WO2012165665A1 - 難燃性樹脂組成物、並びに該樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、フレキシブルプリント配線板用接着シート及びフレキシブルプリント配線板 - Google Patents
難燃性樹脂組成物、並びに該樹脂組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、フレキシブルプリント配線板用接着シート及びフレキシブルプリント配線板 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/14—Macromolecular materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0207—Particles made of materials belonging to B32B25/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/718—Weight, e.g. weight per square meter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
- C08K5/5333—Esters of phosphonic acids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Definitions
- the present invention relates to a halogen-free flame-retardant resin composition, and more specifically, a flame-retardant resin composition mainly used in adhesives such as composites made of glass fiber, polyimide, and metal foil in the field of electronic materials, and
- the present invention relates to a metal-clad laminate for a flexible printed wiring board, a cover lay, an adhesive sheet, and a flexible printed wiring board using the same.
- Flame retardant resin compositions are used as adhesives in the field of electronic materials (especially printed wiring boards [more specifically, flexible printed wiring boards including substrates such as metal-clad laminates (hereinafter also referred to as FPC)]).
- electronic materials especially printed wiring boards [more specifically, flexible printed wiring boards including substrates such as metal-clad laminates (hereinafter also referred to as FPC)].
- FPC metal-clad laminates
- metal foil for example, copper foil
- film for example, polyester film, polyimide film, etc.
- metal foils, films, a composite containing glass fibers, the metal foil, and the composite It is used as an adhesive when bonding films.
- JP 2001-002931 A contains phosphorus in a molecule for the purpose of improving heat resistance, adhesiveness and the like for use in applications such as adhesives for circuit boards.
- a flame retardant resin composition containing a resin for example, a phosphorus-containing polyester resin or a phosphorus-containing polyurethane resin
- a phosphorus-containing compound such as ammonium polyphosphate
- a curing agent such as an epoxy resin or an isocyanate compound
- the flame retardant resin composition described in the publication contains a predetermined amount of a low molecular weight phosphorus-containing compound (phosphorus flame retardant), for example, when it is used as an adhesive for a printed wiring board, it absorbs. It is considered that the adhesion strength and the migration characteristics are remarkably lowered due to hydrolysis of the phosphorus-containing compound by the moisture. Moreover, in such a flame retardant resin composition, the effects (such as glass transition temperature and elastic modulus) of the resin composition after curing molding are reduced, so that the effect on the electrical characteristics of the printed wiring board after curing molding is sufficient. There is a problem that cannot be demonstrated. In addition, such a flame retardant resin composition has a problem that a satisfactory effect cannot be obtained particularly in flame retardancy and adhesiveness depending on the content ratio of the epoxy resin and the curing agent and phosphorus.
- a low molecular weight phosphorus-containing compound phosphorus flame retardant
- an object of the present invention is to provide a flame retardant resin composition that is excellent in adhesion after curing and molding, for example, as an adhesive for printed wiring boards, and in electrical characteristics of printed wiring boards.
- the present invention achieves the above object by providing a flame retardant resin composition containing a thermosetting resin, a curing agent, and a phosphonic acid-containing polymer.
- a flame retardant resin composition that is excellent in adhesiveness after curing and as an adhesive for a printed wiring board and in electrical characteristics of the printed wiring board.
- the outstanding metal-clad laminated board for flexible printed wiring boards, a coverlay, an adhesive sheet, and a flexible printed wiring board which use this flame-retardant resin composition are provided, respectively.
- FIG. 1 is a schematic sectional view showing an embodiment (single-sided metal-clad laminate) of a metal-clad laminate according to the present invention.
- FIG. 2 is a schematic cross-sectional view showing another embodiment (double-sided metal-clad laminate) of the metal-clad laminate according to the present invention.
- FIG. 3 is a schematic cross-sectional view showing an embodiment of a cover lay according to the present invention.
- FIG. 4 is a schematic cross-sectional view showing one embodiment (single-sided board) of the flexible printed wiring board according to the present invention.
- FIG. 5 is a schematic sectional drawing which shows another embodiment (double-sided board) of the flexible printed wiring board based on this invention.
- FIG. 1 is a schematic sectional view showing an embodiment (single-sided metal-clad laminate) of a metal-clad laminate according to the present invention.
- FIG. 2 is a schematic cross-sectional view showing another embodiment (double-sided metal-clad laminate) of the metal-clad laminate according
- FIG. 6 is a schematic cross-sectional view showing an example of a flex-rigid printed wiring board to which the flame retardant resin composition according to the present invention can be applied.
- FIG. 7 is a schematic cross-sectional view showing a laminated board provided with a copper foil before formation of a circuit pattern.
- FIG. 8 is an explanatory diagram (plan view) showing a circuit pattern used in a characteristic evaluation test of a printed wiring board using the flame retardant resin composition according to the present invention.
- the flame-retardant resin composition of the present invention is mainly suitably used for applications such as metal-clad laminates for flexible printed wiring boards, coverlays, adhesive sheets, and flexible printed wiring boards.
- the metal-clad laminate for flexible printed wiring board is a laminate of a film and a metal foil.
- the coverlay is provided to protect the circuit of the metal-clad laminate for a flexible printed wiring board provided with a conductor pattern (hereinafter also referred to as a circuit) formed on a metal foil, for example, electrical insulation.
- the resin composition is provided on a synthetic resin film having properties by means of coating or the like in a single-layer or multi-layer laminated state.
