JP2007512549A5 - - Google Patents
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- Publication number
- JP2007512549A5 JP2007512549A5 JP2006536874A JP2006536874A JP2007512549A5 JP 2007512549 A5 JP2007512549 A5 JP 2007512549A5 JP 2006536874 A JP2006536874 A JP 2006536874A JP 2006536874 A JP2006536874 A JP 2006536874A JP 2007512549 A5 JP2007512549 A5 JP 2007512549A5
- Authority
- JP
- Japan
- Prior art keywords
- fluorinated
- group
- moiety
- resist
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000000217 alkyl group Chemical group 0.000 claims 14
- 239000002253 acid Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 229920000642 polymer Polymers 0.000 claims 8
- 238000004090 dissolution Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- 238000003384 imaging method Methods 0.000 claims 6
- 125000004407 fluoroaryl group Chemical group 0.000 claims 4
- 125000005348 fluorocycloalkyl group Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 3
- 125000003367 polycyclic group Chemical group 0.000 claims 3
- 230000005855 radiation Effects 0.000 claims 3
- 239000004971 Cross linker Substances 0.000 claims 2
- 125000003277 amino group Chemical group 0.000 claims 2
- 125000001841 imino group Chemical group [H]N=* 0.000 claims 2
- 230000002401 inhibitory effect Effects 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- 230000001737 promoting effect Effects 0.000 claims 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims 1
- 150000001241 acetals Chemical class 0.000 claims 1
- 230000004913 activation Effects 0.000 claims 1
- 125000002843 carboxylic acid group Chemical group 0.000 claims 1
- 238000006555 catalytic reaction Methods 0.000 claims 1
- 238000003776 cleavage reaction Methods 0.000 claims 1
- 150000004292 cyclic ethers Chemical group 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- AQYSYJUIMQTRMV-UHFFFAOYSA-N hypofluorous acid Chemical group FO AQYSYJUIMQTRMV-UHFFFAOYSA-N 0.000 claims 1
- -1 ketal Chemical class 0.000 claims 1
- 150000002905 orthoesters Chemical class 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 230000007017 scission Effects 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/693,199 US6939664B2 (en) | 2003-10-24 | 2003-10-24 | Low-activation energy silicon-containing resist system |
| PCT/US2004/035253 WO2005040918A2 (en) | 2003-10-24 | 2004-10-22 | Low-activation energy silicon-containing resist system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007512549A JP2007512549A (ja) | 2007-05-17 |
| JP2007512549A5 true JP2007512549A5 (https=) | 2007-11-22 |
| JP4530368B2 JP4530368B2 (ja) | 2010-08-25 |
Family
ID=34522329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006536874A Expired - Fee Related JP4530368B2 (ja) | 2003-10-24 | 2004-10-22 | 活性化エネルギーの低いケイ素含有レジスト・システム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6939664B2 (https=) |
| EP (1) | EP1678556A4 (https=) |
| JP (1) | JP4530368B2 (https=) |
| KR (1) | KR100773011B1 (https=) |
| CN (1) | CN100561337C (https=) |
| WO (1) | WO2005040918A2 (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7261992B2 (en) * | 2000-12-21 | 2007-08-28 | International Business Machines Corporation | Fluorinated silsesquioxane polymers and use thereof in lithographic photoresist compositions |
| JP4262516B2 (ja) * | 2003-05-12 | 2009-05-13 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
| US7175968B2 (en) * | 2003-07-28 | 2007-02-13 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a substrate |
| US7432042B2 (en) * | 2003-12-03 | 2008-10-07 | United Microelectronics Corp. | Immersion lithography process and mask layer structure applied in the same |
