JP2007329444A - 発光素子およびその製法 - Google Patents

発光素子およびその製法 Download PDF

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Publication number
JP2007329444A
JP2007329444A JP2006194894A JP2006194894A JP2007329444A JP 2007329444 A JP2007329444 A JP 2007329444A JP 2006194894 A JP2006194894 A JP 2006194894A JP 2006194894 A JP2006194894 A JP 2006194894A JP 2007329444 A JP2007329444 A JP 2007329444A
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JP
Japan
Prior art keywords
light
circuit board
light emitting
recess
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006194894A
Other languages
English (en)
Japanese (ja)
Inventor
Soon Jae Yu
ジェ・ユ スーン
Don Su Kim
スー・キム ドン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITSWELL CO Ltd
Original Assignee
ITSWELL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITSWELL CO Ltd filed Critical ITSWELL CO Ltd
Publication of JP2007329444A publication Critical patent/JP2007329444A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2006194894A 2006-06-09 2006-07-14 発光素子およびその製法 Pending JP2007329444A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060051764A KR100808644B1 (ko) 2006-06-09 2006-06-09 표면 실장형 발광 다이오드 램프 및 그 제조 방법

Publications (1)

Publication Number Publication Date
JP2007329444A true JP2007329444A (ja) 2007-12-20

Family

ID=38929689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006194894A Pending JP2007329444A (ja) 2006-06-09 2006-07-14 発光素子およびその製法

Country Status (2)

Country Link
JP (1) JP2007329444A (ko)
KR (1) KR100808644B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021503184A (ja) * 2018-08-24 2021-02-04 ケーティー・アンド・ジー・コーポレーション 発光素子及びそれを含むエアロゾル生成装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101523001B1 (ko) * 2008-03-28 2015-05-27 서울반도체 주식회사 발광 다이오드 패키지 및 그 발광 다이오드 패키지의트랜스퍼 몰딩 방법
KR101430178B1 (ko) * 2013-08-14 2014-08-13 (주)네오빛 사이드뷰 led 패키지
WO2019035653A1 (ko) * 2017-08-18 2019-02-21 엘지이노텍 주식회사 표면발광레이저 패키지

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0654081U (ja) * 1992-12-21 1994-07-22 タキロン株式会社 発光表示体
JPH08204239A (ja) * 1995-01-31 1996-08-09 Rohm Co Ltd 樹脂封止型発光装置
JP2002368286A (ja) * 2001-06-11 2002-12-20 Citizen Electronics Co Ltd 発光ダイオード及びその製造方法
JP2004063499A (ja) * 2002-07-24 2004-02-26 Ichikoh Ind Ltd Ｌｅｄを光源とする車両用灯具
WO2005029597A1 (ja) * 2003-09-19 2005-03-31 Matsushita Electric Industrial Co., Ltd. 照明装置
JP2005175048A (ja) * 2003-12-09 2005-06-30 Sanken Electric Co Ltd 半導体発光装置
JP2005223216A (ja) * 2004-02-06 2005-08-18 Matsushita Electric Ind Co Ltd 発光光源、照明装置及び表示装置
JP2005268600A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 発光ダイオードモジュールとその製造方法
JP2006093672A (ja) * 2004-08-26 2006-04-06 Toshiba Corp 半導体発光装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3432982B2 (ja) * 1995-12-13 2003-08-04 沖電気工業株式会社 表面実装型半導体装置の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0654081U (ja) * 1992-12-21 1994-07-22 タキロン株式会社 発光表示体
JPH08204239A (ja) * 1995-01-31 1996-08-09 Rohm Co Ltd 樹脂封止型発光装置
JP2002368286A (ja) * 2001-06-11 2002-12-20 Citizen Electronics Co Ltd 発光ダイオード及びその製造方法
JP2004063499A (ja) * 2002-07-24 2004-02-26 Ichikoh Ind Ltd Ｌｅｄを光源とする車両用灯具
WO2005029597A1 (ja) * 2003-09-19 2005-03-31 Matsushita Electric Industrial Co., Ltd. 照明装置
JP2005175048A (ja) * 2003-12-09 2005-06-30 Sanken Electric Co Ltd 半導体発光装置
JP2005223216A (ja) * 2004-02-06 2005-08-18 Matsushita Electric Ind Co Ltd 発光光源、照明装置及び表示装置
JP2005268600A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 発光ダイオードモジュールとその製造方法
JP2006093672A (ja) * 2004-08-26 2006-04-06 Toshiba Corp 半導体発光装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021503184A (ja) * 2018-08-24 2021-02-04 ケーティー・アンド・ジー・コーポレーション 発光素子及びそれを含むエアロゾル生成装置
US11304449B2 (en) 2018-08-24 2022-04-19 Kt&G Corporation Light-emitting element and aerosol generation device comprising same
JP7226904B2 (ja) 2018-08-24 2023-02-21 ケーティー アンド ジー コーポレイション 発光素子及びそれを含むエアロゾル生成装置

Also Published As

Publication number Publication date
KR20070117749A (ko) 2007-12-13
KR100808644B1 (ko) 2008-02-29

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