- the flexible printed wiring board is a board in which a coverlay is provided in a necessary portion of a metal-clad laminate for a flexible printed wiring board provided with a circuit.
- the flame-retardant resin composition of the present invention is preferably used mainly for the above applications, but can also be used for multilayer printed wiring boards, flex-rigid printed wiring boards, and the like.
- a flex-rigid printed wiring board a flex-rigid printed wiring board 40 having the form shown in FIG. 6 can be illustrated as an example.
- the flex-rigid printed wiring board 40 includes an FPC 44 including a copper-clad laminate 41 having a circuit 42 formed thereon and a pair of coverlays 43 and 43 laminated on both sides thereof, and both sides of the FPC 44.
- a pair of rigid substrates 46, 46 having a prepreg as a core, adhesive sheets 45, 45 provided between the FPC 44 and the rigid substrates 46, 46, and copper foil are etched to form the rigid substrates.
- a plurality of circuits 47 formed on the surfaces of 46 and 46 and a through hole 48 for drilling holes with a drill after the lamination in a predetermined circuit and performing copper plating are mainly configured.
- the prepreg here refers to a glass cloth that is impregnated with a thermosetting resin (a mixture of epoxy resin, BT resin, etc. with a curing agent, solvent, filler, additive, etc.), heat dried, and can be stored. A state in which curing is advanced to a certain stable state (B stage).
- the flame retardant resin composition of the present invention comprises a thermosetting resin, a curing agent, and a phosphonic acid-containing polymer.
- the phosphonic acid-containing polymer is a phosphonic acid-containing polymer having a property of imparting flame retardancy. By blending this phosphonic acid-containing polymer, high flame retardancy is exhibited.
- the flame retardant resin composition of the present invention comprises a thermosetting resin, a curing agent, and a phosphonic acid-containing polymer or oligomer as basic components, an additive that contributes to the flame retardancy of the entire resin composition The amount of can be reduced. Thereby, the compatibility and molding processability of the flame retardant resin composition before curing are facilitated, and the adhesion characteristics and electrical characteristics of the flame retardant resin composition after curing molding can be improved.
- Examples of the phosphonic acid-containing polymer include polymers, copolymers, oligomers thereof and the like containing a structural unit represented by the following formula (1) in the main chain of the polymer or the side chain of the polymer.
- Ar is a structure containing an aromatic group
- the —O—Ar—O— structure is derived from resorcinol, hydroquinone, biphenol or bisphenol
- R is C1-20 alkyl, C2 -20 alkene, C2-20 alkyne, C5-20 cycloalkyl, or C6-20 allyl
- n is an integer selected from 1 to 300, and the total phosphorus content is 12% by weight or less.
- the —O—AR—O— structure is bisphenol A, bisphenol F, 4,4′-bisphenol, phenolphthalein, 4,4′-thiodiphenol, 4,4′-sulfonyldiphenol, Derived from 3,3,5-trimethylcyclohexyldiphenol, or combinations thereof.
- more specific phosphorus-containing polymers include polymers and copolymers containing a structural unit represented by the following formula (2) in the main chain or side chain of the polymer.
- R1 and R2 may be the same or different and each represents a hydrogen atom, a methyl group or a lower alkyl group.
- N is an integer of 50 to 300.
- the phosphorus weight% in the phosphonic acid-containing polymer is approximately 12% by weight or less, approximately 10% by weight or approximately 9.5% by weight, and approximately 5 to 12% by weight or approximately 7 to 10% by weight.
- the phosphonic acid-containing polymer has a weight average molecular weight (more than 2500, approximately 5000, approximately 9000, or approximately 20000 in weight average molecular weight (molecular weight measured with respect to polystyrene [polystyrene standard], the same shall apply hereinafter), or approximately The weight average molecular weight is 2500 to about 200000, about 5000 to about 150,000, or about 9000 to about 100,000.
- the phosphonic acid-containing polymer has a high Tg (glass transition point), which is defined as 100 ° C.
- the resin composition after curing of the curing agent can exhibit a high flame retardant effect even when a small amount of a phosphonic acid-containing polymer is used.
- the phosphorus-containing polymer has a structure related to a phosphorus component incorporated in the main chain or side chain. That is, the structure relating to the phosphorus component is retained by chemical bonding. Thereby, a phosphorus component does not precipitate from the resin composition, and further, it is resistant to hydrolysis by moisture and becomes a flame retardant resin composition having excellent electrical characteristics.
- the phosphonic acid-containing polymer or oligomer may be a block copolymer or a random copolymer. These copolymers (phosphonate carbonate) may contain at least 20 mol% of high-purity diallylalkylphosphonate or optionally substituted diallylalkylphosphonate (one or more optionally substituted diallylphosphonate). Aromatic dihydroxide can be included, and the mole% of the high purity diallylalkylphosphonic acid is due to the total amount of transesterification components, such as diallylalkylphosphonic acid. Depending on the total amount of and the total amount of diallyl carbonate.
- the monomers of the copolymer carbonate are randomly incorporated into the polymer chain.
- the polymer chain is composed of aromatic dihydroxides and / or various elements, such as some phosphonic or oligophosphonates, polyphosphonates, oligocarbonates, polycarbonates. It is possible to include phosphonic acid and carbonate monomers alternately connected and copolymerized with several carbonate monomer elements such as In addition, the length of the various oligomers, polyphosphonic acid oligomers, polycarbonate elements can vary among the individual copolymers.
