KR101178335B1 - 성분이 충전된 공극을 갖는 ｃｍｐ 다공성 패드 - Google Patents

성분이 충전된 공극을 갖는 ｃｍｐ 다공성 패드 Download PDF

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Publication number
KR101178335B1
KR101178335B1 KR1020067019556A KR20067019556A KR101178335B1 KR 101178335 B1 KR101178335 B1 KR 101178335B1 KR 1020067019556 A KR1020067019556 A KR 1020067019556A KR 20067019556 A KR20067019556 A KR 20067019556A KR 101178335 B1 KR101178335 B1 KR 101178335B1
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KR
South Korea
Prior art keywords
delete delete
polishing
polishing pad
component
polymeric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067019556A
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English (en)
Korean (ko)
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KR20060127221A (ko
Inventor
아바네쉬워 프라사드
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20060127221A publication Critical patent/KR20060127221A/ko
Application granted granted Critical
Publication of KR101178335B1 publication Critical patent/KR101178335B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020067019556A 2004-03-23 2005-03-14 성분이 충전된 공극을 갖는 ｃｍｐ 다공성 패드 Expired - Fee Related KR101178335B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/807,064 US7195544B2 (en) 2004-03-23 2004-03-23 CMP porous pad with component-filled pores
US10/807,064 2004-03-23
PCT/US2005/008527 WO2005100497A1 (en) 2004-03-23 2005-03-14 Cmp porous pad with component-filled pores

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020127016015A Division KR20120087991A (ko) 2004-03-23 2005-03-14 성분이 충전된 공극을 갖는 ｃｍｐ 다공성 패드

Publications (2)

Publication Number Publication Date
KR20060127221A KR20060127221A (ko) 2006-12-11
KR101178335B1 true KR101178335B1 (ko) 2012-08-29

Family

ID=34962652

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020067019556A Expired - Fee Related KR101178335B1 (ko) 2004-03-23 2005-03-14 성분이 충전된 공극을 갖는 ｃｍｐ 다공성 패드
KR1020127016015A Ceased KR20120087991A (ko) 2004-03-23 2005-03-14 성분이 충전된 공극을 갖는 ｃｍｐ 다공성 패드

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020127016015A Ceased KR20120087991A (ko) 2004-03-23 2005-03-14 성분이 충전된 공극을 갖는 ｃｍｐ 다공성 패드

Country Status (9)

Country Link
US (2) US7195544B2 (enExample)
EP (1) EP1751243B1 (enExample)
JP (1) JP2007531276A (enExample)
KR (2) KR101178335B1 (enExample)
CN (1) CN1934208B (enExample)
IL (2) IL176955A (enExample)
MY (2) MY146815A (enExample)
TW (1) TWI280266B (enExample)
WO (1) WO2005100497A1 (enExample)

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RU2008106248A (ru) * 2005-07-19 2009-08-27 Дау Глобал Текнолоджиз Инк. (Us) Содержащий микрополости упругий, термопластичный пеноматериал, композиционный материал из пеноматериала и частиц, способы получения и изделия, изготовленные из него
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KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
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Also Published As

Publication number Publication date
EP1751243A1 (en) 2007-02-14
IL176955A0 (en) 2006-12-10
CN1934208A (zh) 2007-03-21
MY139413A (en) 2009-09-30
US7195544B2 (en) 2007-03-27
EP1751243B1 (en) 2014-04-16
IL176955A (en) 2012-10-31
KR20060127221A (ko) 2006-12-11
CN1934208B (zh) 2011-08-10
WO2005100497A1 (en) 2005-10-27
TW200609315A (en) 2006-03-16
IL215969A0 (en) 2011-12-29
KR20120087991A (ko) 2012-08-07
US20050215177A1 (en) 2005-09-29
MY146815A (en) 2012-09-28
US7699684B2 (en) 2010-04-20
US20070180778A1 (en) 2007-08-09
TWI280266B (en) 2007-05-01
JP2007531276A (ja) 2007-11-01

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