JP2007184607A - 低圧処理装置及び低圧処理装置を分解する方法、基板処理設備 - Google Patents
低圧処理装置及び低圧処理装置を分解する方法、基板処理設備 Download PDFInfo
- Publication number
- JP2007184607A JP2007184607A JP2006354853A JP2006354853A JP2007184607A JP 2007184607 A JP2007184607 A JP 2007184607A JP 2006354853 A JP2006354853 A JP 2006354853A JP 2006354853 A JP2006354853 A JP 2006354853A JP 2007184607 A JP2007184607 A JP 2007184607A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- low
- processing apparatus
- roller set
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000006837 decompression Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5152—Plural diverse manufacturing apparatus including means for metal shaping or assembling with turret mechanism
- Y10T29/5154—Plural diverse manufacturing apparatus including means for metal shaping or assembling with turret mechanism tool turret
- Y10T29/5158—Fluid operated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/54—Miscellaneous apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Solid Materials (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
【解決手段】ベース、前記ベースの上に設置され、基板を支持するステージ、前記ベースの上に取り外し可能に設置され、第1位置と第2位置間を移動し、それが第1位置にある時、前記ベースと共に前記ステージを受けるチャンバーを形成するハウジング、及び前記ハウジングが取り外された時、前記ハウジングに接触して支持し、第1水平方向でその動きを助ける少なくとも1つの第1ローラーセットを含む基板を処理する低圧処理装置。
【選択図】図6
Description
2 ハウジング
3 ステージ
4 基板
5 支持素子
6 アクチュエータ装置
7 排気管
8 チャンバー
10 低圧処理装置
100、100’ 低圧処理装置
111 ベース
112 ステージ
113 基板
114 チャンバー
120、120’ ハウジング
121 ゲート
122 支持構造
130 排気管
140 導溝
150 第1ローラーセット
151 支持素子
152 ローラー
160 アクチュエータ装置
170 持ち上げ装置
171 支持ロッド
200 搬送装置
210 第2ローラーセット
300 基板処理設備
310 ストッカー
320 クリーニングユニット
330 フォトレジストコーティング装置
340 露光ユニット
350 ロボット
Claims (21)
- ベース、
前記ベースの上に設置され、基板を支持するステージ、
前記ベースの上に取り外し可能に設置され、第1位置と第2位置間を移動し、それが第1位置にある時、前記ベースと共に前記ステージを受けるチャンバーを形成するハウジング、及び
前記ハウジングが取り外された時、前記ハウジングに接触して支持し、第1水平方向でその動きを助ける少なくとも1つの第1ローラーセット、
を含む基板を処理する低圧処理装置。 - 前記ハウジングは、前記第1ローラーセットに対応してその上に設置された少なくとも1つの導溝を含む請求項1に記載の低圧処理装置。
- 前記第1ローラーセットに接続したベースの上に設置された少なくとも1つのアクチュエータ装置を更に含み、前記ハウジングが第2位置にある時、前記アクチュエータ装置は、前記第1ローラーセットを第1平面に押し上げ、前記ハウジングに接触して支持する請求項1に記載の低圧処理装置。
- 前記アクチュエータ装置は、エアシリンダーである請求項3に記載の低圧処理装置。
- 搬送装置と請求項1に記載の低圧処理装置を提供するステップ、及び
前記第1ローラーセットによって前記第1水平方向で前記ハウジングを前記搬送装置に移動するステップ、
を含む低圧処理装置を分解する方法。 - 前記搬送装置は、少なくとも1つの第2ローラーセットを含み、前記ハウジングが水平に移動された時、前記第1ローラーセットと前記第2ローラーセットは、第1平面の上に位置される請求項5に記載の方法。
- 第1処理装置、
第2処理装置、及び
請求項1に記載の低圧処理装置、
を含み、前記第1処理装置、前記第2処理装置、前記低圧処理装置は、第2水平方向で配列される基板処理設備。 - 前記第1水平方向は、前記第2水平方向に垂直する請求項7に記載の基板処理設備。
- ベース、
前記ベースの上に設置され、基板を支持するステージ、
前記ベースの上に取り外し可能に設置され、前記ベースと共に前記ステージを受けるチャンバーを形成し、上部に設置されたゲートを含むハウジング、
少なくとも1つのアクチュエータ装置、及び