- the contents of phosphonic acid and carbonate of the copolymer (phosphonate carbonate) can be variously different and are not limited by the contents of phosphonic acid and / or carbonate, and the content of phosphonic acid and / or carbonate is not limited. It is not limited by the range.
- a copolymer (phosphonate carbonate) has a certain phosphorus content, which indicates that the entire copolymer (phosphonate carbonate) contains about 1 wt% to about 20 wt% of phosphonic acid, or It indicates that the phosphorus content of the copolymer (phosphonate carbonate) is about 2 wt% to about 10 wt%.
- the copolymer (phosphonate carbonate) has a high molecular weight distribution and a low molecular weight distribution (eg, low polydispersity (e.g., low polydispersity)).
- a block copolymer or a random copolymer (phosphonate carbonate) can have a weight average molecular weight (Mw) of about 10,000 g / mole to about 100,000 g / mole in ⁇ rel or GPC
- the block copolymer or the random copolymer (phosphonate carbonate) may have a weight average molecular weight (Mw) of about 12,000 g / mole to about 80,000 g / mole in ⁇ rel or GPC.
- the low molecular weight dispersion (eg, Mw / Mn) of such a block copolymer or random copolymer may be about 2 to about 7 or about 2 to about 5.
- These block copolymers and random copolymers have a relative viscosity of about 1.10 to about 1.40.
- the high molecular weight dispersion and low molecular weight dispersion of the block copolymer or random copolymer may provide a suitable combination of properties.
- block copolymers and random copolymers are generally strong, extremely excellent in flame retardancy, and exhibit excellent hydrolysis stability.
- the block copolymers and random carbonates exhibit very good processing properties, including excellent thermal and mechanical properties.
- the blending amount of the phosphonic acid-containing polymer in the flame retardant resin composition is preferably 5 to 50 parts by weight, more preferably 10 to 40 parts by weight with respect to 100 parts by weight of the thermosetting resin.
- thermosetting resin used in the flame retardant resin composition examples include an epoxy resin and a phenol resin, and in particular, adhesion to a metal foil or a film, stability in a semi-cured state (so-called B stage).
- an epoxy resin is preferable.
- an epoxy resin having at least two epoxy groups in one molecule and containing no halogen is used.
- bisphenol type epoxy resins for example, bisphenol A type, bisphenol F type, bisphenol S type, etc.
- novolak type epoxy resins for example, phenol novolak type, cresol novolak type, etc.
- biphenyl type epoxy resin for example, naphthalene ring Containing epoxy resin, alicyclic epoxy resin, and the like.
- bisphenol F-type, bisphenol S-type, and novolak-type epoxy resins are preferable in terms of improving flame retardancy.
- the epoxy resin mentioned above and a phosphorus containing epoxy resin can be used together. Moreover, it can replace with an epoxy resin and can use a phosphorus containing epoxy resin. Moreover, a phosphorus containing epoxy resin and a phosphorus containing polymer can also be used together.
- the phosphonic acid-containing epoxy resin is obtained, for example, by reacting an oligomer represented by the following formula (2) with at least one of the above-described epoxy resins at 100 to 150 ° C. for 2 to 5 hours. be able to.
- n is an integer of 1 to 16
- the curing agent is not particularly limited as long as it is used as a curing agent for thermosetting resins.
- an epoxy resin is used as the thermosetting resin, it is preferably used in combination with a curing agent used as a curing agent for the epoxy resin.
- the curing agent examples include diaminodiphenylmethane (DDM), diaminodiphenylsulfone (DDS), diaminodiphenyl ether (DDE), imidazoles, hexamethylenediamine, polyamidoamine, dicyandiamide, and phenol novolac.
- DDM diaminodiphenylmethane
- DDS diaminodiphenylsulfone
- DDE diaminodiphenyl ether
- imidazoles hexamethylenediamine, polyamidoamine, dicyandiamide, and phenol novolac.
- amine-based curing agents and phenol-based curing agents are preferable from the viewpoint of reaction stability, and amine-based curing agents are particularly preferable.
- the oligomer of Formula (2) can also be used as a phenol type hardening
- the blending amount of the curing agent in the flame retardant resin composition is preferably 1 to 200 parts by weight, more preferably 3 to 100 parts by weight with respect to 100 parts by weight of the thermosetting resin. Moreover, you may use together a hardening accelerator with this hardening
- a softening agent to the flame retardant resin composition from the viewpoint of improving flexibility and adhesiveness.
- synthetic rubber such as acrylonitrile butadiene rubber (NBR), styrene butadiene rubber (SBR), acrylate butadiene rubber (ABR), acrylic rubber (ACM, ANM), polyester resin, polystyrene resin (PS) And thermoplastic resins such as polyethersulfone resin (PES), polyurethane resin (PU), and polyamide resin (PA).
- the blending amount of the softening agent in the flame retardant resin composition is preferably 3 to 80 parts by weight, more preferably 5 to 60 parts by weight with respect to 100 parts by weight of the thermosetting resin.
- the flame-retardant resin composition has a handling property (for example, adjustment of stickiness) when the resin composition is in a semi-cured state (B-stage state), and adhesiveness of the resin composition after curing.
- a flame retardant other than the phosphonic acid-containing polymer can be added for the purpose of improving and easily adjusting the melt viscosity.
- the flame retardant include metal-containing flame retardants such as metal hydrates such as aluminum hydroxide and magnesium hydroxide, and metal carbonates such as calcium carbonate.
