US8458872B2 - Low-pressure process apparatus - Google Patents

Low-pressure process apparatus Download PDF

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Publication number
US8458872B2
US8458872B2 US13/085,209 US201113085209A US8458872B2 US 8458872 B2 US8458872 B2 US 8458872B2 US 201113085209 A US201113085209 A US 201113085209A US 8458872 B2 US8458872 B2 US 8458872B2
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Prior art keywords
housing
base
low
process apparatus
pressure process
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US20110185588A1 (en
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Ting-Hui Huang
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AU Optronics Corp
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AU Optronics Corp
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Priority to US13/085,209 priority Critical patent/US8458872B2/en
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Priority to US13/886,768 priority patent/US8950046B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00—Preparing for use and conserving printing surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5152—Plural diverse manufacturing apparatus including means for metal shaping or assembling with turret mechanism
    • Y10T29/5154—Plural diverse manufacturing apparatus including means for metal shaping or assembling with turret mechanism tool turret
    • Y10T29/5158—Fluid operated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/54—Miscellaneous apparatus

Definitions

  • the invention relates to a low-pressure process apparatus, and in particular to a low-pressure process apparatus for drying photoresist.
  • FIG. 1 a shows a conventional low-pressure process apparatus 10 comprising a base 1 , a housing 2 , a stage 3 , supporting elements 5 , actuating devices 6 and an exhaust pipe 7 .
  • the stage 3 is disposed on the base 1 , supporting a substrate 4 .
  • the housing 2 and the base 1 form a chamber 8 receiving the stage 3 and the substrate 4 .
  • the exhaust pipe 7 and the supporting elements 5 are disposed on the base 2 .
  • the actuating devices 6 are disposed on the base 1 . With reference to FIG. 1 b , the actuating devices 6 push the supporting elements 5 and the housing 2 , and separate the housing 2 from the base 1 allowing a robot (not shown) to access the substrate 4 .
  • the low-pressure process apparatus 10 dries a photoresist material (for example, resin), volatile chemical or particles are deposited on an inner wall of the housing of the exhaust pipe 7 .
  • a photoresist material for example, resin
  • volatile chemical or particles are deposited on an inner wall of the housing of the exhaust pipe 7 .
  • the housing 2 and the exhaust pipe 7 require regular cleaning.
  • the housing 2 and the exhaust pipe 7 are manually cleaned after the housing is elevated. The cleaning process is difficult and time consuming.
  • the low-pressure process apparatus 10 is shut down affecting process yield.
  • the invention provides low-pressure process apparatus for processing a substrate, comprising a base, a stage, a housing and at least one first roller set.
  • the stage is disposed on the base, supporting the substrate.
  • the housing is detachably disposed on the base and moves between a first position and a second position, wherein, when in a first position, the housing and the base form a chamber to receive the stage.
  • the first roller set contacts and supports the housing to allow movement in a first horizontal direction.
  • the housing of the invention is detached and removed from the base to be cleaned.
  • another housing can be disposed on the base to continue the low-pressure process.
  • Shutdown time of the low-pressure process apparatus is thus shortened, and yield and cost are conserved.
  • FIG. 1 a shows a conventional low-pressure process apparatus
  • FIG. 1 b shows the conventional low-pressure process apparatus raising a housing thereof
  • FIG. 2 a is a front view of a low-pressure process apparatus of a first embodiment of the invention
  • FIG. 2 b is a front view of a low-pressure process apparatus of the invention when a housing thereof is in a second position;
  • FIG. 2 c is a side view of a low-pressure process apparatus of the invention when the housing is in the second position;
  • FIGS. 3 a and 3 b show first roller sets contacting lead grooves
  • FIG. 3 c shows the housing sliding by the first roller sets and the lead grooves
  • FIG. 4 a shows substrate processing equipment of the invention
  • FIG. 4 b shows the housing detached from the substrate processing equipment
  • FIG. 5 shows raising devices of the invention
  • FIG. 6 a shows a low-pressure process apparatus of a second embodiment of the invention
  • FIG. 6 b shows a housing detached from the low-pressure process apparatus of the second embodiment.
  • FIG. 2 a is a front view of a low-pressure process apparatus 100 of a first embodiment of the invention, comprising a base 111 , a housing 120 , lead grooves 140 , first roller sets 150 and air cylinders (actuating devices) 160 .
