DE602007006598D1 - Doppeloberflächenpoliervorrichtung - Google Patents

Doppeloberflächenpoliervorrichtung

Info

Publication number
DE602007006598D1
DE602007006598D1 DE602007006598T DE602007006598T DE602007006598D1 DE 602007006598 D1 DE602007006598 D1 DE 602007006598D1 DE 602007006598 T DE602007006598 T DE 602007006598T DE 602007006598 T DE602007006598 T DE 602007006598T DE 602007006598 D1 DE602007006598 D1 DE 602007006598D1
Authority
DE
Germany
Prior art keywords
polishing apparatus
surface polishing
double surface
double
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007006598T
Other languages
English (en)
Inventor
Satoki Kanda
Harumichi Koyama
Masahiro Takeuchi
Yoichi Morozumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38738958&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE602007006598(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of DE602007006598D1 publication Critical patent/DE602007006598D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE602007006598T 2006-09-01 2007-08-20 Doppeloberflächenpoliervorrichtung Active DE602007006598D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006237830A JP5128793B2 (ja) 2006-09-01 2006-09-01 両面研磨装置および両面研磨方法

Publications (1)

Publication Number Publication Date
DE602007006598D1 true DE602007006598D1 (de) 2010-07-01

Family

ID=38738958

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007006598T Active DE602007006598D1 (de) 2006-09-01 2007-08-20 Doppeloberflächenpoliervorrichtung

Country Status (4)

Country Link
US (1) US7485029B2 (de)
EP (1) EP1894675B2 (de)
JP (1) JP5128793B2 (de)
DE (1) DE602007006598D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007021680A (ja) * 2005-07-19 2007-02-01 Shin Etsu Handotai Co Ltd ウエーハの両面研磨方法
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
JP5505713B2 (ja) * 2010-04-26 2014-05-28 株式会社Ｓｕｍｃｏ 研磨液分配装置及びこれを備えた研磨装置
JP5671735B2 (ja) * 2011-01-18 2015-02-18 不二越機械工業株式会社 両面研磨装置
JP5748717B2 (ja) 2012-09-06 2015-07-15 信越半導体株式会社 両面研磨方法
KR101458035B1 (ko) * 2013-02-25 2014-11-04 주식회사 엘지실트론 웨이퍼의 가공 장치 및 가공 방법
CN103506940B (zh) * 2013-09-26 2017-01-04 中国电子科技集团公司第四十五研究所 化学机械抛光晶圆承载器
KR101660898B1 (ko) * 2014-08-13 2016-09-28 주식회사 엘지실트론 슬러리 공급 장치 및 이를 포함하는 연마 장치
CN108857650A (zh) * 2018-06-29 2018-11-23 聂超 一种注塑圆筒件的打磨装置及其使用方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595529A (en) * 1994-03-28 1997-01-21 Speedfam Corporation Dual column abrading machine
US6045437A (en) 1996-03-01 2000-04-04 Tan Thap, Inc. Method and apparatus for polishing a hard disk substrate
US5997390A (en) * 1998-02-02 1999-12-07 Speedfam Corporation Polishing apparatus with improved alignment of polishing plates
JPH11262862A (ja) 1998-03-17 1999-09-28 Speedfam Co Ltd 両面研磨装置及びスラリー供給方法
JP4308344B2 (ja) * 1998-07-24 2009-08-05 不二越機械工業株式会社 両面研磨装置
JP2000271857A (ja) * 1999-03-25 2000-10-03 Super Silicon Kenkyusho:Kk 大口径ウェーハの両面加工方法及び装置
JP2000280171A (ja) * 1999-03-31 2000-10-10 Nippon Light Metal Co Ltd 磁気ディスク用アルミニウム基板の製造方法および研磨装置
JP4421100B2 (ja) 2000-12-21 2010-02-24 不二越機械工業株式会社 シリコンウェーハの研磨砥粒液の温度調整方法
JP2004098286A (ja) * 2003-11-07 2004-04-02 Matsushita Electric Ind Co Ltd スラリー供給装置

Also Published As

Publication number Publication date
JP2008055577A (ja) 2008-03-13
EP1894675B1 (de) 2010-05-19
JP5128793B2 (ja) 2013-01-23
EP1894675A1 (de) 2008-03-05
US20080057831A1 (en) 2008-03-06
EP1894675B2 (de) 2013-10-23
US7485029B2 (en) 2009-02-03

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Legal Events

Date Code Title Description
8363 Opposition against the patent