- the blending amount of the metal-containing flame retardant in the flame retardant resin composition is 10 to 200 parts by weight, preferably 20 to 150 parts by weight with respect to 100 parts by weight of the thermosetting resin.
- various additives such as an antioxidant, a surfactant, a coupling agent, etc., in addition to the above-described components as necessary, within a range that does not deteriorate various properties. ) May be added.
- the flame retardant resin composition is used after being cured (especially for use in the above application).
- the extent to which the resin composition is cured depends on the application, equipment, and the like. Usually, it is used after being cured under predetermined conditions such as heating and pressing.
- the temperature is preferably 130 to 180 ° C.
- the pressure is preferably 2 to 5 MPa / cm 2
- the time is preferably 10 to 60 minutes.
- the metal-clad laminate for a flexible printed wiring board of the present invention is a laminate 20 in which a film 2 and a metal foil 3 are laminated, and the flame-retardant resin composition 1 described above is It is used as an adhesive for adhering the film 2 and the metal foil 3.
- FIG. 1 is a schematic sectional view showing an embodiment 20 (single-sided metal-clad laminate) of a metal-clad laminate according to the present invention.
- the metal-clad laminate of the present invention corresponds to a substrate when used for a flexible printed wiring board.
- the thickness of the film is 4 to 75 ⁇ m and the thickness of the layer made of the flame retardant resin composition as an adhesive is 5 to 30 ⁇ m.
- the metal-clad laminate of the present invention is a laminate 21 in which a pair of metal foils 3 and 3 are laminated on both surfaces of a film 2 as shown in FIG. Examples include those in which the flammable resin compositions 1 and 1 are used as adhesives for adhering the film 2 and the metal foils 3 and 3 on both sides, respectively.
- FIG. 2 is a schematic sectional view showing another embodiment 21 (double-sided metal-clad laminate) of the metal-clad laminate according to the present invention.
- a polyimide film for example, a polyimide film, a polyester film, a polyamide film and the like are adopted, and among them, a polyimide film is preferable in terms of flame retardancy, electrical insulation, heat resistance, elastic modulus and the like.
- metal foil for example, a current-carrying material such as copper foil or silver foil is employed.
- a polyimide film is used as the film 2 and a copper foil is used as the metal foil 3 in the metal-clad laminates 20 and 21.
- the coverlay of the present invention is one in which the above-mentioned heat-resistant resin composition 1 is provided on a synthetic resin film 2 having electrical insulation.
- FIG. 3 is a schematic sectional view showing an embodiment 10 of a cover lay according to the present invention.
- Examples of the cover lay of the present invention include a structure in which the above-mentioned heat-resistant resin composition is applied in a laminated state to a synthetic resin film having electrical insulation. Such a coverlay is used to be provided for protecting the circuit such as a metal-clad laminate for a flexible printed wiring board provided with a circuit.
- the thickness of the synthetic resin film is 4 to 75 ⁇ m and the thickness of the layer made of the flame retardant resin composition is 5 to 50 ⁇ m.
- the synthetic resin film for example, a polyimide film, a polyester film, a polyamide film or the like is adopted, and among them, a polyimide film is preferable in terms of flame retardancy, electrical insulation, heat resistance, elastic modulus and the like. In addition, you may employ
- a polyimide film is used as the film 2, and the flame-retardant resin composition 1 provided on the film 2 functions as an adhesive.
- the adhesive used here may be the same as or different from the adhesive used for the metal-clad laminate described above.
- the adhesive sheet for flexible printed wiring boards of this invention consists of a flame-retardant resin composition mentioned above, and is a sheet-like thing. Specifically, it is a sheet-like adhesive sheet in which a flame-retardant resin composition is applied to a release surface of a release film to make it a semi-cured state.
- the thickness of the adhesive sheet of the present invention is preferably 10 to 60 ⁇ m.
- the adhesive sheet of the present invention is used as a sheet that can be stuck when bonding metal foils, films, a composite made of glass fiber and a thermosetting resin, a metal foil, and the composite and a film.
- FIG. 4 is a schematic sectional view showing one embodiment 30 (single-sided board) of the flexible printed wiring board according to the present invention.
- a flame retardant resin is applied to the film 2, the flame retardant resin composition 1 (1b), and the metal foil 3 of the single-sided metal-clad laminate 20 including the circuit formed metal foil 3.
- the circuit can be formed by performing an etching process.
- the flexible printed wiring board of the present invention can arbitrarily set the entire thickness according to the application.
- FIG. 5 is a schematic sectional view showing another embodiment 31 (double-sided board) of the flexible printed wiring board according to the present invention.
- the film 2 is arranged at the center, the flame retardant resin compositions 1 (1b) and 1 (1b) as adhesives on both surfaces of the film 2, and the metal foils 3 and 3 on the outside thereof.
- a desired circuit is drawn by etching the metal foils 3 and 3 of the laminated board 21, and then the metal foil 3 as the circuit is drawn.
- a flexible printed wiring board 31 obtained by laminating the film 2 and the flame retardant resin composition 1 of the cover lay as an adhesive so that the surfaces of the flame retardant resin composition 1 are in contact with each other. .
- the flexible printed wiring board of the present invention has a preferred embodiment in which the metal-clad laminate for flexible printed wiring board on which the circuit is formed and the coverlay are bonded together by hot pressing.
- the hot press conditions are preferably a temperature of 130 to 180 ° C., a pressure of 2 to 5 MPa, and a time of 10 to 60 minutes.
