FR2901498B1 - Feutre de polissage mecano-chimique - Google Patents

Feutre de polissage mecano-chimique

Info

Publication number
FR2901498B1
FR2901498B1 FR0755265A FR0755265A FR2901498B1 FR 2901498 B1 FR2901498 B1 FR 2901498B1 FR 0755265 A FR0755265 A FR 0755265A FR 0755265 A FR0755265 A FR 0755265A FR 2901498 B1 FR2901498 B1 FR 2901498B1
Authority
FR
France
Prior art keywords
mecano
chemical polishing
polishing felt
felt
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0755265A
Other languages
English (en)
Other versions
FR2901498A1 (fr
Inventor
Mary Jo Kulp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2901498A1 publication Critical patent/FR2901498A1/fr
Application granted granted Critical
Publication of FR2901498B1 publication Critical patent/FR2901498B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
FR0755265A 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique Active FR2901498B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/442,076 US7169030B1 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad

Publications (2)

Publication Number Publication Date
FR2901498A1 FR2901498A1 (fr) 2007-11-30
FR2901498B1 true FR2901498B1 (fr) 2010-09-03

Family

ID=37681809

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0755265A Active FR2901498B1 (fr) 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique

Country Status (7)

Country Link
US (1) US7169030B1 (fr)
JP (1) JP5346445B2 (fr)
KR (1) KR101360654B1 (fr)
CN (1) CN100540224C (fr)
DE (1) DE102007024460B4 (fr)
FR (1) FR2901498B1 (fr)
TW (1) TWI402334B (fr)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US8479523B2 (en) * 2006-05-26 2013-07-09 General Electric Company Method for gas turbine operation during under-frequency operation through use of air extraction
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
US20100035529A1 (en) 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
JP5323447B2 (ja) * 2008-10-29 2013-10-23 大和化成工業株式会社 研磨砥石
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
SG176151A1 (en) * 2009-05-27 2011-12-29 Rogers Corp Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
US8697239B2 (en) 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
JP5606083B2 (ja) * 2010-01-29 2014-10-15 日本発條株式会社 独泡ウレタンシート及びその製造方法
MY164897A (en) * 2010-10-26 2018-01-30 Rohm & Haas Elect Materials Cmp Holdings Inc Polishing pad and method for producing same
US9079288B2 (en) * 2010-10-26 2015-07-14 Toyo Tire & Rubber Co., Ltd. Polishing pad and method for producing same
US8512427B2 (en) 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
US20150059254A1 (en) * 2013-09-04 2015-03-05 Dow Global Technologies Llc Polyurethane polishing pad
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US20150375361A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US9481070B2 (en) * 2014-12-19 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-stability polyurethane polishing pad
DE102015220090B4 (de) * 2015-01-14 2021-02-18 Siltronic Ag Verfahren zum Abrichten von Poliertüchern
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
WO2017074773A1 (fr) 2015-10-30 2017-05-04 Applied Materials, Inc. Appareil et procédé de formation d'article de polissage ayant un potentiel zêta souhaité
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10086494B2 (en) 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
US10208154B2 (en) 2016-11-30 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Formulations for chemical mechanical polishing pads and CMP pads made therewith
JP7112417B2 (ja) 2017-03-03 2022-08-03 ダウ グローバル テクノロジーズ エルエルシー 高ボール反発性を有する低密度ポリウレタンエラストマーフォーム
CN106891246B (zh) * 2017-03-30 2019-05-07 湖北鼎龙控股股份有限公司 一种用于半导体、光学材料和磁性材料表面平坦化的化学机械抛光垫
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
KR101835087B1 (ko) * 2017-05-29 2018-03-06 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법
US10391606B2 (en) 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (fr) 2017-08-07 2019-02-14 Applied Materials, Inc. Tampons à polir à distribution abrasive et leurs procédés de fabrication
KR101949905B1 (ko) * 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
KR102338854B1 (ko) 2017-08-31 2021-12-15 후베이 딩후이 마이크로일렉트로닉스 머티리얼즈 코., 엘티디 폴리우레탄 연마층, 연마층을 포함하는 연마 패드, 연마층의 제조 방법 및 재료 평탄화 방법
US10464187B2 (en) 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
KR102054309B1 (ko) * 2018-04-17 2019-12-10 에스케이씨 주식회사 다공성 연마 패드 및 이의 제조방법
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102277418B1 (ko) * 2019-05-21 2021-07-14 에스케이씨솔믹스 주식회사 가교 밀도가 향상된 연마패드 및 이의 제조방법
US11638978B2 (en) * 2019-06-10 2023-05-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-debris fluopolymer composite CMP polishing pad
CN110170917A (zh) * 2019-07-10 2019-08-27 蓝思科技（长沙）有限公司 一种抛光衬垫及其制备方法
CN110528287B (zh) * 2019-08-08 2022-03-08 安徽安利材料科技股份有限公司 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法
KR102177748B1 (ko) * 2019-11-28 2020-11-11 에스케이씨 주식회사 다공성 연마 패드 및 이의 제조방법
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102572960B1 (ko) * 2021-06-10 2023-09-01 에프엔에스테크 주식회사 복수의 패턴 구조체를 포함하는 연마 패드

