JP4576217B2 - Film forming apparatus and maintenance method of film forming apparatus - Google Patents

Description

  The present invention relates to a film forming apparatus, and more particularly to a film forming apparatus having a new structure.

  Solar cells that generate electricity in response to light are known. As one of them, a thin-film silicon solar cell in which a power generation layer such as amorphous silicon or microcrystalline silicon is formed on a large substrate is known. As a film forming apparatus for manufacturing such a solar cell, for example, the following techniques are known.

  JP-A-2001-127133 discloses a cluster type vacuum processing system. In this cluster type vacuum processing system, substrates are successively transferred to a plurality of processing chambers for processing. A common transfer chamber, a plurality of vacuum processing chambers, a load chamber, an unload chamber, and at least three transfer carts are provided. The common transfer chamber is located in the center. The plurality of vacuum processing chambers are arranged around the common transfer chamber, are provided to be able to communicate with the common transfer chamber via gate valves, respectively, and process the substrate in a vacuum atmosphere. The load chamber is provided so as to be able to communicate with the common transfer chamber via a gate valve, and a substrate is loaded therein. The unload chamber is provided so as to be able to communicate with the common transfer chamber via a gate valve, and the substrate is carried out. At least three transfer carts transfer substrates between the vacuum processing chamber, the common transfer chamber, the load chamber, and the unload chamber.

  Japanese Laid-Open Patent Publication No. 2001-120985 discloses a vertical substrate processing apparatus. This vertical substrate processing apparatus performs vacuum processing in a state where the substrate is stood up. It has a film-forming unit and a substrate heating heater respectively disposed in the film-forming chamber. The film forming unit includes a film forming unit temperature control heater, a gas blowing type ladder electrode, an exhaust gas cover, a heater cover, and an exhaust means. The film forming unit temperature control heater is said to be placed against the center. The gas blowing type ladder electrode is disposed on both sides of the film forming unit temperature control heater via a film forming unit cover. The exhaust gas cover surrounds the temperature control heater, the film forming unit cover, and the ladder electrode except for the gas blowing portion of the ladder electrode. The heater cover is disposed on the back side of the ladder electrode and supports the substrate. The exhaust means exhausts the inside of the exhaust gas cover.

  In these apparatuses, each film forming unit in the film forming chamber is large in order to cope with a large substrate. Therefore, the film forming apparatus becomes large and a lot of space is required. Since the film forming unit is large, it is heavy, and maintenance work takes time and effort. Further, since it is necessary to perform maintenance work in the film forming chamber, it is necessary to provide a work space not directly related to film forming. Therefore, the film forming chamber is further enlarged due to an area unnecessary for film formation, and as a result, the film forming apparatus is also enlarged. A technique capable of facilitating maintenance work is desired. A technique capable of downsizing a film forming apparatus is required.

JP 2001-127133 A JP 2001-120985 A

  Accordingly, an object of the present invention is to provide a film forming apparatus capable of efficiently performing maintenance work on a large film forming chamber.

  Another object of the present invention is to provide a film forming apparatus capable of downsizing the film forming chamber and downsizing the entire apparatus.

  Hereinafter, means for solving the problem will be described using the numbers and symbols used in the best mode for carrying out the invention. These numbers and symbols are added in parentheses in order to clarify the correspondence between the description of the claims and the best mode for carrying out the invention. However, these numbers and symbols should not be used for interpreting the technical scope of the invention described in the claims.