- the flexible printed wiring board of the present invention is suitably used as a so-called chip-on-flex flexible printed wiring board for mounting an IC chip, for example.
- the flexible printed wiring boards 30 and 31 shown in FIGS. 4 and 5 a polyimide film is used as the film 2, and a copper foil is used as the metal foil 3 as a circuit.
- the flame retardant resin composition 1 is used for the adhesive in the printed wiring boards 30 and 31, and these may have the same or different blending composition.
- the flexible printed wiring board of the present invention is not limited to such an embodiment, and may be a multilayer printed wiring board in which several layers having the above-described configuration are laminated.
- Examples 1 to 16 and Comparative Examples 1 to 5 The formulations shown in Table 1 and Table 2 were prepared respectively. The number of parts is a value expressed in terms of solid content. The examples shown in Tables 3 and 4 are made using different flame retardants as shown in the tables.
- Table 2 shows that phosphonic acid-containing polymers (FRX-100), phosphonic acid-containing copolymers (FRX CO-35, FRX CO-60, and FRX CO-95) or oligomers are used (FRX).
- FRX-100 is a phosphonic acid polymer having a structure represented by the formula (1).
- FRX CO-35, FRX CO-60, and FRX CO-95 are random co-polymers consisting of diphenyl carbonate, diphenylmethylphosphonate, and bisphenol A (bisphenol A), with different weight percentages of phosphonic acid. It is a coalescence.
- the phosphonic acid-containing portion of the copolymer has a structure represented by formula (1).
- FRX (OL1001) is an oligomer version of FRX-100, has a lower degree of polymerization than FRX-100, and has a structure represented by Formula (3).
- the data in Table 3 shows that by using a polyphosphonic acid compound as a flame retardant component in the composition, an optimized property profile of the flexible printed wiring board was obtained, and the property passed the FR test. However, it has the desired loop stiffness (low loop stiffness, lower is better) and solder float heat resistance (requires at least 288 ° C.), these properties being sufficient for its application. Surprisingly, the reduction in molecular weight of the phosphonic acid-containing material (80000-30000 g / mole, polystyrene standard) improves the loop stiffness.
- Table 4 shows that the use of a relatively high molecular weight flame retardant compound in the above composition can greatly improve the migration resistance of the composition.
- Optimized molecular weights are sought between 2000 g / mole and 40000 g / mole in order to balance all the properties in the final application (for example a combination of low loop stiffness and excellent migration resistance).
- Epoxy resin A bisphenol type epoxy resin having an epoxy equivalent number of 170 g / eq (solid content: 100%).
- Phosphonic acid-containing polymer FRX-100 (manufactured by FRX Polymers, solid content 100%, phosphorus content 10.8%, polystyrene standard 30,000 to 200,000 g / mole molecular weight (Mw), glass transition temperature 100 ° C to 107 ° C), FRX-CO95 (manufactured by FRX Polymers, solid content 100%, phosphorus content 10.1% by weight, polystyrene standard 30,000 to 100,000 g / mole molecular weight (Mw), glass transition point Temperature 100 ° C to 107 ° C), FRX-CO60 (manufactured by FRX Polymers, solid content 100%, phosphorus content 6.4% by weight, polystyrene standard 30,000 to 100,000 g / mole molecular weight (Mw), glass
- FRX-CO35 manufactured by FRX Polymers, solid
- FRXL100 manufactured by FRX Polymers, solid Minute 100%, phosphorus content 10.8% by weight, polystyrene standard 25,000 to 45,000 g / mole molecular weight (Mw), glass transition temperature 100 ° C.
- FRX-OL5000 manufactured by FRX Polymers
- Solid content 100% phosphorus content 10.5% by weight
- the phosphorus content (% by weight) in the table means the amount of phosphorus contained in the phosphorus-containing polymer by thermosetting resin (solid content conversion), curing agent (solid content conversion), and phosphorus-containing polymer (solid content). Divided by the total amount in terms of conversion) and expressed as a percentage.
- Phosphorus-containing epoxy resin The resin shown below was used.
- Curing agent diaminodiphenylmethane (DDM, solid content 100%).
- Softener Nipol 1072 (manufactured by Nippon Zeon Co., Ltd., solid content 100%).
- Metal-containing flame retardant Aluminum hydroxide (manufactured by Showa Denko KK, Hijilite H43STE).
- the heat resistance was evaluated by preparing samples for evaluation of each resin composition. The evaluation method was performed in accordance with IPC TM650. (Double-circle): Solder float heat resistance is 300 degreeC or more, and has heat resistance which does not have any problem practically. ⁇ : Solder float heat resistance is 288 ° C. or higher, and has practical heat resistance. X: Solder float heat resistance cannot achieve 288 degreeC, and heat resistance is inadequate.
- the sample for evaluation was prepared according to the following procedure. First, each resin composition was applied on a polyimide film (Apical 25NPI, manufactured by Kaneka Chemical Co., Ltd.) using a bar coater so that the thickness after drying would be 10 ⁇ m, and dried by heating at 150 ° C. for 5 minutes. After the B-stage (semi-cured state), the roughened surface of electrolytic copper foil (Mitsui Metal Mining Co., Ltd., 3EC-3, 18 ⁇ m) is bonded to the resin composition surface with a laminator. A sample was prepared by curing the single-sided plate at 180 ° C. for 1 hour until it reached the C stage state.