  • a stage 112 is disposed on the base 111 supporting a substrate 113 .
  • the housing 120 is disposed on the base 111 , and forms a chamber 114 with the base 111 .
  • the stage 112 and the substrate 113 are received in the chamber 114 .
  • An exhaust pipe 130 is disposed on the housing 120 extending into the chamber 114 for exhausting air therefrom.
  • the actuating devices 160 are disposed on the base 111 .
  • the first roller sets 150 are disposed on the actuating devices 160 .
  • the lead grooves are disposed on two sides of the housing 114 corresponding to the first roller sets 150 .
  • the housing 120 is moveable between a first position (as shown in FIG. 2 a ) and a second position (as shown in FIG. 2 b ), wherein raising devices moving the housing 120 between the first and second positions are not shown to simplify the description.
  • the housing 120 When the housing 120 is in the first position, the housing 120 and the base 111 form the chamber 114 for low-pressure processing of the substrate 113 .
  • the housing 120 is moved to the second position allowing a robot (not shown) to access the substrate 113 .
  • FIG. 2 c is a side view of the low-pressure process apparatus 100 when the housing 120 is in the second position.
  • Each first roller set 150 comprises a supporting element 151 and a plurality of rollers 152 .
  • the rollers 152 are disposed on the supporting element 151 .
  • the supporting element 151 contacts the actuating device 160 .
  • the housing 120 is detachably disposed on the base 110 .
  • the user can remove the housing 120 from the base 110 to clean the housing 120 individually.
  • the actuating devices 160 raise the first roller sets 150 to a first plane to contact the lead grooves 140 , wherein the first roller sets 150 support and move the housing 120 .
  • the actuating devices 160 further raise the housing 120 and the first roller sets 150 after the first roller sets 150 contact the lead grooves 140 .
  • FIG. 3 c after the first roller sets 150 are raised to the first plane and contact the lead grooves 140 , the housing 120 is moved to a transmission device 200 in a first horizontal direction y.
  • the transmission device 200 comprises second roller sets 210 located on the first plane.
  • the housing 120 is moved on the first roller sets 150 and the second roller sets 210 by the lead grooves 140 .
  • FIG. 4 a shows the low-pressure process apparatus 100 of the invention disposed in substrate process equipment 300 .
  • the substrate process equipment 300 comprises a plurality of stockers 310 , a cleaning unit (first process apparatus) 320 , a photoresist coating apparatus (second process apparatus) 330 , low-pressure process apparatus 100 , an exposure unit 340 and robots 350 , wherein the cleaning unit (first process apparatus) 320 , the photoresist coating apparatus (second process apparatus) 330 , and the low-pressure process apparatus 100 are arranged along a second horizontal direction x.
  • FIG. 4 b when the housing 120 is detached, the housing 120 is moved to the transmission device 200 in the first horizontal direction y perpendicular to the second horizontal direction x.
  • the housing 120 of the invention is detached and removed from the base 111 to be cleaned.
  • another housing can be disposed on the base 111 to continue the low-pressure process.
  • Shutdown time of the low-pressure process apparatus is thus shortened, and yield and cost are conserved.
  • the low-pressure process apparatus 100 of the invention can be utilized drying organic solvents, such as photoresist (for example, resin).
  • each raising device 170 comprises a supporting rod 171 .
  • the supporting structures 122 are disposed on the housing 120 .
  • the supporting rods 171 are connected to the supporting structures 122 .
  • the raising devices 170 raise the housing 120 by the supporting rods 171 .
  • the supporting rods 171 abut the supporting structures 122 for easy detachment.
  • FIG. 6 a shows a low-pressure process apparatus 100 ′ of a second embodiment of the invention, wherein the housing 120 ′ comprises a gate 121 disposed on a back side thereof.
  • the housing 120 ′ when the robot accesses the substrate 113 , the housing 120 ′ is not raised.
  • the actuating devices 160 directly push the first roller sets 150 and the housing 120 ′. In the second embodiment of the invention, there is no additional device to raise the housing 120 ′.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A low-pressure process apparatus for processing a substrate comprises a base, a stage, a housing and at least one first roller set. The stage is disposed on the base for supporting the substrate. The housing is detachably disposed on the base moving between a first position and a second position, wherein when the housing is in a first position, the housing and the base form a chamber to receive the stage. When the housing is detached, the first roller set contacts and supports the housing to facilitate movement thereof in a first horizontal direction.