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577386A (en) * 1968-10-07 1971-05-04 Minnesota Mining & Mfg Product and process
JPS5480397A (en) 1977-12-09 1979-06-27 Ihara Chem Ind Co Ltd Production of polyurethane elastomer
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5814409A (en) 1994-05-10 1998-09-29 Asahi Kasei Kogyo Kabushiki Kaisha Expanded fluorine type resin products and a preparation process thereof
US6648733B2 (en) * 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6682402B1 (en) * 1997-04-04 2004-01-27 Rodel Holdings, Inc. Polishing pads and methods relating thereto
EP1015176B1 (fr) * 1997-04-04 2003-03-12 Rodel Holdings, Inc. Tampons a polir ameliores et procedes y relatifs
US6022268A (en) 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6514301B1 (en) 1998-06-02 2003-02-04 Peripheral Products Inc. Foam semiconductor polishing belts and pads
US7718102B2 (en) 1998-06-02 2010-05-18 Praxair S.T. Technology, Inc. Froth and method of producing froth
US6022903A (en) 1998-07-09 2000-02-08 Arco Chemical Technology L.P. Permanent gas blown microcellular polyurethane elastomers
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods
US6267644B1 (en) 1998-11-06 2001-07-31 Beaver Creek Concepts Inc Fixed abrasive finishing element having aids finishing method
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6454634B1 (en) 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
US7192340B2 (en) * 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
JP4763161B2 (ja) * 2001-06-19 2011-08-31 善二郎 小柳津 研磨パッド又はバフ材、これに用いる研磨用ポリ尿素弾性硬質フォーム及びその製造方法
JP4313761B2 (ja) * 2002-11-18 2009-08-12 ドン ソン エイ アンド ティ カンパニー リミテッド 微細気孔が含まれたポリウレタン発泡体の製造方法及びそれから製造された研磨パッド
JP2004303280A (ja) 2003-03-28 2004-10-28 Hoya Corp 情報記録媒体用ガラス基板の製造方法
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad

Also Published As

Publication number Publication date
TWI402334B (zh) 2013-07-21
CN101077569A (zh) 2007-11-28
DE102007024460A1 (de) 2007-11-29
CN100540224C (zh) 2009-09-16
TW200813199A (en) 2008-03-16
JP5346445B2 (ja) 2013-11-20
KR101360654B1 (ko) 2014-02-07
KR20070114018A (ko) 2007-11-29
DE102007024460B4 (de) 2021-12-16
JP2007313640A (ja) 2007-12-06
FR2901498A1 (fr) 2007-11-30
US7169030B1 (en) 2007-01-30

Similar Documents

Publication Publication Date Title
FR2901498B1 (fr) Feutre de polissage mecano-chimique
DE602008002445D1 (de) Poliervorrichtung
DE602008001138D1 (de) Polierkissen
CR10841A (es) Imidazotriazinas imidazopirimidinas inhibidores de cinasa
DE602007013342D1 (de) Saugglockenvorrichtung
DE602006021235D1 (de) Kristallglasgegenstand
AT504580A3 (de) Scan-einrichtung
ATE546437T1 (de) Aminomethyl-4-imidazole
DE502007000218D1 (de) nsetzungen
DE602007000850D1 (de) Windschutzscheibe
ATE534010T1 (de) Zielfernrohr
DE602007000759D1 (de) Schleifmaschine
DE502007000361D1 (de) Stanznieteinheit
DE102006045567A8 (de) Crimpstabilisierung
ITMO20050254A1 (it) Gruppo abrasivo
DE602007006598D1 (de) Doppeloberflächenpoliervorrichtung
ATE536943T1 (de) Oberflächenmodifikation
DE112007003147A5 (de) Rohr-Biegevorrichtung
DE112007000530A5 (de) Kopfplatte
DE112007001125A5 (de) Käfigmutter
FI20055407A (fi) Kalanteri
FI7261U1 (fi) Hiomakone
DE602006001471D1 (de) Poliervorrichtung
DE602006001415D1 (de) Poliervorrichtung
FR2900477B3 (fr) Lunettes

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18