JP2007329238A - ウェーハ収納容器 - Google Patents
ウェーハ収納容器 Download PDFInfo
- Publication number
- JP2007329238A JP2007329238A JP2006158372A JP2006158372A JP2007329238A JP 2007329238 A JP2007329238 A JP 2007329238A JP 2006158372 A JP2006158372 A JP 2006158372A JP 2006158372 A JP2006158372 A JP 2006158372A JP 2007329238 A JP2007329238 A JP 2007329238A
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- wafer
- storage container
- wafer storage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
【解決手段】ウェーハ31の外周縁より外側にある外周部12と、外周部12の最上面よりも低い位置からウェーハ31の径方向内側に延出し、ウェーハ31を外周部12の最上面よりも低い位置で載置する載置部14と、を備えるウェーハ収納容器10であって、載置部14は、ウェーハ31の径方向内側に向かって下降すると共に、ウェーハ31を載置した際にウェーハ31の外周縁とのみ接触可能な第1の傾斜面27a,28aと、その第1の傾斜面27a,28aの裏側にあって、ウェーハ31の径方向内側に向かって上昇すると共に、ウェーハ収納容器10を複数重ねた際に、下方のウェーハ31の外周縁とのみ接触可能な第2の傾斜面27b,28bとを備える。
【選択図】図6
Description
12…円周部(外周部に相当)
14…載置部
22…凸部
23…切欠溝
24…凹部
25…上方傾斜部
26…下方傾斜部
27a…第1の傾斜面
27b…第2の傾斜面
28a…第1の傾斜面
28b…第2の傾斜面
31…ウェーハ
Claims (5)
- ウェーハの外周縁より外側にある外周部と、
上記外周部の最上面よりも低い位置からウェーハの径方向内側に延出し、ウェーハを上記外周部の最上面よりも低い位置で載置する載置部と、
を備えるウェーハ収納容器であって、
上記載置部は、ウェーハの径方向内側に向かって下降すると共に、ウェーハを載置した際にウェーハの外周縁とのみ接触可能な第1の傾斜面と、その第1の傾斜面の裏側にあって、ウェーハの径方向内側に向かって上昇すると共に、ウェーハ収納容器を複数重ねた際に、下方のウェーハの外周縁とのみ接触可能な第2の傾斜面とを備えることを特徴とするウェーハ収納容器。 - 前記外周部は、その上面に、所定の間隔で配置され、上方に突出する凸部を複数備え、前記第1の傾斜面は、その凸部と、凸部同士の間にある凹部の両方から連接し、ウェーハを載置した際に同じ高さで水平にウェーハを保持可能であることを特徴とする請求項1記載のウェーハ収納容器。
- 前記ウェーハ収納容器は、中央が貫通したリング状の形態を有することを特徴とする請求項1または2記載のウェーハ収納容器。
- 前記載置部には、周方向に沿って切り欠かれた複数の切欠溝が設けられていることを特徴とする請求項1から3のいずれか1項記載のウェーハ収納容器。
- 前記ウェーハ収納容器には、前記ウェーハの方向性を表すための印が設けられていることを特徴とする請求項1から4のいずれか1項記載のウェーハ収納容器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006158372A JP4716928B2 (ja) | 2006-06-07 | 2006-06-07 | ウェーハ収納容器 |
CN2007101032067A CN101085653B (zh) | 2006-06-07 | 2007-05-10 | 晶片收容容器 |
TW096116740A TWI408761B (zh) | 2006-06-07 | 2007-05-11 | Wafer storage container |
KR1020070052156A KR101033358B1 (ko) | 2006-06-07 | 2007-05-29 | 웨이퍼 수납 용기 |
US11/756,991 US7530462B2 (en) | 2006-06-07 | 2007-06-01 | Wafer storage container |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006158372A JP4716928B2 (ja) | 2006-06-07 | 2006-06-07 | ウェーハ収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007329238A true JP2007329238A (ja) | 2007-12-20 |
JP4716928B2 JP4716928B2 (ja) | 2011-07-06 |
Family
ID=38820806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006158372A Active JP4716928B2 (ja) | 2006-06-07 | 2006-06-07 | ウェーハ収納容器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7530462B2 (ja) |
JP (1) | JP4716928B2 (ja) |
KR (1) | KR101033358B1 (ja) |
CN (1) | CN101085653B (ja) |
TW (1) | TWI408761B (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009054917A (ja) * | 2007-08-29 | 2009-03-12 | Shin Etsu Polymer Co Ltd | ウェーハのハンドリング方法 |
JP2009059858A (ja) * | 2007-08-31 | 2009-03-19 | Shin Etsu Polymer Co Ltd | ウェーハのハンドリング方法 |
US20090250374A1 (en) * | 2007-03-05 | 2009-10-08 | Miraial Co., Ltd. | Semiconductor wafer container |
