DE602008002445D1 - Poliervorrichtung - Google Patents

Poliervorrichtung

Info

Publication number
DE602008002445D1
DE602008002445D1 DE602008002445T DE602008002445T DE602008002445D1 DE 602008002445 D1 DE602008002445 D1 DE 602008002445D1 DE 602008002445 T DE602008002445 T DE 602008002445T DE 602008002445 T DE602008002445 T DE 602008002445T DE 602008002445 D1 DE602008002445 D1 DE 602008002445D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008002445T
Other languages
English (en)
Inventor
Kenichiro Saito
Osamu Nabeya
Kimihide Nagata
Tetsuji Togawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE602008002445D1 publication Critical patent/DE602008002445D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE602008002445T 2007-01-30 2008-01-29 Poliervorrichtung Active DE602008002445D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007019634 2007-01-30

Publications (1)

Publication Number Publication Date
DE602008002445D1 true DE602008002445D1 (de) 2010-10-28

Family

ID=39323669

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008002445T Active DE602008002445D1 (de) 2007-01-30 2008-01-29 Poliervorrichtung

Country Status (7)

Country Link
US (1) US8152594B2 (de)
EP (1) EP1952945B1 (de)
JP (1) JP5301840B2 (de)
KR (1) KR101095605B1 (de)
CN (1) CN101254586B (de)
DE (1) DE602008002445D1 (de)
TW (1) TWI451488B (de)

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CN104044057B (zh) * 2004-11-01 2017-05-17 株式会社荏原制作所 抛光设备
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US20100130107A1 (en) * 2008-11-24 2010-05-27 Applied Materials, Inc. Method and apparatus for linear pad conditioning
JP5306065B2 (ja) * 2009-06-04 2013-10-02 株式会社荏原製作所 ドレッシング装置およびドレッシング方法
KR20100134433A (ko) * 2009-06-15 2010-12-23 엘지전자 주식회사 기능 제어부를 갖는 이동 단말기
TWI381904B (zh) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
US20170066104A9 (en) * 2009-12-08 2017-03-09 Allison Transmission Inc. Method for Detecting And/Or Preventing Grind Burn
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
US8545289B2 (en) * 2011-04-13 2013-10-01 Nanya Technology Corporation Distance monitoring device
JP5896625B2 (ja) 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
CN103029039B (zh) * 2011-09-30 2016-01-06 鸿富锦精密工业（深圳）有限公司 压力检测装置及应用该压力检测装置的打磨设备
CN103084969B (zh) * 2011-11-01 2015-09-09 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨设备
CN103182681A (zh) * 2011-12-28 2013-07-03 青岛嘉星晶电科技股份有限公司 一种双面研磨机研磨盘修整装置及其修整方法
CN103381575A (zh) * 2012-05-03 2013-11-06 旺宏电子股份有限公司 平坦化修正臂、应用其的平坦化系统及平坦化方法
CN102672594A (zh) * 2012-05-04 2012-09-19 上海华力微电子有限公司 一种精确控制cmp研磨盘温度的装置
US10702972B2 (en) 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
JP5927083B2 (ja) 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
JP5919157B2 (ja) * 2012-10-01 2016-05-18 株式会社荏原製作所 ドレッサー
CN102941533B (zh) * 2012-11-09 2016-08-03 佛山市业鹏机械有限公司 水钻抛光盘磨耗自动补偿检测装置
JP5973883B2 (ja) * 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
JP6239354B2 (ja) * 2012-12-04 2017-11-29 不二越機械工業株式会社 ウェーハ研磨装置
US20140224766A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Groove Design for Retaining Ring
JP6113552B2 (ja) * 2013-03-29 2017-04-12 株式会社荏原製作所 研磨装置及び摩耗検知方法
JP6161999B2 (ja) 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
CN103506956B (zh) * 2013-09-26 2016-04-27 中国电子科技集团公司第四十五研究所 一种用于晶圆化学机械平坦化设备中的抛光垫修整器
JP6313611B2 (ja) * 2014-02-28 2018-04-18 株式会社荏原製作所 研磨装置
CN104002388B (zh) * 2014-05-22 2016-03-30 袁子科 一种聚能式瓷砖刮平机
JP6327958B2 (ja) * 2014-06-03 2018-05-23 株式会社荏原製作所 研磨装置
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
JP6093741B2 (ja) * 2014-10-21 2017-03-08 信越半導体株式会社 研磨装置及びウェーハの研磨方法
JP2017148931A (ja) * 2016-02-19 2017-08-31 株式会社荏原製作所 研磨装置および研磨方法
JP6509766B2 (ja) * 2016-03-08 2019-05-08 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
TWI821887B (zh) * 2016-11-29 2023-11-11 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體
JP6823541B2 (ja) 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
JP7000054B2 (ja) * 2017-07-12 2022-01-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11267099B2 (en) * 2017-09-27 2022-03-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization membrane
CN107650009B (zh) * 2017-11-20 2023-08-25 山东省科学院新材料研究所 一种新型晶片研磨抛光机
CN107855900B (zh) * 2017-12-27 2024-01-16 中原工学院 一种两工位聚晶金刚石复合片类抛光机
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
CN110009333B (zh) 2018-10-31 2020-10-27 创新先进技术有限公司 一种生成目标合同的方法及终端设备
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
TWI695754B (zh) * 2019-08-13 2020-06-11 大量科技股份有限公司 拋光墊即時整修方法
CN110977688B (zh) * 2019-12-12 2021-09-14 王远志 一种植保无人机固定翼生产加工用打磨装置
CN111085931A (zh) * 2019-12-31 2020-05-01 浙江芯晖装备技术有限公司 一种抛光头驱动装置及抛光设备
CN113649477B (zh) * 2021-08-31 2023-09-26 浙江安胜科技股份有限公司 一种同步式快速换装的不锈钢容器成型模具
US20230390882A1 (en) * 2022-06-06 2023-12-07 Taiwan Semiconductor Manufacturing Company, Ltd. System, control method and apparatus for chemical mechanical polishing
CN115533753B (zh) * 2022-10-09 2024-06-14 湘潭大学 抛光装置和抛光装置在线修整方法

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Also Published As

Publication number Publication date
US8152594B2 (en) 2012-04-10
JP5301840B2 (ja) 2013-09-25
KR101095605B1 (ko) 2011-12-19
CN101254586B (zh) 2014-03-12
CN101254586A (zh) 2008-09-03
TW200915407A (en) 2009-04-01
KR20080071526A (ko) 2008-08-04
US20080287043A1 (en) 2008-11-20
EP1952945A3 (de) 2008-08-27
EP1952945B1 (de) 2010-09-15
EP1952945A2 (de) 2008-08-06
TWI451488B (zh) 2014-09-01
JP2008207320A (ja) 2008-09-11

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