前記アクチュエータ装置に接続し、前記ハウジングが取り外された時、前記アクチュエータ装置により前記ハウジングと共に押し上げられ、前記ハウジングと接触することにより第1水平方向に移動させる少なくとも1つの第1ローラーセット、
を含む基板を処理する低圧処理装置。 - 前記ハウジングは、前記第1ローラーセットに対応してその上に設置された少なくとも1つの導溝を含む請求項9に記載の低圧処理装置。
- 前記アクチュエータ装置は、エアシリンダーである請求項9に記載の低圧処理装置。
- 両側に設置された2つの第1ローラーセットを含むベース、及び
排気管を含み、前記ベースの上の第1位置と第2位置間で移動可能であり、第1位置にある時、前記ベースと共にチャンバーを形成するハウジングを含み、
前記ハウジングが第2位置にある時、前記第1ローラーセットは、前記ハウジングに接触して支持し、第1水平方向でその動きを助け、前記ベースから離れる低圧処理装置。 - 前記ベースは、ステージを更に含む請求項12に記載の低圧処理装置。
- 前記ステージは、基板を支持する請求項13に記載の低圧処理装置。
- 前記ハウジングは、前記第1ローラーセットに対応してその両側に設置された2つの導溝を含む請求項12に記載の低圧処理装置。
- 前記第1ローラーセットに接続したベースの上に設置された少なくとも1つのアクチュエータ装置を更に含み、前記ハウジングが第2位置にある時、前記アクチュエータ装置は、前記第1ローラーセットを第1平面に押し上げ、前記ハウジングに接触して支持する請求項12に記載の低圧処理装置。
- 前記アクチュエータ装置は、エアシリンダーである請求項16に記載の低圧処理装置。
- 搬送装置と請求項12に記載の低圧処理装置を提供するステップ、及び
前記第1ローラーセットによって前記第1水平方向で前記ハウジングを前記搬送装置に移動するステップ、
を含む低圧処理装置を分解する方法。 - 前記搬送装置は、少なくとも1つの第2ローラーセットを含み、前記ハウジングが水平に移動された時、前記第1ローラーセットと前記第2ローラーセットは、第1平面の上に位置される請求項18に記載の方法。
- 第1処理装置、
第2処理装置、及び
請求項12に記載の低圧処理装置を含み、前記第1処理装置、前記第2処理装置及び前記低圧処理装置は、第2水平方向で配列される基板処理設備。 - 前記第1水平方向は、前記第2水平方向に垂直する請求項20に記載の基板処理設備。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094146971A TWI283005B (en) | 2005-12-28 | 2005-12-28 | Low-pressure process apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007184607A true JP2007184607A (ja) | 2007-07-19 |
JP4625799B2 JP4625799B2 (ja) | 2011-02-02 |
Family
ID=38191941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006354853A Active JP4625799B2 (ja) | 2005-12-28 | 2006-12-28 | 低圧処理装置及び低圧処理装置を分解する方法、基板処理設備 |
Country Status (3)
Country | Link |
---|---|
US (3) | US7958612B2 (ja) |
JP (1) | JP4625799B2 (ja) |
TW (1) | TWI283005B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113091413B (zh) * | 2021-04-30 | 2022-06-10 | Tcl华星光电技术有限公司 | 真空干燥装置 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05183041A (ja) * | 1991-11-09 | 1993-07-23 | Tokyo Electron Ltd | 処理装置 |
JPH07335923A (ja) * | 1994-06-10 | 1995-12-22 | Fuji Electric Corp Res & Dev Ltd | 薄膜光電変換素子の製造装置 |
JPH0878388A (ja) * | 1994-09-02 | 1996-03-22 | Dainippon Screen Mfg Co Ltd | 表面処理装置 |
JPH08288371A (ja) * | 1995-04-17 | 1996-11-01 | Toshiba Mach Co Ltd | 被処理材の固定装置 |
JPH11128810A (ja) * | 1997-10-30 | 1999-05-18 | Tokyo Ohka Kogyo Co Ltd | 回転カップ式塗布装置 |
JP2002008967A (ja) * | 2000-06-22 | 2002-01-11 | Mitsubishi Electric Corp | 半導体装置の製造装置及び製造方法 |
JP2002280296A (ja) * | 2000-11-07 | 2002-09-27 | Tokyo Electron Ltd | 液処理装置 |
JP2004193349A (ja) * | 2002-12-11 | 2004-07-08 | Sony Corp | 熱処理装置 |
JP2005019967A (ja) * | 2003-05-30 | 2005-01-20 | Tokyo Electron Ltd | 基板搬送装置および基板搬送方法ならびに真空処理装置 |
JP2006156839A (ja) * | 2004-11-30 | 2006-06-15 | Mitsubishi Heavy Ind Ltd | 製膜装置 |
