JP2011509340A5 - - Google Patents

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Publication number
JP2011509340A5
JP2011509340A5 JP2010542331A JP2010542331A JP2011509340A5 JP 2011509340 A5 JP2011509340 A5 JP 2011509340A5 JP 2010542331 A JP2010542331 A JP 2010542331A JP 2010542331 A JP2010542331 A JP 2010542331A JP 2011509340 A5 JP2011509340 A5 JP 2011509340A5
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JP
Japan
Prior art keywords
composition according
composition
bisphenol
imidazole
deblocking agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010542331A
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English (en)
Japanese (ja)
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JP5661472B2 (ja
JP2011509340A (ja
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Publication date
Priority claimed from US12/008,375 external-priority patent/US8084553B2/en
Application filed filed Critical
Publication of JP2011509340A publication Critical patent/JP2011509340A/ja
Publication of JP2011509340A5 publication Critical patent/JP2011509340A5/ja
Application granted granted Critical
Publication of JP5661472B2 publication Critical patent/JP5661472B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010542331A 2008-01-10 2009-01-08 硬化型接着組成物、接着方法およびその応用 Expired - Fee Related JP5661472B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/008,375 2008-01-10
US12/008,375 US8084553B2 (en) 2008-01-10 2008-01-10 Curable adhesive compositions, process, and applications
PCT/US2009/030384 WO2009089314A1 (en) 2008-01-10 2009-01-08 Curable adhesive compositions, process, and applications

Publications (3)

Publication Number Publication Date
JP2011509340A JP2011509340A (ja) 2011-03-24
JP2011509340A5 true JP2011509340A5 (enExample) 2011-05-06
JP5661472B2 JP5661472B2 (ja) 2015-01-28

Family

ID=40850866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010542331A Expired - Fee Related JP5661472B2 (ja) 2008-01-10 2009-01-08 硬化型接着組成物、接着方法およびその応用

Country Status (6)

Country Link
US (2) US8084553B2 (enExample)
JP (1) JP5661472B2 (enExample)
KR (1) KR101288321B1 (enExample)
CN (1) CN101970224B (enExample)
TW (1) TWI382999B (enExample)
WO (1) WO2009089314A1 (enExample)

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US8044154B2 (en) * 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
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US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
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US9352539B2 (en) 2013-03-12 2016-05-31 Trillion Science, Inc. Microcavity carrier with image enhancement for laser ablation
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CN104312471A (zh) * 2014-11-10 2015-01-28 深圳市飞世尔实业有限公司 一种含苯并恶嗪的异方性导电膜及其制备方法
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CN108047647B (zh) * 2017-12-27 2020-07-07 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料、层压板、覆金属箔层压板和印刷电路板
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