JP2009272349A (ja) * | 2008-04-30 | 2009-11-19 | Sumco Techxiv株式会社 | 保持容器及び保持容器ユニット |
WO2010067656A1 (ja) * | 2008-12-11 | 2010-06-17 | 三菱重工業株式会社 | 常温接合装置 |
JP2012006603A (ja) * | 2010-06-22 | 2012-01-12 | Hoya Corp | 包装体、及び光学素子の製造方法 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070068846A1 (en) * | 2005-09-29 | 2007-03-29 | Huang-Ting Hsiao | Wafer packing |
US20100224517A1 (en) * | 2009-03-03 | 2010-09-09 | Haggard Clifton C | Disk separator device |
US20100225011A1 (en) * | 2009-03-06 | 2010-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and Method for Integrated Circuit Fabrication |
US9224627B2 (en) | 2011-02-16 | 2015-12-29 | Texchem Advanced Products Incorporated Sdn Bhd | Single and dual stage wafer cushion and wafer separator |
US9653331B2 (en) * | 2011-02-16 | 2017-05-16 | Texchem Advanced Products Incorporated Sdn. Bhd. | Single and dual stage wafer cushion |
TWI541928B (zh) * | 2011-10-14 | 2016-07-11 | 晶元光電股份有限公司 | 晶圓載具 |
US9099514B2 (en) * | 2012-03-21 | 2015-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer holder with tapered region |
JP5797176B2 (ja) * | 2012-09-14 | 2015-10-21 | 東京エレクトロン株式会社 | スペーサ、スペーサの搬送方法、処理方法、及び、処理装置 |
SG11201607061WA (en) | 2014-02-25 | 2016-09-29 | Entegris Inc | Wafer shipper with stacked support rings |
JP6545601B2 (ja) * | 2015-10-23 | 2019-07-17 | アキレス株式会社 | セパレータ |
US10832927B2 (en) * | 2015-12-18 | 2020-11-10 | Texas Instruments Incorporated | Interlocking nest wafer protector |
US10643876B2 (en) | 2016-06-28 | 2020-05-05 | Murata Machinery, Ltd. | Substrate carrier and substrate carrier stack |
US10573545B2 (en) * | 2016-06-28 | 2020-02-25 | Murata Machinery, Ltd. | Substrate carrier and substrate carrier stack |
KR20180001999A (ko) * | 2016-06-28 | 2018-01-05 | 테크-샘 아게 | 개선된 기판 스토리지 및 프로세싱 |
CN108455070B (zh) * | 2017-02-20 | 2019-12-31 | 京东方科技集团股份有限公司 | 防潮垫片 |
JP6990873B2 (ja) * | 2017-03-31 | 2022-02-03 | アキレス株式会社 | 半導体ウェハ容器 |
US11257700B2 (en) * | 2017-08-29 | 2022-02-22 | Daewon Semiconductor Packaging Industrial Company | Separators for handling, transporting, or storing semiconductor wafers |
US10818530B1 (en) * | 2017-08-30 | 2020-10-27 | Murata Machinery, Ltd. | Substrate carriers with isolation membrane |
DE202019101793U1 (de) * | 2018-06-27 | 2019-10-09 | Murata Machinery, Ltd. | Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung |
JP6951306B2 (ja) * | 2018-09-10 | 2021-10-20 | 株式会社東芝 | ディスク装置 |
TWI735115B (zh) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | 晶圓儲存裝置及晶圓承載盤 |
US11664257B2 (en) * | 2021-09-21 | 2023-05-30 | Intel Corporation | Contactless wafer separator |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158437A (ja) * | 1982-03-16 | 1983-09-20 | Toshiba Corp | 減音・換気装置 |
JPH08236607A (ja) * | 1994-10-27 | 1996-09-13 | Illinois Tool Works Inc <Itw> | 集積回路要素用トレイとトレイに対する手動式要素転移システム |