Therefore, in order to solve the above problems, the film forming apparatus of the present invention includes a film forming chamber (6) and a moving mechanism (20) for forming a film on the substrate (8). The film forming chamber (6) has a film forming chamber main body (6b) including one electrode (2) for discharging during film forming and a film forming chamber lid (6a) including the other electrode (3) for discharging. ). The film forming chamber body (6b) and the film forming chamber lid (6a) are inclined at a predetermined angle with respect to the vertical direction. The film forming chamber lid (6a) closes the opening of the film forming chamber main body (6b). The moving mechanism (20) includes a first direction moving mechanism (21) and a first direction (X) for moving the film forming chamber lid (6a) in a first direction (X) away from the film forming chamber main body (6b). A film forming chamber body (6b) and a film forming chamber lid (6a) are moved in a second direction (Y) perpendicular to the second direction (Y) to a position where they do not overlap each other. The film forming chamber lid (6a) is moved in a predetermined direction (X, Y) to open or close the film forming chamber lid (6a). When the moving mechanism (20) opens the film forming chamber lid (6a), the film forming chamber lid (6a) and the film forming chamber main body (6b) are separated.
Since the film forming chamber lid (6a) and the film forming chamber main body (6b) are separated, the operator can form the film forming chamber lid (6a) and the film forming chamber in an area outside the film forming chamber (6). Maintenance work of the main body (6b) can be performed. Thereby, it is not necessary to provide an area for maintenance work in the film forming chamber (6).
In addition, the film forming chamber lid (6a) and the film forming chamber main body (6b), which are individually separated, can move to a position where they do not overlap with each other in the second direction (Y), so the film forming chamber main body (6b) A wide space can be secured in front of the opening of the film forming chamber lid (6a). Thereby, maintenance work can be separately performed on the film forming chamber lid (6a) and the film forming chamber body (6b), and the work efficiency can be improved.
Maintenance work can be performed separately for each electrode for discharging, and the work can be made more efficient.
Since the film forming chamber body (6b) and the film forming chamber lid (6a) are inclined at a predetermined angle with respect to the vertical direction, an increase in the size of the film forming chamber (6) associated with the large substrate (8) is suppressed. At the same time, the substrate (8) can be held more easily.

In the film forming apparatus, the first direction (X) is preferably a normal direction to the opening surface .
By doing in this way , the area | region which performs a maintenance operation | work with a small movement amount compared with another direction is securable.

In the film forming apparatus, the first direction moving mechanism (21) includes a first track (26) extending in the first direction (X) and a film forming chamber lid (6a) on the first track (26). It is preferable that the 1st support part (25 + 24) supported so that a movement is possible is included.
Since it moves on the 1st track | orbit (26), the lid | cover for film formation chamber (6a) can be moved stably and easily.

In the film forming apparatus, the second direction (Y) is preferably a direction parallel to the opening surface of the opening.
By setting the direction parallel to the opening surface, it is possible to narrow the area necessary for the movement of the film forming chamber lid (6a) as compared with other directions.

In the film forming apparatus, the second moving mechanism (22) moves on the second track (28) along the second track (28) extending in the second direction (Y) and the first direction moving mechanism (21). It is preferable that the 2nd support part (27) supported so that it is possible is included.
Since it moves on the 2nd track | orbit (28), the lid | cover for film forming chambers (6a) can be moved stably and easily.

In the film forming apparatus, the film forming chamber main body (6b) has a plurality of doors (19) provided on the side surface opposite to the film forming chamber lid (6a) in the film forming chamber main body (6b). Is preferred.
Maintenance work can be performed from the surface opposite to the opening of the film forming chamber body (6b), and the maintenance work can be made more efficient.

In order to solve the above problems, a parallel type film forming apparatus of the present invention includes a central transfer device (9) and a plurality of film forming devices (1). The central transfer device (9) is moved by a transfer device (not shown) that transfers the substrate (8). The plurality of film forming apparatuses (1) are connected to the central transfer apparatus (9) through gate valves (not shown). The substrate (8) is transferred by the transport device. The plurality of film forming apparatuses (1) is described in any one of the above paragraphs. Each of the plurality of film forming apparatuses (1) is connected to the central transfer apparatus (9) so as to be adjacent to each other.
A plurality of film forming apparatuses (1) can be installed with a small occupied area, and a multilayer film can be formed in-situ. Maintenance work of a large film forming chamber can be made efficient, and the film forming chamber can be downsized.

