JP2007250529A5 - - Google Patents
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- Publication number
- JP2007250529A5 JP2007250529A5 JP2007031474A JP2007031474A JP2007250529A5 JP 2007250529 A5 JP2007250529 A5 JP 2007250529A5 JP 2007031474 A JP2007031474 A JP 2007031474A JP 2007031474 A JP2007031474 A JP 2007031474A JP 2007250529 A5 JP2007250529 A5 JP 2007250529A5
- Authority
- JP
- Japan
- Prior art keywords
- work piece
- charged particle
- particle beam
- directing
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims 54
- 239000000463 material Substances 0.000 claims 43
- 238000000034 method Methods 0.000 claims 26
- 238000004544 sputter deposition Methods 0.000 claims 9
- 239000011248 coating agent Substances 0.000 claims 7
- 238000000576 coating method Methods 0.000 claims 7
- 239000010410 layer Substances 0.000 claims 5
- 239000011241 protective layer Substances 0.000 claims 5
- 238000002347 injection Methods 0.000 claims 4
- 239000007924 injection Substances 0.000 claims 4
- 238000010894 electron beam technology Methods 0.000 claims 2
- 238000010884 ion-beam technique Methods 0.000 claims 2
- 238000003801 milling Methods 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 206010026749 Mania Diseases 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000005459 micromachining Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 238000004626 scanning electron microscopy Methods 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77339606P | 2006-02-15 | 2006-02-15 | |
| US60/773,396 | 2006-02-15 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007250529A JP2007250529A (ja) | 2007-09-27 |
| JP2007250529A5 true JP2007250529A5 (enExample) | 2010-04-02 |
| JP5600371B2 JP5600371B2 (ja) | 2014-10-01 |
Family
ID=37943762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007031474A Active JP5600371B2 (ja) | 2006-02-15 | 2007-02-13 | 荷電粒子ビーム処理のための保護層のスパッタリング・コーティング |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7675049B2 (enExample) |
| EP (2) | EP1821146A1 (enExample) |
| JP (1) | JP5600371B2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008171800A (ja) | 2006-10-31 | 2008-07-24 | Fei Co | 荷電粒子ビーム処理用保護層 |
| JP5105357B2 (ja) * | 2007-11-01 | 2012-12-26 | エスアイアイ・ナノテクノロジー株式会社 | 欠陥認識方法、欠陥観察方法、及び荷電粒子ビーム装置 |
| EP2151848A1 (en) * | 2008-08-07 | 2010-02-10 | FEI Company | Method of machining a work piece with a focused particle beam |
| NL2004888A (en) * | 2009-06-29 | 2010-12-30 | Asml Netherlands Bv | Deposition method and apparatus. |
| JP5595054B2 (ja) * | 2010-01-29 | 2014-09-24 | 株式会社日立ハイテクサイエンス | 電子顕微鏡及び試料分析方法 |
| US9187815B2 (en) * | 2010-03-12 | 2015-11-17 | United Technologies Corporation | Thermal stabilization of coating material vapor stream |
| US20110223317A1 (en) * | 2010-03-12 | 2011-09-15 | United Technologies Corporation | Direct thermal stabilization for coating application |
| US8859963B2 (en) | 2011-06-03 | 2014-10-14 | Fei Company | Methods for preparing thin samples for TEM imaging |
| US8912490B2 (en) | 2011-06-03 | 2014-12-16 | Fei Company | Method for preparing samples for imaging |
| US9041793B2 (en) * | 2012-05-17 | 2015-05-26 | Fei Company | Scanning microscope having an adaptive scan |
| EP2765591B1 (en) | 2013-02-08 | 2016-07-13 | FEI Company | Sample preparation stage |
| EP2787523B1 (en) * | 2013-04-03 | 2016-02-10 | Fei Company | Low energy ion milling or deposition |
| EP2811506B1 (en) | 2013-06-05 | 2016-04-06 | Fei Company | Method for imaging a sample in a dual-beam charged particle apparatus |
| US9601305B2 (en) | 2013-11-11 | 2017-03-21 | Howard Hughes Medical Institute | Specimen sample holder for workpiece transport apparatus |
| EP3249676B1 (en) * | 2016-05-27 | 2018-10-03 | FEI Company | Dual-beam charged-particle microscope with in situ deposition functionality |
| FR3080947B1 (fr) * | 2018-05-02 | 2021-02-19 | Centre Nat Rech Scient | Microscope electronique en transmission equipe d'au moins une source de jet de matiere balistique |
| DE102020112220B9 (de) * | 2020-05-06 | 2022-05-25 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlgerät zum Abtragen mindestens eines Materials von einer Materialeinheit und Anordnen des Materials an einem Objekt |