JPH09199438A (ja) * | 1996-01-12 | 1997-07-31 | Tokyo Electron Ltd | 熱処理用治具 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158437U (ja) * | 1982-04-16 | 1983-10-22 | 昭和電工株式会社 | ウエハ−容器 |
JP2791971B2 (ja) * | 1994-06-17 | 1998-08-27 | 信越ポリマー株式会社 | ウェーハ収納容器におけるウェーハバスケット |
US6010008A (en) * | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
JP2000077512A (ja) | 1998-08-27 | 2000-03-14 | Super Silicon Kenkyusho:Kk | ウエーハ収容ケース |
US6550619B2 (en) * | 2000-05-09 | 2003-04-22 | Entergris, Inc. | Shock resistant variable load tolerant wafer shipper |
MY126840A (en) * | 2000-06-23 | 2006-10-31 | Sumitomo Bakelite Co | Electronic parts carrier tape |
US6837374B2 (en) * | 2001-07-15 | 2005-01-04 | Entegris, Inc. | 300MM single stackable film frame carrier |
JP4010244B2 (ja) * | 2002-12-20 | 2007-11-21 | ヤマハ株式会社 | 表面実装型パッケージ |
US6915906B2 (en) * | 2003-07-14 | 2005-07-12 | Peak Plastic & Metal Products (International) Limited | Wafer storage container with wafer positioning posts |
US7617932B2 (en) * | 2003-09-19 | 2009-11-17 | Diabetes Diagnostics, Inc. | Medical device package, kit and associated methods |
-
2006
- 2006-06-07 JP JP2006158372A patent/JP4716928B2/ja active Active
-
2007
- 2007-05-10 CN CN2007101032067A patent/CN101085653B/zh not_active Expired - Fee Related
- 2007-05-11 TW TW096116740A patent/TWI408761B/zh active
- 2007-05-29 KR KR1020070052156A patent/KR101033358B1/ko not_active IP Right Cessation
- 2007-06-01 US US11/756,991 patent/US7530462B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158437A (ja) * | 1982-03-16 | 1983-09-20 | Toshiba Corp | 減音・換気装置 |
JPH08236607A (ja) * | 1994-10-27 | 1996-09-13 | Illinois Tool Works Inc <Itw> | 集積回路要素用トレイとトレイに対する手動式要素転移システム |
JPH09199438A (ja) * | 1996-01-12 | 1997-07-31 | Tokyo Electron Ltd | 熱処理用治具 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090250374A1 (en) * | 2007-03-05 | 2009-10-08 | Miraial Co., Ltd. | Semiconductor wafer container |
US8397917B2 (en) * | 2007-03-05 | 2013-03-19 | Miraial Co., Ltd. | Semiconductor wafer container |
JP2009054917A (ja) * | 2007-08-29 | 2009-03-12 | Shin Etsu Polymer Co Ltd | ウェーハのハンドリング方法 |
JP2009059858A (ja) * | 2007-08-31 | 2009-03-19 | Shin Etsu Polymer Co Ltd | ウェーハのハンドリング方法 |
JP2009272349A (ja) * | 2008-04-30 | 2009-11-19 | Sumco Techxiv株式会社 | 保持容器及び保持容器ユニット |
WO2010067656A1 (ja) * | 2008-12-11 | 2010-06-17 | 三菱重工業株式会社 | 常温接合装置 |
US8906175B2 (en) | 2008-12-11 | 2014-12-09 | Mitsubishi Heavy Industries, Ltd. | Room temperature bonding apparatus |
JP2012006603A (ja) * | 2010-06-22 | 2012-01-12 | Hoya Corp | 包装体、及び光学素子の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101085653B (zh) | 2010-10-20 |
TW200805548A (en) | 2008-01-16 |
KR101033358B1 (ko) | 2011-05-09 |
US20070284282A1 (en) | 2007-12-13 |
TWI408761B (zh) | 2013-09-11 |
JP4716928B2 (ja) | 2011-07-06 |
CN101085653A (zh) | 2007-12-12 |
US7530462B2 (en) | 2009-05-12 |
KR20070117455A (ko) | 2007-12-12 |
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