In order to solve the above problems, a maintenance method for a film forming apparatus according to the present invention includes: (a) a film forming chamber body (6b) including one electrode (2) for discharging during film forming; and a film forming chamber. A film forming chamber lid (6a) that covers the opening of the main body (6b) and includes the other electrode (3) for discharge, and is formed of the film forming chamber main body (6b) and the film forming chamber lid (6a). In each of the film forming chambers (6) for forming the film on the substrate (8), each of which is inclined at a predetermined angle with respect to the vertical direction, a moving mechanism for movably holding the film forming chamber lid (6a). The film forming chamber lid (6a) is moved in the first direction (X) using the first direction moving mechanism (21) of (20), and the film forming chamber lid (6a) is moved from the film forming chamber body (6b). And (b) the film forming chamber lid (6a) moved in the first direction (X), and the second direction moving mechanism (20) of the moving mechanism (20). 2) to move the film forming chamber body (6b) and the film forming chamber lid (6a) to a position where they do not overlap each other in the second direction (Y) perpendicular to the first direction (X). It has.
A wide maintenance work area can be secured, and the maintenance efficiency of the large film forming chamber can be improved.

  According to the present invention, in a film forming apparatus, maintenance work for a large film forming chamber can be efficiently performed. In addition, the film forming chamber can be downsized, the entire apparatus can be downsized, and maintenance work can be performed efficiently.

Hereinafter, embodiments of a film forming apparatus of the present invention will be described with reference to the accompanying drawings.
First, the configuration of the embodiment of the film forming apparatus of the present invention will be described. FIG. 1 is a conceptual diagram showing a configuration of an embodiment of a film forming apparatus of the present invention. The film forming apparatus 1 includes a film forming chamber 6, a moving mechanism 20, and a table 15. In the drawing, an XYZ direction is indicated by an arrow 100. The configuration related to gas supply is omitted (the same applies hereinafter).

  The film forming chamber 6 forms a film on the substrate inside at a desired degree of vacuum. The film forming chamber 6 basically has a rectangular parallelepiped structure and is held on a table 15. The film forming chamber 6 includes a film forming chamber main body 6b and a film forming chamber lid 6a. The film forming chamber main body 6b is a portion on the right side of the line indicated by AA in the drawing. The film forming chamber lid 6a is a left portion. The film forming chamber main body 6b and the film forming chamber lid 6a are integrated to form a vacuum container when forming a film on the substrate 8 using discharge (hereinafter also referred to as “film forming”) (FIG. 1). The surface indicated by AA is sealed with, for example, an O-ring.

  When performing the maintenance operation of the film forming chamber 6 (hereinafter also referred to as “maintenance operation”), the film forming chamber lid 6a is separated in the X direction by the moving mechanism 20 and separated from each other (described later). Therefore, the operator can perform maintenance work separately on the film forming chamber body 6b and the film forming chamber lid 6a using the region outside the film forming chamber 6. That is, even when the film forming chamber 6 is large, maintenance work can be easily performed. Further, it is not necessary to provide an area for maintenance work in the film forming chamber 6, and the film forming chamber 6 can be made smaller.

  The film forming chamber body 6 a includes a substrate table 2, a soaking plate 5, a soaking plate moving mechanism 11, a holding unit 14, a high vacuum exhaust pump 31, a valve 32, a valve 34, and a low vacuum exhaust pump 35.

  The substrate table 2 is a metal plate having holding means (not shown) that can hold the substrate 8. During film formation, it becomes one electrode (example: ground side). The substrate table 8 is held by the soaking plate 5, and one surface is in close contact with the surface of the soaking plate 5. Then, the other surface is brought into close contact with the surface of the substrate 8 during film formation. By being in close contact with the soaking plate 5 and the substrate 8, it is also in close thermal contact so that heat exchange between the soaking plate 5 and the substrate 8 can be easily performed. Thereby, the temperature of the board | substrate 8 can be made into desired temperature with the soaking | uniform-heating board 5, and the whole board | substrate 8 can be made uniform temperature.