JP2006210767A (ja) * | 2005-01-31 | 2006-08-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2006253517A (ja) * | 2005-03-14 | 2006-09-21 | Dainippon Screen Mfg Co Ltd | 減圧乾燥装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3255843A (en) * | 1959-10-02 | 1966-06-14 | Owens Corning Fiberglass Corp | Fibrous acoustical panel with continuously adhered surface film and method of making same |
BE757119A (fr) * | 1969-10-07 | 1971-03-16 | Cmi Corp | Secheuse de tapis |
FR2146106B1 (ja) * | 1971-07-16 | 1977-08-05 | Thomson Csf | |
US4341592A (en) * | 1975-08-04 | 1982-07-27 | Texas Instruments Incorporated | Method for removing photoresist layer from substrate by ozone treatment |
US4714511A (en) * | 1985-02-07 | 1987-12-22 | Fujitsu Limited | Method and apparatus for adhering a tape or sheet to a semiconductor wafer |
US4915777A (en) * | 1987-07-16 | 1990-04-10 | Texas Instruments Incorporated | Method for etching tungsten |
US5226056A (en) * | 1989-01-10 | 1993-07-06 | Nihon Shinku Gijutsu Kabushiki Kaisha | Plasma ashing method and apparatus therefor |
JP2528962B2 (ja) * | 1989-02-27 | 1996-08-28 | 株式会社日立製作所 | 試料処理方法及び装置 |
US5328540A (en) * | 1992-03-06 | 1994-07-12 | Northrop Corporation | Mechanized lay up assembly line for composite structures |
ES2078718T3 (es) * | 1992-08-04 | 1995-12-16 | Ibm | Estructuras de cadenas de fabricacion a base de transportadores totalmente automatizados e informatizados adaptados a recipientes transportables estancos a presion. |
US5972780A (en) * | 1996-08-22 | 1999-10-26 | Nippon Telegraph Telephone Corporation | Thin film forming apparatus and method |
JP4401649B2 (ja) * | 2002-12-13 | 2010-01-20 | キヤノン株式会社 | 太陽電池モジュールの製造方法 |
-
2005
- 2005-12-28 TW TW094146971A patent/TWI283005B/zh not_active IP Right Cessation
-
2006
- 2006-06-01 US US11/421,501 patent/US7958612B2/en active Active
- 2006-12-28 JP JP2006354853A patent/JP4625799B2/ja active Active
-
2011
- 2011-04-12 US US13/085,209 patent/US8458872B2/en active Active
-
2013
- 2013-05-03 US US13/886,768 patent/US8950046B2/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05183041A (ja) * | 1991-11-09 | 1993-07-23 | Tokyo Electron Ltd | 処理装置 |
JPH07335923A (ja) * | 1994-06-10 | 1995-12-22 | Fuji Electric Corp Res & Dev Ltd | 薄膜光電変換素子の製造装置 |
JPH0878388A (ja) * | 1994-09-02 | 1996-03-22 | Dainippon Screen Mfg Co Ltd | 表面処理装置 |
JPH08288371A (ja) * | 1995-04-17 | 1996-11-01 | Toshiba Mach Co Ltd | 被処理材の固定装置 |
JPH11128810A (ja) * | 1997-10-30 | 1999-05-18 | Tokyo Ohka Kogyo Co Ltd | 回転カップ式塗布装置 |