| JP4494060B2 (ja) * | 2004-03-30 | 2010-06-30 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
| JP4989047B2 (ja) * | 2004-07-02 | 2012-08-01 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 浸漬リソグラフィ用の組成物及びプロセス |
| US7320855B2 (en) * | 2004-11-03 | 2008-01-22 | International Business Machines Corporation | Silicon containing TARC/barrier layer |
| US7659050B2 (en) * | 2005-06-07 | 2010-02-09 | International Business Machines Corporation | High resolution silicon-containing resist |
| EP1731962B1 (en) * | 2005-06-10 | 2008-12-31 | Obducat AB | Pattern replication with intermediate stamp |
| US8404427B2 (en) * | 2005-12-28 | 2013-03-26 | Fujifilm Corporation | Photosensitive composition, and pattern-forming method and resist film using the photosensitive composition |
| US7407736B2 (en) * | 2006-01-31 | 2008-08-05 | International Business Machines Corporation | Methods of improving single layer resist patterning scheme |
| US8945808B2 (en) * | 2006-04-28 | 2015-02-03 | International Business Machines Corporation | Self-topcoating resist for photolithography |
| US8034532B2 (en) | 2006-04-28 | 2011-10-11 | International Business Machines Corporation | High contact angle topcoat material and use thereof in lithography process |
| US7951524B2 (en) * | 2006-04-28 | 2011-05-31 | International Business Machines Corporation | Self-topcoating photoresist for photolithography |
| US20070269736A1 (en) * | 2006-05-16 | 2007-11-22 | International Business Machines Corporation | NEW SUB 40 NM RESOLUTION Si CONTAINING RESIST SYSTEM |
| US7704670B2 (en) * | 2006-06-22 | 2010-04-27 | Az Electronic Materials Usa Corp. | High silicon-content thin film thermosets |
| JP5085649B2 (ja) * | 2006-06-28 | 2012-11-28 | ダウ コーニング コーポレーション | 電子吸引基を有する塩基性添加剤を含有するシルセスキオキサン樹脂システム |
| WO2008002975A2 (en) * | 2006-06-28 | 2008-01-03 | Dow Corning Corporation | Silsesquioxane resin systems with base additives bearing electron- attracting functionalities |
| WO2008001782A1 (fr) * | 2006-06-28 | 2008-01-03 | Tokyo Ohka Kogyo Co., Ltd. | Composition de résine photosensible et procédé de formation d'un motif |
| US8026040B2 (en) | 2007-02-20 | 2011-09-27 | Az Electronic Materials Usa Corp. | Silicone coating composition |
| EP2121808A1 (en) | 2007-02-27 | 2009-11-25 | AZ Electronic Materials USA Corp. | Silicon-based antifrelective coating compositions |
| US20090104566A1 (en) * | 2007-10-19 | 2009-04-23 | International Business Machines Corporation | Process of multiple exposures with spin castable film |
| US20110003176A1 (en) * | 2008-01-31 | 2011-01-06 | Showa Denko K.K. | Process for forming concavo-convex patterns, and process for manufacturing magnetic recording media using the same |
| EP2199854B1 (en) * | 2008-12-19 | 2015-12-16 | Obducat AB | Hybrid polymer mold for nano-imprinting and method for making the same |
| EP2199855B1 (en) * | 2008-12-19 | 2016-07-20 | Obducat | Methods and processes for modifying polymer material surface interactions |
| US8932796B2 (en) * | 2011-11-10 | 2015-01-13 | International Business Machines Corporation | Hybrid photoresist composition and pattern forming method using thereof |
| FI128886B (en) | 2019-02-25 | 2021-02-26 | Pibond Oy | Functional hydrogen silsesquioxane resins and the use thereof |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07140666A (ja) | 1993-06-04 | 1995-06-02 | Internatl Business Mach Corp <Ibm> | マイクロリトグラフィックレジスト組成物、酸不安定化合物、マイクロリトグラフィックレリーフ画像形成方法及び酸感知性ポリマー組成物 |
| JP2697680B2 (ja) * | 1995-05-31 | 1998-01-14 | 日本電気株式会社 | 珪素含有高分子化合物および感光性樹脂組成物 |