Description

CROSS REFERENCE TO RELATED APPLICATIONS
This present application is a divisional application of and claims priority from U.S. patent application Ser. No. 11/421,501, filed Jun. 1, 2006, now U.S. Pat. No. 7,958,612, the content of which is hereby incorporated by reference in its entirety.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a low-pressure process apparatus, and in particular to a low-pressure process apparatus for drying photoresist.
2. Description of the Related Art
FIG. 1 a shows a conventional low-pressure process apparatus 10 comprising a base 1, a housing 2, a stage 3, supporting elements 5, actuating devices 6 and an exhaust pipe 7. The stage 3 is disposed on the base 1, supporting a substrate 4. The housing 2 and the base 1 form a chamber 8 receiving the stage 3 and the substrate 4. The exhaust pipe 7 and the supporting elements 5 are disposed on the base 2. The actuating devices 6 are disposed on the base 1. With reference to FIG. 1 b, the actuating devices 6 push the supporting elements 5 and the housing 2, and separate the housing 2 from the base 1 allowing a robot (not shown) to access the substrate 4.
When the low-pressure process apparatus 10 dries a photoresist material (for example, resin), volatile chemical or particles are deposited on an inner wall of the housing of the exhaust pipe 7. Thus, the housing 2 and the exhaust pipe 7 require regular cleaning. Conventionally, the housing 2 and the exhaust pipe 7 are manually cleaned after the housing is elevated. The cleaning process is difficult and time consuming. Additionally, when the housing 2 and the exhaust pipe 7 are cleaned, the low-pressure process apparatus 10 is shut down affecting process yield.
BRIEF SUMMARY OF THE INVENTION
A detailed description is given in the following embodiments with reference to the accompanying drawings.
The invention provides low-pressure process apparatus for processing a substrate, comprising a base, a stage, a housing and at least one first roller set. The stage is disposed on the base, supporting the substrate. The housing is detachably disposed on the base and moves between a first position and a second position, wherein, when in a first position, the housing and the base form a chamber to receive the stage. When the housing is detached, the first roller set contacts and supports the housing to allow movement in a first horizontal direction.
The housing of the invention is detached and removed from the base to be cleaned. Thus, when the original housing (first housing) is cleaned, another housing (second housing) can be disposed on the base to continue the low-pressure process. Shutdown time of the low-pressure process apparatus is thus shortened, and yield and cost are conserved.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
FIG. 1 a shows a conventional low-pressure process apparatus;
FIG. 1 b shows the conventional low-pressure process apparatus raising a housing thereof;
FIG. 2 a is a front view of a low-pressure process apparatus of a first embodiment of the invention;
FIG. 2 b is a front view of a low-pressure process apparatus of the invention when a housing thereof is in a second position;
FIG. 2 c is a side view of a low-pressure process apparatus of the invention when the housing is in the second position;
FIGS. 3 a and 3 b show first roller sets contacting lead grooves;
FIG. 3 c shows the housing sliding by the first roller sets and the lead grooves;
FIG. 4 a shows substrate processing equipment of the invention;
FIG. 4 b shows the housing detached from the substrate processing equipment;
FIG. 5 shows raising devices of the invention;
FIG. 6 a shows a low-pressure process apparatus of a second embodiment of the invention;
FIG. 6 b shows a housing detached from the low-pressure process apparatus of the second embodiment.
 DETAILED DESCRIPTION OF THE INVENTION
The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
FIG. 2 a is a front view of a low-pressure process apparatus 100 of a first embodiment of the invention, comprising a base 111, a housing 120, lead grooves 140, first roller sets 150 and air cylinders (actuating devices) 160. A stage 112 is disposed on the base 111 supporting a substrate 113. The housing 120 is disposed on the base 111, and forms a chamber 114 with the base 111. The stage 112 and the substrate 113 are received in the chamber 114. An exhaust pipe 130 is disposed on the housing 120 extending into the chamber 114 for exhausting air therefrom. The actuating devices 160 are disposed on the base 111. The first roller sets 150 are disposed on the actuating devices 160. The lead grooves are disposed on two sides of the housing 114 corresponding to the first roller sets 150.
With reference to FIG. 2 b, the housing 120 is moveable between a first position (as shown in FIG. 2 a) and a second position (as shown in FIG. 2 b), wherein raising devices moving the housing 120 between the first and second positions are not shown to simplify the description. When the housing 120 is in the first position, the housing 120 and the base 111 form the chamber 114 for low-pressure processing of the substrate 113. When the process is finished, the housing 120 is moved to the second position allowing a robot (not shown) to access the substrate 113.
FIG. 2 c is a side view of the low-pressure process apparatus 100 when the housing 120 is in the second position. Each first roller set 150 comprises a supporting element 151 and a plurality of rollers 152. The rollers 152 are disposed on the supporting element 151. The supporting element 151 contacts the actuating device 160.
With reference to FIGS. 3 a and 3 b, the housing 120 is detachably disposed on the base 110. The user can remove the housing 120 from the base 110 to clean the housing 120 individually. When the housing 120 is detached from the base 110, the actuating devices 160 raise the first roller sets 150 to a first plane to contact the lead grooves 140, wherein the first roller sets 150 support and move the housing 120. In a modified embodiment, the actuating devices 160 further raise the housing 120 and the first roller sets 150 after the first roller sets 150 contact the lead grooves 140. With reference to FIG. 3 c, after the first roller sets 150 are raised to the first plane and contact the lead grooves 140, the housing 120 is moved to a transmission device 200 in a first horizontal direction y. The transmission device 200 comprises second roller sets 210 located on the first plane. The housing 120 is moved on the first roller sets 150 and the second roller sets 210 by the lead grooves 140.
FIG. 4 a shows the low-pressure process apparatus 100 of the invention disposed in substrate process equipment 300. The substrate process equipment 300 comprises a plurality of stockers 310, a cleaning unit (first process apparatus) 320, a photoresist coating apparatus (second process apparatus) 330, low-pressure process apparatus 100, an exposure unit 340 and robots 350, wherein the cleaning unit (first process apparatus) 320, the photoresist coating apparatus (second process apparatus) 330, and the low-pressure process apparatus 100 are arranged along a second horizontal direction x. With reference to FIG. 4 b, when the housing 120 is detached, the housing 120 is moved to the transmission device 200 in the first horizontal direction y perpendicular to the second horizontal direction x.
The housing 120 of the invention is detached and removed from the base 111 to be cleaned. Thus, when the original housing (first housing) is cleaned, another housing (second housing) can be disposed on the base 111 to continue the low-pressure process. Shutdown time of the low-pressure process apparatus is thus shortened, and yield and cost are conserved.
The low-pressure process apparatus 100 of the invention can be utilized drying organic solvents, such as photoresist (for example, resin).
With reference to FIG. 5, the housing 120 is moved between the first position and the second position by the raising devices 170 and the supporting structures 122. Each raising device 170 comprises a supporting rod 171. The supporting structures 122 are disposed on the housing 120. The supporting rods 171 are connected to the supporting structures 122. The raising devices 170 raise the housing 120 by the supporting rods 171. The supporting rods 171 abut the supporting structures 122 for easy detachment.
FIG. 6 a shows a low-pressure process apparatus 100′ of a second embodiment of the invention, wherein the housing 120′ comprises a gate 121 disposed on a back side thereof. Thus, in the second embodiment, when the robot accesses the substrate 113, the housing 120′ is not raised. With reference to FIG. 6 b, when the housing 120′ is detached to be cleaned, the actuating devices 160 directly push the first roller sets 150 and the housing 120′. In the second embodiment of the invention, there is no additional device to raise the housing 120′.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (7)

