KR101288321B1 - 경화성 접착제 조성물, 방법, 및 용도 - Google Patents

경화성 접착제 조성물, 방법, 및 용도 Download PDF

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Publication number
KR101288321B1
KR101288321B1 KR1020107015116A KR20107015116A KR101288321B1 KR 101288321 B1 KR101288321 B1 KR 101288321B1 KR 1020107015116 A KR1020107015116 A KR 1020107015116A KR 20107015116 A KR20107015116 A KR 20107015116A KR 101288321 B1 KR101288321 B1 KR 101288321B1
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South Korea
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composition
weight
phenols
epoxy
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Expired - Fee Related
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KR1020107015116A
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English (en)
Korean (ko)
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KR20100124704A (ko
Inventor
룽-창 량
존 제이. 맥나마라
위룽 잉
충-전 허우
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트릴리온 사이언스 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
KR1020107015116A 2008-01-10 2009-01-08 경화성 접착제 조성물, 방법, 및 용도 Expired - Fee Related KR101288321B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/008,375 2008-01-10
US12/008,375 US8084553B2 (en) 2008-01-10 2008-01-10 Curable adhesive compositions, process, and applications
PCT/US2009/030384 WO2009089314A1 (en) 2008-01-10 2009-01-08 Curable adhesive compositions, process, and applications

Publications (2)

Publication Number Publication Date
KR20100124704A KR20100124704A (ko) 2010-11-29
KR101288321B1 true KR101288321B1 (ko) 2013-07-23

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KR1020107015116A Expired - Fee Related KR101288321B1 (ko) 2008-01-10 2009-01-08 경화성 접착제 조성물, 방법, 및 용도

Country Status (6)

Country Link
US (2) US8084553B2 (enExample)
JP (1) JP5661472B2 (enExample)
KR (1) KR101288321B1 (enExample)
CN (1) CN101970224B (enExample)
TW (1) TWI382999B (enExample)
WO (1) WO2009089314A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US8067484B2 (en) * 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
US8044154B2 (en) * 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
JP5698940B2 (ja) * 2010-09-08 2015-04-08 積水化学工業株式会社 電子部品用接着剤及び半導体装置の製造方法
JP6109144B2 (ja) * 2011-03-28 2017-04-05 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物、物品、硬化方法及びタックフリー反応生成物
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
JP2013253195A (ja) * 2012-06-08 2013-12-19 Namics Corp エポキシ樹脂組成物
US9352539B2 (en) 2013-03-12 2016-05-31 Trillion Science, Inc. Microcavity carrier with image enhancement for laser ablation
GB201319363D0 (en) 2013-11-01 2013-12-18 Uni I Oslo Compounds
US9540539B2 (en) * 2014-05-27 2017-01-10 Infineon Technologies Ag Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
KR20170033886A (ko) 2014-07-22 2017-03-27 사빅 글로벌 테크놀러지스 비.브이. 고온 모노머 및 이들의 용도의 방법
CN104312471A (zh) * 2014-11-10 2015-01-28 深圳市飞世尔实业有限公司 一种含苯并恶嗪的异方性导电膜及其制备方法
BR112017018698A2 (pt) * 2015-03-04 2018-04-17 Huntsman Advanced Mat Americas Llc ?composição livre de ácido de enxofre orgânico, artigo curado, uso de uma composição livre de ácido de enxofre orgânico, e, método para produzir um artigo compósito?.
CN108047647B (zh) * 2017-12-27 2020-07-07 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料、层压板、覆金属箔层压板和印刷电路板
JP7261654B2 (ja) * 2018-05-24 2023-04-20 住友化学株式会社 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法
KR102633142B1 (ko) 2019-08-26 2024-02-02 삼성전자주식회사 반도체 패키지
EP4026630A4 (en) * 2019-09-02 2023-08-23 Osaka Soda Co., Ltd. Silver particles
CN117534682A (zh) * 2023-11-09 2024-02-09 江苏大学 一种具有多苯并二噁茂结构的单官能度生物基苯并噁嗪单体及树脂
CN119552132A (zh) * 2024-11-04 2025-03-04 北玻院(滕州)复合材料有限公司 一种可降解环氧树脂单体、环氧树脂、复合材料及其制备方法和降解方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020082322A1 (en) * 2000-09-21 2002-06-27 Kuen-Yuan Hwang Flame retarded epoxy resin composition