  The soaking plate 5 has a substantially uniform temperature as a whole, and has a function of equalizing the temperature of the substrate table 2 in contact therewith. Manufactured with a material having good thermal conductivity so that the entire temperature is substantially uniform. In addition, it has a temperature adjustment function for heating, cooling, and keeping the substrate table 2 at a desired temperature. It includes a structure or a heater through which a heat medium controlled at a high temperature or a low temperature flows so as to achieve a desired temperature. Thereby, when the surface of a plate-like member (example: substrate table 2, substrate 8) contacts the surface of the soaking plate 5, the soaking plate 5 becomes a heat path, and the temperature distribution of the member is relaxed, The member can be maintained at a substantially uniform desired temperature.

  The soaking plate moving mechanism 11 includes a drive part 11a and a support part 11b. The drive unit 11a is provided outside the side surface (the right side in FIG. 1) of the film forming chamber body 6b. The support portion 11b is coupled to the drive portion 11a and extends into the film forming chamber 6 through a sealing means (not shown). The soaking plate 5 (and the substrate table 2) is held so as to be substantially parallel to the side surface (the right side in FIG. 1) of the film forming chamber 6.

  By driving the driving unit 11a, the support unit 11b enters and exits the film forming chamber 6 in a direction perpendicular to the side surface (right side in FIG. 1) of the film forming chamber body 6b. At the time of film formation, the support portion 11b enters the film formation chamber 6 and brings the soaking plate 5 (and the substrate table 2) closer to the ladder electrode 3 as the other electrode (high-frequency power input side). When the substrate 8 is brought into or out of the film forming chamber 6 (hereinafter also referred to as “substrate transport”) or during maintenance work, the soaking plate 5 (and the substrate table 2) is moved away from the ladder electrode 3.

  The holding unit 14 holds the film forming chamber main body 6b on the top of the table 15 with an inclination of θ = 7 ° to 12 ° with respect to the vertical direction (Z direction). More preferably, the tilt is about 10 °. As a result, the surface of the substrate table 2 that contacts the substrate 8 is directed upward by 7 ° to 12 ° (more preferably about 10 °) with respect to the vertical direction (Z direction). It is preferable that the substrate 8 be stood and transported or formed into a film because the work can be performed in a narrow work area as compared with the case where the substrate 8 is laid down. When the substrate 8 is held, it is preferable to slightly tilt the substrate 8 from the vertical as described above, because the substrate 8 can be held with little effort by utilizing its own weight. This facilitates the holding and close contact of the substrate 8 with the substrate table 2.

  The high vacuum pump 31 exhausts the gas in the film forming chamber 6. This is a vacuum pump for high vacuum exhaust. The high vacuum pump 31 is exemplified by a turbo molecular pump. The valve 32 opens and closes the path between the high vacuum exhaust pump 31 and the film forming chamber 6. The low vacuum pump 35 exhausts the gas in the film forming chamber 6. This is a vacuum pump for roughing exhaust. The low vacuum pump 35 is exemplified by a dry pump. The valve 34 opens and closes the path between the low vacuum exhaust pump 35 and the film forming chamber 6. The positions of the high vacuum exhaust pump 31 and the low vacuum exhaust pump 35 may be upside down.

  As described above, since the film forming chamber 6 can be made small, the capacity of each vacuum pump can be made small. Thereby, a pump can be provided also in the upper part of the film forming chamber 6. That is, high vacuum and roughing can be attached separately in the top and bottom. Thereby, the upper space can be used effectively, and the installation area of the film forming apparatus can be reduced.

  The film forming chamber lid 6 a includes a ladder electrode 3, a deposition preventing plate 4, a support portion 7, a high frequency cable 12, and a matching box 13.