| US11749496B2 (en) * | 2021-06-21 | 2023-09-05 | Fei Company | Protective shutter for charged particle microscope |
| US12308207B2 (en) | 2022-08-18 | 2025-05-20 | Applied Materials Israel Ltd. | Enhanced deposition rate by thermal isolation cover for GIS manipulator |
| KR20250157420A (ko) | 2023-03-07 | 2025-11-04 | 칼 짜이스 에스엠테 게엠베하 | 하전 입자 빔 이미징을 위한 샘플 준비 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54124879A (en) | 1978-03-22 | 1979-09-28 | Nippon Telegr & Teleph Corp <Ntt> | Ion beam deposition |
| US4639301B2 (en) | 1985-04-24 | 1999-05-04 | Micrion Corp | Focused ion beam processing |
| US5188705A (en) | 1991-04-15 | 1993-02-23 | Fei Company | Method of semiconductor device manufacture |
| JPH0620639A (ja) * | 1992-07-03 | 1994-01-28 | Hitachi Ltd | 集束イオンビーム加工用ガスノズル |
| US5429730A (en) | 1992-11-02 | 1995-07-04 | Kabushiki Kaisha Toshiba | Method of repairing defect of structure |
| JP3117836B2 (ja) | 1993-03-02 | 2000-12-18 | セイコーインスツルメンツ株式会社 | 集束イオンビーム装置 |
| US5435850A (en) | 1993-09-17 | 1995-07-25 | Fei Company | Gas injection system |
| DE4340956C2 (de) | 1993-12-01 | 2002-08-22 | Advantest Corp | Verfahren und Vorrichtung zur Bearbeitung einer Probe |
| JPH08171882A (ja) * | 1994-12-19 | 1996-07-02 | Hitachi Ltd | 集束イオンビーム装置および試料前処理方法 |
| US5916424A (en) * | 1996-04-19 | 1999-06-29 | Micrion Corporation | Thin film magnetic recording heads and systems and methods for manufacturing the same |
| US5851413A (en) | 1996-06-19 | 1998-12-22 | Micrion Corporation | Gas delivery systems for particle beam processing |
| JP4279369B2 (ja) * | 1997-02-27 | 2009-06-17 | 株式会社ルネサステクノロジ | 半導体装置の加工方法 |
| US6188068B1 (en) * | 1997-06-16 | 2001-02-13 | Frederick F. Shaapur | Methods of examining a specimen and of preparing a specimen for transmission microscopic examination |
| JPH11154479A (ja) | 1997-11-20 | 1999-06-08 | Hitachi Ltd | 2次電子画像検出方法及びその装置並びに集束荷電粒子ビームによる処理方法及びその装置 |
| JP2000035391A (ja) * | 1998-07-16 | 2000-02-02 | Seiko Instruments Inc | 薄片化加工時の試料歪除去方法 |
| JP2000260383A (ja) * | 1999-03-11 | 2000-09-22 | Jeol Ltd | 荷電粒子ビーム装置 |
| JP4137317B2 (ja) | 1999-10-07 | 2008-08-20 | 独立行政法人科学技術振興機構 | 微小立体構造物、その製造方法及びその製造装置 |
| EP1210723B1 (en) | 2000-01-21 | 2009-03-18 | Fei Company | Shaped and low density focused ion beams |
| EP1209737B2 (en) * | 2000-11-06 | 2014-04-30 | Hitachi, Ltd. | Method for specimen fabrication |
| US7326445B2 (en) | 2000-11-29 | 2008-02-05 | Sii Nanotechnology Inc. | Method and apparatus for manufacturing ultra fine three-dimensional structure |
| US6646259B2 (en) * | 2001-03-20 | 2003-11-11 | United Microelectronics Corp. | Method of sample preparation for transmission electron microscope analysis |
| JP5246981B2 (ja) * | 2001-04-17 | 2013-07-24 | 株式会社日立ハイテクサイエンス | 試料加工方法及びイオンビーム装置 |
| WO2003012551A1 (en) | 2001-07-27 | 2003-02-13 | Fei Company | Electron beam processing |
| JP3916541B2 (ja) * | 2002-09-27 | 2007-05-16 | 独立行政法人科学技術振興機構 | 透過型電子顕微鏡 |
| US6783637B2 (en) | 2002-10-31 | 2004-08-31 | Freescale Semiconductor, Inc. | High throughput dual ion beam deposition apparatus |
| CN100458712C (zh) | 2002-11-12 | 2009-02-04 | Fei公司 | 缺陷表征系统及方法以及缺陷分析系统 |
| CN1739066B (zh) | 2003-01-16 | 2010-06-02 | Fei公司 | 用于掩模修复的电子束处理技术 |
| DE602004031073D1 (de) | 2003-06-13 | 2011-03-03 | Fei Co | Verfahren und Vorrichtung zum Manipulieren von mikroskopischen Proben |
| US6926935B2 (en) | 2003-06-27 | 2005-08-09 | Fei Company | Proximity deposition |
| DE10362116B4 (de) | 2003-09-17 | 2008-08-28 | Carl Zeiss Nts Gmbh | Verfahren zur Präparation einer Probe für elektronenmikroskopische Untersuchungen, sowie dabei verwendeter Greifer |
| US7601246B2 (en) * | 2004-09-29 | 2009-10-13 | Lam Research Corporation | Methods of sputtering a protective coating on a semiconductor substrate |
-
2007
- 2007-02-13 JP JP2007031474A patent/JP5600371B2/ja active Active
- 2007-02-14 US US11/706,053 patent/US7675049B2/en active Active
- 2007-02-14 EP EP07102322A patent/EP1821146A1/en not_active Ceased
- 2007-02-14 EP EP10159048.7A patent/EP2209047B1/en active Active
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