JP2007502904A - ポリエキシ樹脂用ポリホスホネート難燃硬化剤 - Google Patents
ポリエキシ樹脂用ポリホスホネート難燃硬化剤 Download PDFInfo
- Publication number
- JP2007502904A JP2007502904A JP2006533410A JP2006533410A JP2007502904A JP 2007502904 A JP2007502904 A JP 2007502904A JP 2006533410 A JP2006533410 A JP 2006533410A JP 2006533410 A JP2006533410 A JP 2006533410A JP 2007502904 A JP2007502904 A JP 2007502904A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- polyphosphonate
- composition
- curing agent
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract description 5
- 239000003063 flame retardant Substances 0.000 title abstract description 5
- 229920005989 resin Polymers 0.000 title description 7
- 239000011347 resin Substances 0.000 title description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 125000000732 arylene group Chemical group 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 36
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 19
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 14
- 239000000047 product Substances 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- -1 arylene diols Chemical class 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 0 *c(cc1)ccc1OP(*)(Oc1ccc(*)cc1)=N Chemical compound *c(cc1)ccc1OP(*)(Oc1ccc(*)cc1)=N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- HPUPGAFDTWIMBR-UHFFFAOYSA-N [methyl(phenoxy)phosphoryl]oxybenzene Chemical compound C=1C=CC=CC=1OP(=O)(C)OC1=CC=CC=C1 HPUPGAFDTWIMBR-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005600 alkyl phosphonate group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- HECGKCOICWUUJU-UHFFFAOYSA-N bis(diphenylphosphanylmethyl)-phenylphosphane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 HECGKCOICWUUJU-UHFFFAOYSA-N 0.000 description 1
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- YLFBFPXKTIQSSY-UHFFFAOYSA-N dimethoxy(oxo)phosphanium Chemical compound CO[P+](=O)OC YLFBFPXKTIQSSY-UHFFFAOYSA-N 0.000 description 1
- VONWDASPFIQPDY-UHFFFAOYSA-N dimethyl methylphosphonate Chemical compound COP(C)(=O)OC VONWDASPFIQPDY-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47265403P | 2003-05-22 | 2003-05-22 | |
| PCT/US2004/016459 WO2004113411A1 (en) | 2003-05-22 | 2004-05-19 | Polyphosphonate flame retardant curing agent for epoxy resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007502904A true JP2007502904A (ja) | 2007-02-15 |
| JP2007502904A5 JP2007502904A5 (enrdf_load_stackoverflow) | 2007-07-12 |
Family
ID=33539043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006533410A Pending JP2007502904A (ja) | 2003-05-22 | 2004-05-19 | ポリエキシ樹脂用ポリホスホネート難燃硬化剤 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1625171A1 (enrdf_load_stackoverflow) |
| JP (1) | JP2007502904A (enrdf_load_stackoverflow) |
| KR (1) | KR20060019547A (enrdf_load_stackoverflow) |
| CN (1) | CN1795223A (enrdf_load_stackoverflow) |
| CA (1) | CA2525856A1 (enrdf_load_stackoverflow) |
| WO (1) | WO2004113411A1 (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010530017A (ja) * | 2007-06-14 | 2010-09-02 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃剤組成物 |
| JP4782789B2 (ja) * | 2004-08-31 | 2011-09-28 | スプレスタ エルエルシー | アルキルホスホン酸ジアリールエステルならびにそのアルキルホスホン酸アリーレン誘導体のオリゴマー／ポリマー誘導体の調製方法 |
| JP2012507599A (ja) * | 2008-10-29 | 2012-03-29 | アイシーエル−アイピー アメリカ インコーポレイテッド | リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板 |
| WO2012165665A1 (ja) * | 2011-06-03 | 2012-12-06 | Arisawa Mfg. Co., Ltd. | 難燃性樹脂組成物、並びに該樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、フレキシブルプリント配線板用接着シート及びフレキシブルプリント配線板 |
| US10167377B2 (en) | 2013-01-22 | 2019-01-01 | Frx Polymers, Inc. | Phosphorus containing epoxy compounds and compositions therefrom |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110132646A1 (en) * | 2009-06-12 | 2011-06-09 | Icl-Ip America Inc. | Flame retardant epoxy resin composition, prepreg and laminate thereof |