- the migration resistance was evaluated by performing a test under predetermined conditions (voltage: 100 V, temperature: 85 ° C., humidity: 85% RH) and changing the voltage for a certain time (1000 hours). At this time, migration was evaluated based on the following criteria.
- X The resistance value was less than 1.0 ⁇ 10 7 (there was a problem in practical use).
- Heating resistance (UL-94-VTM-0)
- the resin sheet sample of each resin composition based on UL94 standard was produced.
- the cured state of the sheet sample was set to the C stage state (completely cured state).
- the curing conditions were as follows. (1) Heating temperature: 180 ° C. (2) Time: 60 minutes. It was confirmed whether flame retardancy (UL-94-VTM-0) can achieve UL94 standard VTM-0 grade.
- the evaluation sample was produced by the following procedure. First, the single-sided copper-clad laminate shown in FIG. 7 was prepared, and the circuit pattern shown in FIG. 8 was drawn on the copper foil surface of the laminate by etching to obtain a single-sided copper-clad laminate with a circuit formed thereon.
- the single-sided copper-clad laminate has the same configuration as that used in the heat resistance test described above.
- each resin composition was adjusted based on Table 1, and each resin composition was applied to a polyimide film by a bar coater method so that the coating thickness after heating and drying was 25 ⁇ m.
- Each of the coverlays in a cured state (B stage state) was obtained. The semi-cured condition at this time was 180 ° C. for 1 hour.
- each coverlay is laminated on the circuit pattern of a single-sided copper-clad laminate, and heated and pressed under the conditions of 180 ° C., 1 hour, 3 MPa / cm 2 for the evaluation sample. Each flexible printed wiring board was obtained.
- Migration also called copper migration is a phenomenon in which, when a voltage is applied between copper foil circuits, copper ions are eluted from the anode using ionic impurities in the adhesive as a medium, and copper is deposited on the cathode side. I mean. When this deposition increases, the resistance value between circuits decreases.
- the flame retardant resin composition of the present invention is excellent in flame retardancy after curing and molding, for example, as an adhesive for a printed wiring board, and electrical characteristics of the printed wiring board. I confirmed.
- SYMBOLS 1 Flame-retardant resin composition, 2 ... Film, 3 ... Metal foil, 10 ... Coverlay, 20, 21 ... Metal-clad laminate, 30, 31 ... Flexible printed wiring board, 40 ... Flex-rigid printed wiring board, 41 ... Copper-clad laminate, 42, 47 ... Circuit, 43 ... Coverlay, 44 ... FPC, 45 ... Adhesive sheet, 46 ... Rigid substrate, 48 ... Through-hole, 70 ... Single-sided copper-clad laminate, 71 ... Copper foil, 72 ... adhesive, 73 ... polyimide film, 80 ... circuit pattern, 81 ... line, 82 ... space.
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Abstract
Description
