995-04-28 | 1998-08-04 | Showa Aircraft Industry Co., Ltd. | Honeycomb core |
| JPH10131017A (ja) * | 1996-02-21 | 1998-05-19 | Shin Kobe Electric Mach Co Ltd | 積層板用基材及びその製造法ならびにプリプレグ及び積層板 |
| JPH1072752A (ja) * | 1996-05-15 | 1998-03-17 | Matsushita Electric Ind Co Ltd | プリント配線板用不織布基材とこれを用いたプリプレグ |
| JPH10212688A (ja) * | 1997-01-20 | 1998-08-11 | Shin Kobe Electric Mach Co Ltd | 積層板用基材の製造法及びその製造に用いる混抄不織布 |
| US5833807A (en) * | 1997-04-17 | 1998-11-10 | E. I. Du Pont De Nemours And Company | Aramid dispersions and aramid sheets of increased uniformity |
| JP3206500B2 (ja) * | 1997-07-02 | 2001-09-10 | 王子製紙株式会社 | 積層板基材用原料の処理方法 |
| JP3869559B2 (ja) * | 1998-09-28 | 2007-01-17 | 新神戸電機株式会社 | 電気絶縁用不織布ならびにプリプレグ及び積層板 |
| JP3631385B2 (ja) * | 1998-11-18 | 2005-03-23 | 王子製紙株式会社 | 積層板用基材およびその製造方法 |
| JP2000273788A (ja) * | 1999-01-21 | 2000-10-03 | Toray Ind Inc | パラ系芳香族ポリアミド繊維紙およびその製造方法 |
| JP3556114B2 (ja) * | 1999-02-08 | 2004-08-18 | 帝人テクノプロダクツ株式会社 | 芳香族ポリアミド繊維紙 |
| US6120643A (en) * | 1999-10-27 | 2000-09-19 | E. I. Du Pont De Nemours And Company | Aramid and glass fiber absorbent papers |
| US6592963B1 (en) * | 2000-06-16 | 2003-07-15 | E. I. Du Pont De Nemours And Company | Honeycomb structure |
| US6303221B1 (en) * | 2000-12-07 | 2001-10-16 | E. I. Du Pont De Nemours And Company | Two-component pulp reinforcement |
| US20020142689A1 (en) * | 2001-01-23 | 2002-10-03 | Levit Mikhail R. | Non-woven sheet of aramid floc |
| US6436236B1 (en) * | 2001-03-05 | 2002-08-20 | E. I. Du Pont De Nemours & Company | Electrically-conductive para-aramid pulp |
| JP4287622B2 (ja) * | 2002-06-28 | 2009-07-01 | デュポン帝人アドバンスドペーパー株式会社 | コーティングセパレータ、その製造方法およびそれを用いた電気電子部品 |
| US7459044B2 (en) * | 2002-08-26 | 2008-12-02 | E. I. Du Pont De Nemours And Company | Sheet material especially useful for circuit boards |
| US20040071952A1 (en) * | 2002-10-01 | 2004-04-15 | Anderson David Wayne | Aramid paper laminate |
| JP2005200545A (ja) * | 2004-01-15 | 2005-07-28 | Yokohama Rubber Co Ltd:The | ホース補強層間ゴム組成物およびこれを用いたホース |
| US20050284595A1 (en) * | 2004-06-25 | 2005-12-29 | Conley Jill A | Cellulosic and para-aramid pulp and processes of making same |
| US20060266486A1 (en) * | 2005-05-26 | 2006-11-30 | Levit Mikhail R | Electroconductive aramid paper |
-
2004
- 2004-04-16 US US10/826,530 patent/US20050230072A1/en not_active Abandoned
-
2005
- 2005-04-15 WO PCT/US2005/012996 patent/WO2005103376A1/en not_active Ceased
- 2005-04-15 CA CA2561329A patent/CA2561329C/en not_active Expired - Lifetime
- 2005-04-15 BR BRPI0509409A patent/BRPI0509409B8/pt active IP Right Grant
- 2005-04-15 CN CN2005800111380A patent/CN1942629B/zh not_active Expired - Lifetime
- 2005-04-15 EP EP05739774A patent/EP1756360B1/en not_active Expired - Lifetime
- 2005-04-15 JP JP2007508603A patent/JP2007532798A/ja active Pending
-
2011
- 2011-07-22 JP JP2011161010A patent/JP5686688B2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4729921A (en) * | 1984-10-19 | 1988-03-08 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| CN1222604A (zh) * | 1999-01-22 | 1999-07-14 | 四川省对外经济贸易总公司 | 特种合成纤维纸及其生产方法 |
| EP1152084A2 (en) * | 2000-04-03 | 2001-11-07 | Showa Aircraft Industry Co., Ltd. | Aramid Honeycombs and a method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| BRPI0509409B8 (pt) | 2023-01-31 |
| EP1756360B1 (en) | 2012-08-15 |
| CN1942629A (zh) | 2007-04-04 |
| JP2011219913A (ja) | 2011-11-04 |
| CA2561329A1 (en) | 2005-11-03 |
| US20050230072A1 (en) | 2005-10-20 |
| EP1756360A1 (en) | 2007-02-28 |
| JP2007532798A (ja) | 2007-11-15 |
| CA2561329C (en) | 2014-07-15 |
| BRPI0509409B1 (pt) | 2015-12-22 |
| WO2005103376A1 (en) | 2005-11-03 |
| JP5686688B2 (ja) | 2015-03-18 |
| BRPI0509409A (pt) | 2007-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1105102 Country of ref document: HK |
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| C14 | Grant of patent or utility model | ||
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221117 Address after: Delaware Patentee after: DuPont Security & Construction Address before: Delaware Patentee before: E. I. du Pont de Nemours and Co. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100407 |