| JP5806333B2 (ja) * | 2010-12-22 | 2015-11-10 | エフアールエックス ポリマーズ、インク． | ホスホン酸オリゴマーおよびこれを含む組成物 |
| TWI475052B (zh) * | 2011-12-22 | 2015-03-01 | Frx Polymers Inc | 寡聚膦酸酯及包含該寡聚膦酸酯之組成物 |
| KR101469270B1 (ko) * | 2011-12-30 | 2014-12-08 | 제일모직주식회사 | 폴리포스포네이트 공중합체, 그 제조 방법 및 이를 포함하는 난연성 열가소성 수지 조성물 |
| CN105802127B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板 |
| CN105801814B (zh) | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
| CN105330824A (zh) * | 2015-12-09 | 2016-02-17 | 西安元创化工科技股份有限公司 | 一种用于环氧树脂的阻燃固化剂及其制备方法 |
| TWI620785B (zh) * | 2016-08-10 | 2018-04-11 | Taiwan Union Technology Corporation | 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
| TWI620763B (zh) * | 2017-04-27 | 2018-04-11 | Taiwan Union Technology Corporation | 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
| EP3704185A4 (en) * | 2017-09-13 | 2021-08-04 | Hexion Research Belgium SA | EPOXY RESIN SYSTEMS |
| CN107903383A (zh) * | 2017-11-22 | 2018-04-13 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大小丝束碳纤维环氧复合传动轴中的应用 |
| CN107778456A (zh) * | 2017-11-22 | 2018-03-09 | 吉林省高性能复合材料制造业创新中心有限公司 | 中低温固化环氧树脂及其制备方法与在大丝束碳纤维环氧复合传动轴中的应用 |
| CN109705530B (zh) * | 2018-12-29 | 2021-06-04 | 广东生益科技股份有限公司 | 热固性树脂组合物及含有它的预浸料、层压板和高频电路基板 |
| CN112480373A (zh) * | 2019-09-11 | 2021-03-12 | 广东广山新材料股份有限公司 | 一种阻燃性环氧树脂组合物及其制备方法和应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1180178A (ja) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | リン含有フェノール末端オリゴマー及びその製造法 |
| JP2001019746A (ja) * | 1999-07-09 | 2001-01-23 | Asahi Denka Kogyo Kk | 難燃性エポキシ樹脂組成物 |
| JP2002363259A (ja) * | 2001-06-04 | 2002-12-18 | Mitsubishi Gas Chem Co Inc | 難燃性樹脂組成物 |
| WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004044054A1 (en) * | 2002-11-08 | 2004-05-27 | Akzo Nobel N.V. | Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| DE10300462A1 (de) * | 2003-01-07 | 2004-07-15 | Bakelite Ag | Phosphormodifiziertes Epoxidharz |
-
2004
- 2004-05-19 CA CA002525856A patent/CA2525856A1/en not_active Abandoned
- 2004-05-19 EP EP04776110A patent/EP1625171A1/en not_active Withdrawn
- 2004-05-19 KR KR1020057022045A patent/KR20060019547A/ko not_active Ceased
- 2004-05-19 JP JP2006533410A patent/JP2007502904A/ja active Pending
- 2004-05-19 CN CNA2004800140798A patent/CN1795223A/zh active Pending
- 2004-05-19 WO PCT/US2004/016459 patent/WO2004113411A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1180178A (ja) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | リン含有フェノール末端オリゴマー及びその製造法 |
| JP2001019746A (ja) * | 1999-07-09 | 2001-01-23 | Asahi Denka Kogyo Kk | 難燃性エポキシ樹脂組成物 |
| JP2002363259A (ja) * | 2001-06-04 | 2002-12-18 | Mitsubishi Gas Chem Co Inc | 難燃性樹脂組成物 |
| WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4782789B2 (ja) * | 2004-08-31 | 2011-09-28 | スプレスタ エルエルシー | アルキルホスホン酸ジアリールエステルならびにそのアルキルホスホン酸アリーレン誘導体のオリゴマー／ポリマー誘導体の調製方法 |
| JP2010530017A (ja) * | 2007-06-14 | 2010-09-02 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃剤組成物 |
| JP2012507599A (ja) * | 2008-10-29 | 2012-03-29 | アイシーエル−アイピー アメリカ インコーポレイテッド | リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板 |
| WO2012165665A1 (ja) * | 2011-06-03 | 2012-12-06 | Arisawa Mfg. Co., Ltd. | 難燃性樹脂組成物、並びに該樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、フレキシブルプリント配線板用接着シート及びフレキシブルプリント配線板 |
| US10167377B2 (en) | 2013-01-22 | 2019-01-01 | Frx Polymers, Inc. | Phosphorus containing epoxy compounds and compositions therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1795223A (zh) | 2006-06-28 |
| KR20060019547A (ko) | 2006-03-03 |
| CA2525856A1 (en) | 2004-12-29 |
| EP1625171A1 (en) | 2006-02-15 |
| WO2004113411A1 (en) | 2004-12-29 |
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