JP2007291375A5 - - Google Patents
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- Publication number
- JP2007291375A5 JP2007291375A5 JP2007090758A JP2007090758A JP2007291375A5 JP 2007291375 A5 JP2007291375 A5 JP 2007291375A5 JP 2007090758 A JP2007090758 A JP 2007090758A JP 2007090758 A JP2007090758 A JP 2007090758A JP 2007291375 A5 JP2007291375 A5 JP 2007291375A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- group
- double bond
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 claims description 79
- 229920005989 resin Polymers 0.000 claims description 63
- 239000011347 resin Substances 0.000 claims description 63
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 12
- -1 methacryloyl group Chemical group 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000002313 adhesive film Substances 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 238000002788 crimping Methods 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000009736 wetting Methods 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 5
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 150000002989 phenols Chemical class 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007090758A JP2007291375A (ja) | 2004-05-31 | 2007-03-30 | 樹脂組成物、接着フィルムおよび樹脂ワニス |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004162016 | 2004-05-31 | ||
| JP2007090758A JP2007291375A (ja) | 2004-05-31 | 2007-03-30 | 樹脂組成物、接着フィルムおよび樹脂ワニス |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005160356A Division JP4015668B2 (ja) | 2004-05-31 | 2005-05-31 | 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007116025A Division JP2007291394A (ja) | 2004-05-31 | 2007-04-25 | 樹脂組成物、接着フィルムおよび樹脂ワニス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007291375A JP2007291375A (ja) | 2007-11-08 |
| JP2007291375A5 true JP2007291375A5 (enExample) | 2008-05-29 |
Family
ID=38762296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007090758A Pending JP2007291375A (ja) | 2004-05-31 | 2007-03-30 | 樹脂組成物、接着フィルムおよび樹脂ワニス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007291375A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009242508A (ja) * | 2008-03-31 | 2009-10-22 | Asahi Kasei E-Materials Corp | 接着剤及び接合体 |
| JP5428423B2 (ja) * | 2008-04-21 | 2014-02-26 | 日立化成株式会社 | 半導体装置及びフィルム状接着剤 |
| JP5732815B2 (ja) | 2009-10-30 | 2015-06-10 | 日立化成株式会社 | 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。 |
| JP2018028062A (ja) * | 2016-08-10 | 2018-02-22 | Jnc株式会社 | 熱硬化性組成物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09100450A (ja) * | 1995-10-03 | 1997-04-15 | Lintec Corp | 粘接着テープおよびその使用方法 |
| JP4570259B2 (ja) * | 2001-01-31 | 2010-10-27 | 住友ベークライト株式会社 | 感光性フラックス、これを用いた半導体チップ搭載用基板、半導体パッケージ、及び、プリント配線板 |
| JP3893303B2 (ja) * | 2002-03-29 | 2007-03-14 | 住友ベークライト株式会社 | 半導体パッケージの製造方法 |
| JP2003309131A (ja) * | 2002-04-12 | 2003-10-31 | Sumitomo Bakelite Co Ltd | 半導体パッケージの製造方法 |
| JP4015668B2 (ja) * | 2004-05-31 | 2007-11-28 | 住友ベークライト株式会社 | 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス |
-
2007
- 2007-03-30 JP JP2007090758A patent/JP2007291375A/ja active Pending
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