JP2007531276A5 - - Google Patents

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Publication number
JP2007531276A5
JP2007531276A5 JP2007505008A JP2007505008A JP2007531276A5 JP 2007531276 A5 JP2007531276 A5 JP 2007531276A5 JP 2007505008 A JP2007505008 A JP 2007505008A JP 2007505008 A JP2007505008 A JP 2007505008A JP 2007531276 A5 JP2007531276 A5 JP 2007531276A5
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JP
Japan
Prior art keywords
polishing pad
polishing
pad according
holes
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007505008A
Other languages
English (en)
Japanese (ja)
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JP2007531276A (ja
Filing date
Publication date
Priority claimed from US10/807,064 external-priority patent/US7195544B2/en
Application filed filed Critical
Publication of JP2007531276A publication Critical patent/JP2007531276A/ja
Publication of JP2007531276A5 publication Critical patent/JP2007531276A5/ja
Pending legal-status Critical Current

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JP2007505008A 2004-03-23 2005-03-14 成分を満たした複数の孔を有するｃｍｐ多孔質パッド Pending JP2007531276A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/807,064 US7195544B2 (en) 2004-03-23 2004-03-23 CMP porous pad with component-filled pores
PCT/US2005/008527 WO2005100497A1 (en) 2004-03-23 2005-03-14 Cmp porous pad with component-filled pores

Publications (2)

Publication Number Publication Date
JP2007531276A JP2007531276A (ja) 2007-11-01
JP2007531276A5 true JP2007531276A5 (enExample) 2008-04-17

Family

ID=34962652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007505008A Pending JP2007531276A (ja) 2004-03-23 2005-03-14 成分を満たした複数の孔を有するｃｍｐ多孔質パッド

Country Status (9)

Country Link
US (2) US7195544B2 (enExample)
EP (1) EP1751243B1 (enExample)
JP (1) JP2007531276A (enExample)
KR (2) KR101178335B1 (enExample)
CN (1) CN1934208B (enExample)
IL (2) IL176955A (enExample)
MY (2) MY139413A (enExample)
TW (1) TWI280266B (enExample)
WO (1) WO2005100497A1 (enExample)

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US10946495B2 (en) 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
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