  The ladder electrode 3 is a metal bar formed in a ladder shape. During film formation, it becomes the other electrode (example: high-frequency power input side) with respect to the substrate table 2 (example: ground side) which is one electrode. A film is formed on the substrate 8 by the plasma generated by the discharge between the ladder electrode 3 and the substrate table 2.

  One of the high-frequency cables 12 is electrically connected to the ladder electrode 3 and the other to the matching box 13. The RF power supplied from the matching box 13 is supplied to the ladder electrode 3. The matching box 13 is supplied with RF power from an RF power source (not shown). Then, impedance matching between the high frequency cable 12 and the ladder electrode 3 is performed, and RF power is supplied to the ladder electrode 13 via the high frequency cable 12.

  The support portion 7 extends vertically inward from the side surface (left side in FIG. 1) of the film forming chamber lid 6a. The adhesion preventing plate 4 is held so as to cover the space opposite to the substrate table 2 in the ladder electrode 3 by being coupled to the adhesion preventing plate 4. At the same time, it is insulatively coupled to the ladder electrode 3 and holds the ladder electrode 3 so as to be substantially parallel to the side surface (left side in FIG. 1) of the film forming chamber 6.

  The deposition preventing plate 4 is grounded and limits the range in which the film is formed by suppressing the range in which the plasma spreads. In the case of FIG. 1, no film is formed on the wall on the back side (the side opposite to the substrate 8) of the deposition preventing plate 4 inside the film forming chamber 6.

  The base 15 holds the film forming chamber lid 6a via the moving mechanism 20 provided on the upper surface. Similarly, the film forming chamber main body 6b is held via a holding portion 14 provided on the upper surface. An area including the low vacuum pump 35 is provided inside. The base 15 may not be provided, and in that case, the moving mechanism 20 is provided on the bottom surface of the room, for example. The low vacuum evacuation pump 35 is provided, for example, on the side of the film forming chamber body 6b that does not hinder the movement of the film forming chamber lid 6a.

  The moving mechanism 20 moves the film forming chamber lid 6a in the X direction and the Y direction. An X-direction moving mechanism 21 and a Y-direction moving mechanism 22 are provided.

  The X-direction moving mechanism 21 moves the film forming chamber lid 6a in the X direction. The X direction moving mechanism 21 includes a holding portion 24, a slider 25, and a rail 26. The holding unit 24 holds the film forming chamber lid 6a at an angle θ that is the same as that of the film forming chamber main body 6b with respect to the vertical direction (Z direction). The slider 25 supports the film forming chamber lid 6a through the holding portion 24 so as to be movable. The slider 25 is guided by the rail 26 and moves within a predetermined range on the rail 26 in the X direction. The rail 26 is installed on the upper surface of the slider 27 of the Y-direction moving mechanism 22 so as to extend in the X direction.

  The Y-direction moving mechanism 22 moves the film forming chamber lid 6a in the Y direction. The Y-direction moving mechanism 22 includes a slider 27 and a rail 28. The slider 27 supports the film forming chamber lid 6a through the X-direction moving mechanism 21 so as to be movable. The slider 27 is guided by the rail 28 and moves within a predetermined range on the rail 28 in the Y direction. As the slider 27 moves in the Y direction, the film forming chamber lid 6a moves in the Y direction. The rail 28 is installed on the upper surface of the base 15 so as to extend in the Y direction.

  FIG. 2 is a conceptual diagram showing the configuration of the embodiment of the film forming apparatus of the present invention. Each configuration indicated by each symbol is as described in FIG. In the drawing, an XYZ direction is indicated by an arrow 100. This figure shows a state in which the film forming chamber lid 6a in the film forming chamber 6 of the film forming apparatus 1 of FIG. 1 has been moved to the positive side in the X direction (left side in the figure) by the moving mechanism 20. As shown in this figure, the film forming chamber lid 6a can be separated from the film forming chamber main body 6b during maintenance work.