| JP3505990B2 (ja) * | 1997-01-31 | 2004-03-15 | 信越化学工業株式会社 | 高分子シリコーン化合物、化学増幅ポジ型レジスト材料及びパターン形成方法 |
| US5985524A (en) * | 1997-03-28 | 1999-11-16 | International Business Machines Incorporated | Process for using bilayer photoresist |
| JP3533951B2 (ja) * | 1997-08-06 | 2004-06-07 | 信越化学工業株式会社 | 高分子シリコーン化合物、レジスト材料及びパターン形成方法 |
| KR100452670B1 (ko) * | 1997-08-06 | 2005-10-11 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고분자실리콘화합물,레지스트재료및패턴형성방법 |
| US6037097A (en) * | 1998-01-27 | 2000-03-14 | International Business Machines Corporation | E-beam application to mask making using new improved KRS resist system |
| US6087064A (en) * | 1998-09-03 | 2000-07-11 | International Business Machines Corporation | Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method |
| US6225403B1 (en) * | 1999-02-03 | 2001-05-01 | Barry R. Knowlton | Method and composition for treating fibrous substrates to impart oil, water and dry soil repellency |
| US6227546B1 (en) | 1999-03-26 | 2001-05-08 | Jetseal, Inc. | Resilient seal and method of using a resilient seal |
| KR100725462B1 (ko) * | 1999-12-06 | 2007-06-07 | 후지필름 가부시키가이샤 | 포지티브 포토레지스트 조성물 |
| US6444408B1 (en) * | 2000-02-28 | 2002-09-03 | International Business Machines Corporation | High silicon content monomers and polymers suitable for 193 nm bilayer resists |
| US20010036594A1 (en) * | 2000-03-28 | 2001-11-01 | Fujitsu Limited | Resist composition for use in chemical amplification and method for forming a resist pattern thereof |
| US6531260B2 (en) * | 2000-04-07 | 2003-03-11 | Jsr Corporation | Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin composition |
| JP3410707B2 (ja) * | 2000-04-19 | 2003-05-26 | 松下電器産業株式会社 | パターン形成材料及びパターン形成方法 |
| KR100555285B1 (ko) * | 2000-06-02 | 2006-03-03 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고분자 화합물, 레지스트 조성물 및 패턴 형성 방법 |
| US6420084B1 (en) * | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Mask-making using resist having SIO bond-containing polymer |
| US6420088B1 (en) * | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Antireflective silicon-containing compositions as hardmask layer |
| JP2002082437A (ja) * | 2000-09-06 | 2002-03-22 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| US20020081520A1 (en) * | 2000-12-21 | 2002-06-27 | Ratnam Sooriyakumaran | Substantially transparent aqueous base soluble polymer system for use in 157 nm resist applications |
| US7261992B2 (en) * | 2000-12-21 | 2007-08-28 | International Business Machines Corporation | Fluorinated silsesquioxane polymers and use thereof in lithographic photoresist compositions |
| JP3931951B2 (ja) * | 2001-03-13 | 2007-06-20 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
| JP4061454B2 (ja) * | 2001-03-13 | 2008-03-19 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
| JP3900246B2 (ja) * | 2001-03-13 | 2007-04-04 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
| CN1916760B (zh) * | 2001-06-29 | 2010-10-13 | Jsr株式会社 | 酸发生剂、磺酸、磺酸衍生物及辐射敏感树脂组合物 |
| US7244549B2 (en) * | 2001-08-24 | 2007-07-17 | Jsr Corporation | Pattern forming method and bilayer film |
-
2003
- 2003-10-24 US US10/693,199 patent/US6939664B2/en not_active Expired - Fee Related
-
2004
- 2004-10-22 EP EP04796270A patent/EP1678556A4/en not_active Withdrawn
- 2004-10-22 WO PCT/US2004/035253 patent/WO2005040918A2/en not_active Ceased
- 2004-10-22 KR KR1020067007410A patent/KR100773011B1/ko not_active Expired - Fee Related
- 2004-10-22 JP JP2006536874A patent/JP4530368B2/ja not_active Expired - Fee Related
- 2004-10-22 CN CNB2004800311819A patent/CN100561337C/zh not_active Expired - Fee Related
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