What is claimed is:
1. A low-pressure process apparatus for processing a substrate, comprising:
a base;
a stage, disposed on the base supporting the substrate;
a housing, detachably disposed on the base and moving between a first position and a second position, wherein when the housing is in a first position, the housing and the base form a chamber to receive the stage; and
at least one first roller set, wherein when the housing is detached, the first roller set contacts and supports the housing to facilitate movement thereof in a first horizontal direction.
2. The low-pressure process apparatus as claimed in claim 1, wherein the housing comprises at least one lead groove disposed thereon corresponding to the first roller set.
3. The low-pressure process apparatus as claimed in claim 1, further comprising at least one actuating device disposed on the base connecting the first roller set, wherein when the housing is in the second position, the actuating device pushes the first roller set to a first plane to contact and support the housing.
4. The low-pressure process apparatus as claimed in claim 3, wherein the actuating device is an air cylinder.
5. A low-pressure process apparatus for processing a substrate, comprising:
a base;
a stage, disposed on the base supporting the substrate;
a housing, detachably disposed on the base, wherein the housing and the base form a chamber to receive the stage, and the housing comprises a gate disposed thereon;
at least one actuating device; and
at least one first roller set connecting the actuating device, wherein when the housing is detached, the actuating device pushes the first roller set and the housing, and the housing contacts the first roller set to be moved in a first horizontal direction via the first roller set.
6. The low-pressure process apparatus as claimed in claim 5, wherein the housing comprises at least one lead groove disposed thereon corresponding to the first roller set.
7. The low-pressure process apparatus as claimed in claim 5, wherein the actuating device is an air cylinder.
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US13/886,768 US8950046B2 (en) 2005-12-28 2013-05-03 Low-pressure process apparatus

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US11/421,501 US7958612B2 (en) 2005-12-28 2006-06-01 Low-pressure process apparatus
US13/085,209 US8458872B2 (en) 2005-12-28 2011-04-12 Low-pressure process apparatus

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US8950046B2 (en) 2015-02-10

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