  The moving mechanism 20 will be further described. FIG. 3 is a perspective view showing the configuration of the embodiment of the moving mechanism 20 of the present invention.

  The two rails 28 are provided on the upper surface of the base 15 so as to extend in directions parallel to each other and substantially parallel to the Y direction. Two sliders 27 are installed on the two rails 28 so as to be movable at an interval smaller than the width in the Y direction of the film forming chamber lid 6a. The slider 27 is guided by the two rails 28 and moves in the Y direction (D2 direction). The slider 27 is electrically operated and is operated by, for example, a switch (not shown) attached to the side surface of the film forming chamber lid 6a.

  A rail 26 is provided on the upper surface of each of the two sliders 27 so as to extend in a direction substantially parallel to the X direction. A slider 25 is movably provided on each rail 26. The slider 25 is guided by the rail 26 and moves in the X direction (D1 direction). The lower part of the film forming chamber lid 6 a is held on the upper surface of each of the two sliders 25. The slider 25 is electrically operated and is operated by, for example, a switch (not shown) attached to the side surface of the film forming chamber lid 6a.

  As the slider 25 and the rail 26 and the slider 27 and the rail 28, for example, those commercially available as LM Guide (registered trademark) can be used.

  FIG. 4 is a perspective view showing the configuration of the embodiment of the film forming apparatus of the present invention. In the drawing, an XYZ direction is indicated by an arrow 100.

A plurality of doors 19 are provided on the side surface of the film forming chamber body 6b opposite to the film forming chamber lid 6a. Door 19, and a not shown hinge and lock mechanism. Usually, it is locked and closed by a lock mechanism. For example, an O-ring seal is used as the seal portion. Opened during maintenance work. Thereby, the maintenance work of the area | region of the lower side (side with the door 19) of the substrate table 2 can be performed, without removing the substrate table 2. FIG. A similar door (not shown) may be provided on the side surface of the film forming chamber lid 6a opposite to the film forming chamber body 6b. Maintenance work can be performed on the lower region (side with the door) of the protective plate 4 without removing the protective plate 4.
Each configuration indicated by the other symbols is as described in FIG.

  The film forming chamber lid 6a is normally located at a position B1 shown in the figure, and forms the film forming chamber 6 integrally with the film forming chamber body 6b. During the maintenance work, the film forming chamber lid 6a is moved in the X direction as indicated by the arrow D1 by the X direction moving mechanism 21 and reaches the position B2. When the position B2 is sufficiently away from the position B1 (the rail 26 of the X-direction moving mechanism 21 is sufficiently long), the maintenance operation of the film forming chamber lid 6a or the film forming chamber main body 6b is performed in that state. It is also possible. In this case, the area of the table 15 in the Y direction can be narrowed.

  The film forming chamber lid 6a is further moved in the Y direction as indicated by the arrow D2 by the Y direction moving mechanism 22, and reaches the position B3. Maintenance work is performed in this state. In this case, the position B2 and the position B1 only need to be slightly separated so as not to hinder movement in the Y direction. That is, the area of the table 15 in the X direction can be narrowed. Further, since a wide space can be secured in front of the opening of the film forming chamber main body 6b (next to the film forming chamber lid 6a at the position B3), the maintenance operation of the film forming chamber main body 6b can be easily performed. On the other hand, since a wide space can be secured in front of the opening of the film forming chamber lid 6a (next to the film forming chamber main body 6b), the maintenance operation of the film forming chamber lid 6a can be easily performed.

  Since the maintenance work can be performed outside the film forming chamber 6, it is not necessary to secure an area necessary for the maintenance work in the film forming chamber 6. Thereby, effects such as downsizing the film forming chamber 6 (vacuum container), downsizing the entire film forming apparatus, improving the vacuum exhaust speed, and reducing impurities in the film forming chamber can be obtained. Further, since the film forming chamber main body 6b and the film forming chamber lid 6a are completely separated from each other, they can be independently maintained, work can be easily performed, and work time can be shortened.