JP2002008967A (ja) * | 2000-06-22 | 2002-01-11 | Mitsubishi Electric Corp | 半導体装置の製造装置及び製造方法 |
JP2002280296A (ja) * | 2000-11-07 | 2002-09-27 | Tokyo Electron Ltd | 液処理装置 |
JP2004193349A (ja) * | 2002-12-11 | 2004-07-08 | Sony Corp | 熱処理装置 |
JP2005019967A (ja) * | 2003-05-30 | 2005-01-20 | Tokyo Electron Ltd | 基板搬送装置および基板搬送方法ならびに真空処理装置 |
JP2006156839A (ja) * | 2004-11-30 | 2006-06-15 | Mitsubishi Heavy Ind Ltd | 製膜装置 |
JP2006210767A (ja) * | 2005-01-31 | 2006-08-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2006253517A (ja) * | 2005-03-14 | 2006-09-21 | Dainippon Screen Mfg Co Ltd | 減圧乾燥装置 |
Also Published As
Publication number | Publication date |
---|---|
US7958612B2 (en) | 2011-06-14 |
US20130239383A1 (en) | 2013-09-19 |
US20110185588A1 (en) | 2011-08-04 |
JP4625799B2 (ja) | 2011-02-02 |
TWI283005B (en) | 2007-06-21 |
US8458872B2 (en) | 2013-06-11 |
TW200725691A (en) | 2007-07-01 |
US20070144029A1 (en) | 2007-06-28 |
US8950046B2 (en) | 2015-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5819458B2 (ja) | 基板処理装置 | |
JP5225815B2 (ja) | インターフェイス装置、基板を搬送する方法及びコンピュータ可読記憶媒体 | |
JP4312787B2 (ja) | 減圧乾燥装置 | |
JP3989384B2 (ja) | 基板処理装置及び基板処理方法 | |
JP2016085439A (ja) | 露光方法及び露光装置 | |
JP5503057B2 (ja) | 減圧乾燥装置及び減圧乾燥方法 | |
KR101558596B1 (ko) | 감압 건조 장치 및 감압 건조 방법 | |
JP4625799B2 (ja) | 低圧処理装置及び低圧処理装置を分解する方法、基板処理設備 | |
JP4859968B2 (ja) | 減圧乾燥装置及び減圧乾燥方法 | |
JP4673308B2 (ja) | 真空処理装置 | |
JPWO2012008439A1 (ja) | 基板処理方法及び基板処理システム | |
KR102010267B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
KR20100059238A (ko) | 기판 상의 포토레지스트막을 건조하기 위한 장치 | |
KR100812009B1 (ko) | 감압처리장치 | |
JP2007201461A (ja) | 低圧処理機器のハウジング移動装置及びハウジング洗浄方法並びに基板処理ライン | |
JPH10209133A (ja) | プラズマ灰化装置およびプラズマ灰化方法 | |
JP2006278821A (ja) | 半導体製造装置、半導体装置の製造方法および半導体製造装置のクリーニング方法 | |
KR100783730B1 (ko) | 포토마스크 건식세정장치 및 건식세정방법 | |
WO2012060205A1 (ja) | テンプレート処理方法、コンピュータ記憶媒体及びテンプレート処理装置 | |
JP6361964B2 (ja) | デバイス製造装置 | |
KR102259064B1 (ko) | 기판 처리 장치 | |
CN100498528C (zh) | 低压处理机台、其拆卸方法及基板处理设备 | |
JP2007273824A (ja) | 半導体製造装置 | |
JP2019005683A (ja) | 基板処理装置及び基板処理方法 | |
JP2015064185A (ja) | 減圧乾燥装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070918 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100625 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100713 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100929 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101019 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101108 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4625799 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131112 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |