JP2007313640A5 - - Google Patents

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JP2007313640A5
JP2007313640A5 JP2007138565A JP2007138565A JP2007313640A5 JP 2007313640 A5 JP2007313640 A5 JP 2007313640A5 JP 2007138565 A JP2007138565 A JP 2007138565A JP 2007138565 A JP2007138565 A JP 2007138565A JP 2007313640 A5 JP2007313640 A5 JP 2007313640A5
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polymer
polishing
polymer matrix
polishing pad
bulk
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JP5346445B2 (ja
JP2007313640A (ja
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重量%未反応NCOを制御することに加えて、硬化剤及びプレポリマー反応生成物は、通常、未反応NCOに対するOH又はNH 2 の化学量論比90125%、好ましくは97125%を有し、もっとも好ましくは、未反応NCOに対するOH又はNH 2 の化学量論比100120%を有する。たとえば、101〜115%の範囲の未反応NCOで形成されたポリウレタンが優れた結果を提供するものと思われる。この化学量論比は、原料の化学量論レベルを提供することによって直接的に達成することもできるし、意図的又は外来性水分への暴露によってNCOの一部を水と反応させることによって間接的に達成することもできる。

Claims (10)

  1. 半導体、光学及び磁性基材の少なくとも一つを平坦化するのに適した研磨パッドであって、ポリマーマトリックスを含み、前記ポリマーマトリックスが上研磨面を有し、前記上研磨面が、ポリマー研磨アスペリティを有するか、砥粒でコンディショニングされるとポリマー研磨アスペリティを形成し、前記ポリマー研磨アスペリティが、前記ポリマーマトリックスから延び、研磨中に基材と接することができる前記上研磨面の部分であり、前記研磨パッドが、前記上研磨面の摩耗又はコンディショニングによって前記ポリマーマトリックスからさらなるポリマー研磨アスペリティを形成し、前記ポリマー研磨アスペリティが、少なくとも6,500psi(44.8MPa)のバルク極限引張り強さ及び少なくとも250lb/in(4.5×103g/mm)のバルク引裂き強さを有するポリマーマトリックスからのものである研磨パッド。
  2. 前記バルク引裂き強さが250〜750lb/in(4.5×103〜1.34×103g/mm)である、請求項1記載の研磨パッド。
  3. 前記ポリマーマトリックスが、二官能性又は多官能性イソシアネートから誘導されるポリマーを含み、前記ポリマーが、ポリエーテルウレア、ポリイソシアヌレート、ポリウレタン、ポリウレア、ポリウレタンウレア、それらのコポリマー及びそれらの混合物から選択される少なくとも一つを含む、請求項1記載の研磨パッド。
  4. 前記ポリマーマトリックスが、硬化剤とイソシアネート終端化ポリマーとの反応生成物からのものであり、前記硬化剤が、前記イソシアネート終端化反応生成物を硬化させる硬化剤アミンを含み、前記イソシアネート終端化反応生成物が、90対125%のNH2対NCO化学量論比を有する、請求項3記載の研磨パッド。
  5. 前記バルク引張り強さが6,500〜14,000psi(44.8〜96.5MPa)であり、前記ポリマーマトリックスが、少なくとも200%のバルク破断伸びを有する、請求項1記載の研磨パッド。
  6. 半導体、光学及び磁性基材の少なくとも一つを平坦化するのに適した研磨パッドであって、ポリマーマトリックスを含み、前記ポリマーマトリックスが上研磨面を有し、前記上研磨面が、ポリマー研磨アスペリティを有するか、砥粒でコンディショニングされるとポリマー研磨アスペリティを形成し、前記ポリマー研磨アスペリティが、前記ポリマーマトリックスから延び、研磨中に基材と接することができる前記上研磨面の部分であり、前記ポリマーマトリックスが、二官能性又は多官能性イソシアネートから誘導されるポリマーを含み、前記ポリマーが、ポリエーテルウレア、ポリイソシアヌレート、ポリウレタン、ポリウレア、ポリウレタンウレア、それらのコポリマー及びそれらの混合物から選択される少なくとも一つを含み、前記ポリマーマトリックスが、6,500〜14,000psi(44.8〜96.5MPa)のバルク極限引張り強さ及び250〜750lb/in(4.5×103〜1.34×103g/mm)のバルク引裂き強さを有するものである研磨パッド。
  7. 前記バルク引裂き強さが275〜700lb/in(4.9×103〜1.25×103g/mm)である、請求項6記載の研磨パッド。
  8. 前記ポリマーマトリックスが、硬化剤とイソシアネート終端化ポリマーとの反応生成物からのものであり、前記硬化剤が、前記イソシアネート終端化反応生成物を硬化させる硬化剤アミンを含み、前記イソシアネート終端化反応生成物が、100超対125%のNH2対NCO化学量論比を有する、請求項6記載の研磨パッド。
  9. 前記バルク極限引張り強さが6,750〜10,000psi(46.5〜68.9MPa)であり、前記ポリマーマトリックスが、少なくとも200%のバルク破断伸びを有する、請求項6記載の研磨パッド。
  10. 前記ポリマーマトリックス内で25〜65容量%の気孔率及び2〜50μmの平均孔径を含む、請求項6記載の研磨パッド。
JP2007138565A 2006-05-25 2007-05-25 ケミカルメカニカル研磨パッド Active JP5346445B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/442,076 2006-05-25
US11/442,076 US7169030B1 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad

Publications (3)

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JP2007313640A JP2007313640A (ja) 2007-12-06
JP2007313640A5 true JP2007313640A5 (ja) 2012-12-06
JP5346445B2 JP5346445B2 (ja) 2013-11-20

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US (1) US7169030B1 (ja)
JP (1) JP5346445B2 (ja)
KR (1) KR101360654B1 (ja)
CN (1) CN100540224C (ja)
DE (1) DE102007024460B4 (ja)
FR (1) FR2901498B1 (ja)
TW (1) TWI402334B (ja)

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