本発明の難燃性樹脂組成物は、主に、フレキシブルプリント配線板用金属張積層板、カバーレイ、接着シート、フレキシブルプリント配線板等の用途に好適に用いられる。ここで、フレキシブルプリント配線板用金属張積層板とは、フィルムと金属箔とが積層されたものである。また、カバーレイとは、金属箔に形成される導体パターン(以下、回路ともいう)を設けたフレキシブルプリント配線板用金属張積層板の該回路を保護する為に設けられるもの、例えば、電気絶縁性を有する合成樹脂フィルムに前記樹脂組成物が単層又は複数層の積層状態で塗布等の手段により設けられたものである。また、フレキシブルプリント配線板とは、回路を設けたフレキシブルプリント配線板用金属張積層板の必要な部分に、カバーレイを設けたものである。
本発明のフレキシブルプリント配線板用金属張積層板は、図1に示すように、フィルム2と金属箔3とが積層された積層板20であって、前述した難燃性樹脂組成物1が、該フィルム2と該金属箔3とを貼着せしめる接着剤として使用されているものである。尚、図1は、本発明に係る金属張積層板の一実施形態20(片面金属張積層板)を示す概略断面図である。本発明の金属張積層板は、フレキシブルプリント配線板に対して使用する際の基板に相当する。
本発明のカバーレイは、図3に示すように、前述した難熱性樹脂組成物1が、電気絶縁性を有する合成樹脂フィルム2に設けられているものである。尚、図3は、本発明に係るカバーレイの一実施形態10を示す概略断面図である。
本発明のフレキシブルプリント配線板用接着シートは、前述した難燃性樹脂組成物からなるもので、シート状のものである。具体的には離型フィルムの離型面に難燃性樹脂組成物を塗布し、半硬化状態にしたシート状の接着シートである。
図4は、本発明に係るフレキシブルプリント配線板の一実施形態30(片面板)を示す概略断面図である。図4に示すように、フィルム2、難燃性樹脂組成物1(1b)、回路が形成された金属箔3からなる片面金属張積層板20の金属箔3に、フィルム2に難燃性樹脂組成物1(1a)が設けられたカバーレイ10の難燃性樹脂組成物1(1a)の面が接するように積層することで得られる片面フレキシブルプリント配線板30である。尚、本実施形態において、回路の形成は、エッチング処理を施すことにより形成することができる。
表1および表2に示す配合物をそれぞれ調製した。また、部数は、固形分換算で表した値である。表3および表4に示される例はそれら表に示されているように異なる難燃材を使用して作られている。
エポキシ樹脂:エポキシ当量数が170g/eqであるビスフェノールタイプのエポキシ樹脂(固形分100%)。
ホスホン酸含有ポリマー:FRX−100(FRX Polymers社製、固形分100%、リン含有率10.8%、ポリスチレン標準で30,000~200,000g/moleの分子量(Mw)、ガラス転移点温度100℃~107℃)、FRX−CO95(FRX Polymers社製、固形分100%、リン含有率10.1重量%、ポリスチレン標準で30,000~100,000g/moleの分子量(Mw)、ガラス転移点温度100℃~107℃)、FRX−CO60(FRX Polymers社製、固形分100%、リン含有率6.4重量%、ポリスチレン標準で30,000~100,000g/moleの分子量(Mw)、ガラス転移点温度115℃~125℃)、FRX−CO35(FRX Polymers社製、固形分100%、リン含有率3.7重量%、ポリスチレン標準で30,000~100,000g/moleの分子量(Mw)、ガラス転移点温度125℃~135℃)、FRXL100(FRX Polymers社製、固形分100%、リン含有率10.8重量%、ポリスチレン標準で25,000~45,000g/moleの分子量(Mw)、ガラス転移点温度100℃~107℃)、FRX−OL5000(FRX Polymers社製、固形分100%、リン含有率10.5重量%、ポリスチレン標準で8,000~10,000g/moleの分子量(Mw)、ガラス転移点温度85℃~95℃)。ここで、表中のリン含有率(重量%)とは、リン含有ポリマーに含まれるリンの量を熱硬化性樹脂(固形分換算)、硬化剤(固形分換算)及びリン含有ポリマー(固形分換算)の合計量で除し、それを百分率で示したものである。
リン含有エポキシ樹脂:後述に示した樹脂を用いた。
硬化剤:ジアミノジフェニルメタン(DDM、固形分100%)。
柔軟剤:ニポール1072(日本ゼオン社製、固形分100%)。
金属含有難燃剤:水酸化アルミ(昭和電工社製、ハイジライトH43STE)。
リン含有エポキシ樹脂は、エポキシ当量が188g/eqのビスフェノールA型エポキシ樹脂(三菱化学社製、JER828)550gとリン含有オリゴマー(FRX Polymers社製、FRX OL 1001、固形分100%、リン含有率8~10重量%、分子量=2000~4500g/mole(ポリスチレン標準))450gとを2リットルのセパラブルフラスコに計り入れ、130℃で加熱撹拌した。その後、トリフェニルフォスフィンを2.5g添加し、約3時間加熱撹拌することにより、エポキシ当量が約510g/eq、リン含有量が約4.1質量%のリン含有エポキシ樹脂を得た。
UL94規格に準拠した各樹脂組成物の樹脂シートサンプルを作製した。シートサンプルの硬化状態は、Cステージ状態(完全硬化状態)となるようにした。硬化条件は、次の通りとした。
(1)加熱温度:180℃、(2)時間:60分。
また、表1および2では、難燃性は、以下の基準に基づきUL94規格V−0グレードを達成できるか否かにより難燃性を評価した。
◎:UL94規格V−0グレードを完璧に達成できる(難燃性にとても優れる)。
○:UL94規格V−0グレードをほぼ達成できる(実用上問題がない)。
×:UL94規格V−0グレードを達成することができない(実用上問題がある)。
耐熱性は、各樹脂組成物の評価用サンプルを作製し評価した。評価方法は、IPC TM650に準拠して行った。
◎:はんだフロート耐熱性が300℃以上であり、実用上全く問題のない耐熱性を有する。
○:はんだフロート耐熱性が288℃以上であり、実用可能な耐熱性を有する。
×:はんだフロート耐熱性が288℃を達成することができず、耐熱性が不十分である。
耐マイグレーション性は、所定の条件(電圧:100V、温度:85℃、湿度:85%RH)下で試験を行い、一定時間(1000hr)の電圧の変化により評価を行った。このとき、下記基準に基づいて、マイグレーション性を評価した。
◎:抵抗値が1.0×1010以上であった(優れたマイグレーション性を有する)。
○:抵抗値が1.0×107以上、1.0×1010未満であった(実用上問題がないレベルであった)。
×:抵抗値が1.0×107未満となった(実用上問題がある)。
JPCA−TM002に準拠して測定した。
IPC TM650に準拠して測定した。
測定機器として島津製作所社製オートグラフAGS−500を用い、90°方向における引き剥がし強度を測定した。条件は、基材フィルム引きで、テストスピードは50mm/min、室温で行った。
UL94規格に準拠した各樹脂組成物の樹脂シートサンプルを作製した。シートサンプルの硬化状態は、Cステージ状態(完全硬化状態)となるようにした。硬化条件は、次の通りとした。
(1)加熱温度:180℃、(2)時間:60分。
難燃性(UL−94−VTM−0)はUL94規格VTM−0グレードを達成できるか否かを確認した。
