CN101970224B - 可固化粘合剂组合物、方法及应用 - Google Patents

可固化粘合剂组合物、方法及应用 Download PDF

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Publication number
CN101970224B
CN101970224B CN200980102010.3A CN200980102010A CN101970224B CN 101970224 B CN101970224 B CN 101970224B CN 200980102010 A CN200980102010 A CN 200980102010A CN 101970224 B CN101970224 B CN 101970224B
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CN
China
Prior art keywords
composition
imidazole
phenolic compound
cured
protected phenolic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200980102010.3A
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English (en)
Chinese (zh)
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CN101970224A (zh
Inventor
梁荣昌
约翰·J·麦克纳马拉
应宇蓉
候中仁
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Trillion Science Inc
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Trillion Science Inc
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Publication of CN101970224A publication Critical patent/CN101970224A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
CN200980102010.3A 2008-01-10 2009-01-08 可固化粘合剂组合物、方法及应用 Expired - Fee Related CN101970224B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/008,375 2008-01-10
US12/008,375 US8084553B2 (en) 2008-01-10 2008-01-10 Curable adhesive compositions, process, and applications
PCT/US2009/030384 WO2009089314A1 (en) 2008-01-10 2009-01-08 Curable adhesive compositions, process, and applications

Publications (2)

Publication Number Publication Date
CN101970224A CN101970224A (zh) 2011-02-09
CN101970224B true CN101970224B (zh) 2014-11-12

Family

ID=40850866

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980102010.3A Expired - Fee Related CN101970224B (zh) 2008-01-10 2009-01-08 可固化粘合剂组合物、方法及应用

Country Status (6)

Country Link
US (2) US8084553B2 (enExample)
JP (1) JP5661472B2 (enExample)
KR (1) KR101288321B1 (enExample)
CN (1) CN101970224B (enExample)
TW (1) TWI382999B (enExample)
WO (1) WO2009089314A1 (enExample)

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US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US8067484B2 (en) * 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
US8044154B2 (en) * 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
JP5698940B2 (ja) * 2010-09-08 2015-04-08 積水化学工業株式会社 電子部品用接着剤及び半導体装置の製造方法
JP6109144B2 (ja) * 2011-03-28 2017-04-05 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物、物品、硬化方法及びタックフリー反応生成物
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
JP2013253195A (ja) * 2012-06-08 2013-12-19 Namics Corp エポキシ樹脂組成物
US9352539B2 (en) 2013-03-12 2016-05-31 Trillion Science, Inc. Microcavity carrier with image enhancement for laser ablation
GB201319363D0 (en) 2013-11-01 2013-12-18 Uni I Oslo Compounds
US9540539B2 (en) * 2014-05-27 2017-01-10 Infineon Technologies Ag Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
KR20170033886A (ko) 2014-07-22 2017-03-27 사빅 글로벌 테크놀러지스 비.브이. 고온 모노머 및 이들의 용도의 방법
CN104312471A (zh) * 2014-11-10 2015-01-28 深圳市飞世尔实业有限公司 一种含苯并恶嗪的异方性导电膜及其制备方法
BR112017018698A2 (pt) * 2015-03-04 2018-04-17 Huntsman Advanced Mat Americas Llc ?composição livre de ácido de enxofre orgânico, artigo curado, uso de uma composição livre de ácido de enxofre orgânico, e, método para produzir um artigo compósito?.
CN108047647B (zh) * 2017-12-27 2020-07-07 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料、层压板、覆金属箔层压板和印刷电路板
JP7261654B2 (ja) * 2018-05-24 2023-04-20 住友化学株式会社 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法
KR102633142B1 (ko) 2019-08-26 2024-02-02 삼성전자주식회사 반도체 패키지
EP4026630A4 (en) * 2019-09-02 2023-08-23 Osaka Soda Co., Ltd. Silver particles
CN117534682A (zh) * 2023-11-09 2024-02-09 江苏大学 一种具有多苯并二噁茂结构的单官能度生物基苯并噁嗪单体及树脂
CN119552132A (zh) * 2024-11-04 2025-03-04 北玻院(滕州)复合材料有限公司 一种可降解环氧树脂单体、环氧树脂、复合材料及其制备方法和降解方法

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US5409764A (en) * 1990-07-17 1995-04-25 Toyo Ink Manufacturing Co., Ltd. Curable adhesive composition and sheet thereof
US20020082322A1 (en) * 2000-09-21 2002-06-27 Kuen-Yuan Hwang Flame retarded epoxy resin composition
US20040006150A1 (en) * 2002-06-24 2004-01-08 Henkel Loctite Corporation Photocurable adhesive compositions, reaction products of which have low halide ion content
US20040147640A1 (en) * 2003-01-16 2004-07-29 Kuen-Yuan Hwang Halogen-free resin composition
US20070149726A1 (en) * 2004-07-13 2007-06-28 Yukio Isobe Curable compositions having improved adhesion performance

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US6207786B1 (en) * 1998-11-10 2001-03-27 Edison Polymer Innovation Corporation Ternary systems of benzoxazine, epoxy, and phenolic resins
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US6627685B2 (en) * 2001-08-14 2003-09-30 Ellis Breskman Lightfast epoxy resin
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409764A (en) * 1990-07-17 1995-04-25 Toyo Ink Manufacturing Co., Ltd. Curable adhesive composition and sheet thereof
US20020082322A1 (en) * 2000-09-21 2002-06-27 Kuen-Yuan Hwang Flame retarded epoxy resin composition
US20040006150A1 (en) * 2002-06-24 2004-01-08 Henkel Loctite Corporation Photocurable adhesive compositions, reaction products of which have low halide ion content
US20040147640A1 (en) * 2003-01-16 2004-07-29 Kuen-Yuan Hwang Halogen-free resin composition
US20070149726A1 (en) * 2004-07-13 2007-06-28 Yukio Isobe Curable compositions having improved adhesion performance

Also Published As

Publication number Publication date
KR20100124704A (ko) 2010-11-29
US20120029116A1 (en) 2012-02-02
US8084553B2 (en) 2011-12-27
TW200936629A (en) 2009-09-01
TWI382999B (zh) 2013-01-21
CN101970224A (zh) 2011-02-09
JP5661472B2 (ja) 2015-01-28
HK1152681A1 (en) 2012-03-09
KR101288321B1 (ko) 2013-07-23
US20090181165A1 (en) 2009-07-16
WO2009089314A1 (en) 2009-07-16
JP2011509340A (ja) 2011-03-24

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