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2003A (en) * 1841-03-12 Improvement in horizontal windivhlls
US2795572A (en) * 1957-06-11 Their polymers
NL186530B (nl) * 1953-06-26 1900-01-01 Hilti Ag Een door een verbrandingsmotor aandrijfbare boor- en beitelhamer.
US4123450A (en) * 1977-09-22 1978-10-31 Fmc Corporation Process for preparing alkyl isocyanates
JPS61171726A (ja) * 1985-01-25 1986-08-02 Hitachi Chem Co Ltd 塗料用組成物
GR870442B (en) 1986-03-21 1987-07-20 Union Carbide Corp Process for preparing methyl isocyanate
US4833226A (en) * 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
US5212044A (en) * 1988-09-08 1993-05-18 The Mead Corporation Photoresist composition including polyphenol and sensitizer
US5219956A (en) * 1989-02-13 1993-06-15 Asahi Kasei Kogyo Kabushiki Kaisha Method for hardening a one-package epoxy formulation including partial curing
US5409764A (en) * 1990-07-17 1995-04-25 Toyo Ink Manufacturing Co., Ltd. Curable adhesive composition and sheet thereof
US5543516A (en) * 1994-05-18 1996-08-06 Edison Polymer Innovation Corporation Process for preparation of benzoxazine compounds in solventless systems
JP3045274B2 (ja) * 1995-06-15 2000-05-29 東京応化工業株式会社 ポジ型化学増幅型レジスト組成物
US5728773A (en) * 1997-02-21 1998-03-17 Minnesota Mining And Manufacturing Company Fluoroelastomer composition with organo-onium and blocked-carbonate compounds
US6225440B1 (en) * 1998-06-26 2001-05-01 Edison Polymer Innovation Corporation Cationic ring-opening polymerization of benzoxazines
JP4023931B2 (ja) * 1998-11-09 2007-12-19 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． ポジ型感放射線性樹脂組成物
US6207786B1 (en) * 1998-11-10 2001-03-27 Edison Polymer Innovation Corporation Ternary systems of benzoxazine, epoxy, and phenolic resins
EP1263842A2 (en) * 2000-02-09 2002-12-11 Ciba SC Holding AG Hyperbranched amphiphilic polymeric additives and polymer compositions with increased surface energy
US6437026B1 (en) * 2001-01-05 2002-08-20 Cookson Singapore Pte Ltd. Hardener for epoxy molding compounds
US6627685B2 (en) * 2001-08-14 2003-09-30 Ellis Breskman Lightfast epoxy resin
US6743852B2 (en) * 2001-11-13 2004-06-01 Henkel Corporation Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof
US6899960B2 (en) * 2002-03-22 2005-05-31 Intel Corporation Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
US6918984B2 (en) * 2002-06-24 2005-07-19 Loctite (R&D) Limited Photocurable adhesive compositions, reaction products of which have low halide ion content
CN100357336C (zh) * 2002-10-25 2007-12-26 旭化成化学株式会社 胶囊型硬化剂及其组合物
TW200413467A (en) * 2003-01-16 2004-08-01 Chang Chun Plastics Co Ltd Resin composition without containing halogen
WO2005035617A1 (ja) * 2003-10-10 2005-04-21 Asahi Kasei Chemicals Corporation 潜在性硬化剤および組成物
EP1616892A1 (en) * 2004-07-13 2006-01-18 Henkel Kommanditgesellschaft auf Aktien Curable compositions with an improved adhesion performance
US20080119580A1 (en) * 2006-11-17 2008-05-22 Menovcik Gregory G Thermosetting coating compositions with three or more cure mechanisms

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020082322A1 (en) * 2000-09-21 2002-06-27 Kuen-Yuan Hwang Flame retarded epoxy resin composition

Also Published As

Publication number Publication date
KR20100124704A (ko) 2010-11-29
US20120029116A1 (en) 2012-02-02
CN101970224B (zh) 2014-11-12
US8084553B2 (en) 2011-12-27
TW200936629A (en) 2009-09-01
TWI382999B (zh) 2013-01-21
CN101970224A (zh) 2011-02-09
JP5661472B2 (ja) 2015-01-28
HK1152681A1 (en) 2012-03-09
US20090181165A1 (en) 2009-07-16
WO2009089314A1 (en) 2009-07-16
JP2011509340A (ja) 2011-03-24

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