Claims (18)
- 熱硬化性樹脂と、硬化剤と、ホスホン酸含有ポリマーと、を含む難燃性樹脂組成物であって、前記ホスホン酸含有ポリマーは、9000を超える分子量(ポリスチレン標準)、100℃以上のガラス転移温度、又は12%以下のリン重量%を有するものである、難燃性樹脂組成物。
- 前記熱硬化性樹脂は、エポキシ樹脂である、請求項1記載の難燃性樹脂組成物。
- −O−Ar−O−の構造は、ビスフェノールA、ビスフェノールF、4,4‘−ビスフェノール、フェノールフタレイン、4,4‘−チオジフェノール、4,4‘−スルホニルジフェノール、3,3,5−トリメチルシクロヘキシルジフェノール、又はそれらの組み合わせに由来するものである、請求項3記載の難燃性樹脂組成物。
- 更に、柔軟剤が添加されており、前記柔軟剤が合成ゴム、熱可塑性樹脂から少なくとも1つ以上選択されたものであることを特徴とする請求項1~5の何れかに記載の難燃性樹脂組成物。
- 更に、難燃剤が添加されており、前記難燃剤が金属水和物、金属炭酸塩から少なくとも1つ以上選択されたものであることを特徴とする請求項1~6の何れかに記載の難燃性樹脂組成物。
- 請求項1~7の何れかに記載の難燃性樹脂組成物が、フィルムと金属箔とを貼着せしめる接着剤として使用されていることを特徴とするフレキシブルプリント配線板用金属張積層板。
- 請求項1~7の何れかに記載の難燃性樹脂組成物が、電気絶縁性を有する合成樹脂フィルムの少なくとも一面に設けられていることを特徴とするカバーレイ。
- 請求項1~7の何れかに記載の難燃性樹脂組成物からなることを特徴とするフレキシブルプリント配線板用接着シート。
- 請求項1~7の何れかに記載の難燃性樹脂組成物によりカバーレイを形成し、前記カバーレイが金属箔上に設けられていることを特徴とするフレキシブルプリント配線板。
- フレキシブルプリント配線板用金属張積層板であって、このフレキシブルプリント配線板用金属張積層板ではフィルムと金属箔との接着のために難燃性樹脂組成物が使われており、
前記難燃性樹脂組成物はリン含有ポリマーを含み、このリン含有ポリマーは下記式(1)で表される構造単位を有するものである、フレキシブルプリント配線板用金属張積層板。
- 前記−O−Ar−O−は、ビスフェノールA、ビスフェノールF、4,4‘−ビスフェノール、フェノールフタレイン、4,4‘−チオジフェノール、4,4‘−スルホニルジフェノール、3,3,5−トリメチルシクロヘキシルジフェノール、又はそれらの組み合わせに由来するものである、請求項12記載の難燃性樹脂組成物。
- フレキシブルプリント配線板用の接着シートであって、前記接着シートは、前記フレキシブルプリント配線板の回路パターンからのマイグレーションの防止のために耐熱性樹脂組成物を含有している、フレキシブルプリント配線板用接着シート。
- フレキシブルプリント配線板用の接着シートであって、前記接着シートは耐熱性樹脂組成物を含有し、前記耐熱性樹脂組成物は分子量が2000を超える(ポリスチレン基準)耐熱性ポリマーを含有している、フレキシブルプリント配線板用の接着シート。
- フレキシブルプリント配線板用金属張積層板であって、前記フレキシブルプリント配線板用金属張積層板は耐熱性樹脂組成物を含有し、前記耐熱性樹脂組成物は分子量が2000を超える(ポリスチレン基準)耐熱性ポリマーを含有している、フレキシブルプリント配線板用金属張積層板。
- フレキシブルプリント配線板用の接着シートであって、前記接着シートは耐熱性樹脂組成物を含有し、前記耐熱性樹脂組成物は分子量が2000~40000(ポリスチレン基準)の耐熱性ポリマーを含有している、フレキシブルプリント配線板用の接着シート。
- フレキシブルプリント配線板用金属張積層板であって、前記フレキシブルプリント配線板用金属張積層板は耐熱性樹脂組成物を含有し、前記耐熱性樹脂組成物は分子量が2000~40000(ポリスチレン基準)の耐熱性ポリマーを含有している、フレキシブルプリント配線板用金属張積層板。
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EP12794115.1A EP2716718A4 (en) | 2011-06-03 | 2012-06-04 | FIRE-RESISTANT RESIN, METAL-BASED BASE LAMINATE FOR A FLEXIBLE FITTED PCB WITH THIS COMPOSITION, COVER AND ADHESIVE FILM FOR FLEXIBLE FITTED PCBS AND FLEXIBLE FITTED LADDER PLATE |
CN201280037242.7A CN104024338A (zh) | 2011-06-03 | 2012-06-04 | 阻燃性树脂组合物、使用所述树脂组合物的挠性印刷线路板用金属箔基层压板、覆盖层、挠性印刷线路板用粘合片、以及挠性印刷线路板 |
US14/123,262 US20140224529A1 (en) | 2011-06-03 | 2012-06-04 | Fire-retardant resin composition, metal-clad base laminate for flexible printed circuit board utilizing said composition, cover lay, adhesive sheet for flexible printed circuit board and flexible printed circuit board |
KR1020147000094A KR20140093656A (ko) | 2011-06-03 | 2012-06-04 | 난연성 수지 조성물, 및 당해 수지 조성물을 사용한 플렉서블 프린트 배선판용 금속장 적층판, 커버 레이, 플렉서블 프린트 배선판용 접착 시트 및 플렉서블 프린트 배선판 |
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EP (1) | EP2716718A4 (ja) |
JP (1) | JP2013010955A (ja) |
KR (1) | KR20140093656A (ja) |
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US20140224529A1 (en) | 2014-08-14 |
CN104024338A (zh) | 2014-09-03 |
JP2013010955A (ja) | 2013-01-17 |
TW201313462A (zh) | 2013-04-01 |
KR20140093656A (ko) | 2014-07-28 |
EP2716718A1 (en) | 2014-04-09 |
EP2716718A4 (en) | 2015-04-15 |
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