Next, the operation in the embodiment of the film forming apparatus of the present invention will be described.
During the maintenance work, first, the pressure in the film forming chamber 6 of the film forming apparatus 1 is set to atmospheric pressure by a leak valve (not shown). Next, the switch of the X direction moving mechanism 21 is turned on by the operator, and the two sliders 25 move on the rail 26 by a predetermined distance in the X direction. Thereby, the film forming chamber lid 6a moves away from the film forming chamber main body 6b in the direction D1 from the position B1, and reaches the position B2. That is, the film forming chamber lid 6a is separated from the film forming chamber main body 6b. Thereafter, the switch of the Y-direction moving mechanism 22 is turned on by the operator, and the two sliders 27 move on the rail 28 by a predetermined distance in the Y direction. Thereby, the film forming chamber lid 6a moves further away from the film forming chamber main body 6b in the direction D2 from the position B2, and reaches the position B3. That is, a wide space can be secured in front of the opening of the film forming chamber body 6b (next to the film forming chamber lid 6a at position B3). At the same time, a wide space can be secured also in front of the opening of the film forming chamber lid 6a (next to the film forming chamber main body 6b).

  By the above operation, the film forming chamber main body 6b and the film forming chamber lid 6a are moved to positions where maintenance work can be easily performed.

  The above-described operation is performed by the operator turning on the switches of the X-direction moving mechanism 21 and the Y-direction moving mechanism 22, but the operation of each switch can be controlled using a computer. For example, a sensor capable of detecting the positions of the slider 25 and the slider 27 may be provided in each moving mechanism, and a program for executing the above operation may be executed based on position information from the sensors.

  Next, an application example in the embodiment of the film forming apparatus of the present invention will be described. FIG. 5 is a perspective view showing an application example of the embodiment of the film forming apparatus of the present invention. The parallel type film forming apparatus 10 includes a plurality of film forming apparatuses 1, a conveyor 41, a delivery table 42, a substrate delivery device 43, a load chamber 44, a central transfer chamber 9, an unload chamber 45, a substrate delivery device 46, and a delivery table. 47 and a conveyor 48 are provided.

  The plurality of film forming apparatuses 1 are attached to both sides of the central transfer chamber 9 so as to be adjacent to each other. Each film forming apparatus 1 has a configuration shown in FIGS. The film forming apparatus 1 and the central transfer chamber 9 are connected by a gate valve (not shown), and the substrate 8 can be transferred in a vacuum state. The film forming apparatus 1 is supplied with a substrate 8 from a substrate transfer apparatus (not shown) that transfers the substrate 8 moving in the central transfer chamber 9, and forms a predetermined film on the substrate 8. The substrate 8 after film formation is recovered by the substrate transfer device. The film forming apparatus 10 can form a plurality of films in-situ without exposure to the atmosphere by transferring the substrate 8 to the plurality of film forming apparatuses 1 by the substrate transfer apparatus.

  The substrate 8 conveyed by the conveyor 41 is placed on the delivery table 42. The substrate 8 on the delivery table 42 is transferred from the delivery table 42 to the load chamber 44 opened to the atmosphere by the substrate moving device 51 of the substrate delivery device 43. The evacuated substrate 8 in the load chamber 44 is taken out by the substrate transfer device in the central transfer chamber 9 and transferred to a predetermined film forming apparatus 1. Thereafter, the substrate 8 formed with a plurality of films is transferred to the unload chamber 45 evacuated by the substrate transfer apparatus. The substrate 8 in the unload chamber 45 released to the atmosphere is transferred from the unload chamber 45 onto the delivery table 47 by the substrate moving device 52 of the delivery device 46. The substrate 8 on the delivery table 47 is conveyed to the next apparatus by the conveyor 48. The transfer and delivery of the substrate is performed using a technique exemplified in a conventional conventional cluster type vacuum processing system (Japanese Patent Laid-Open No. 2001-127133), for example.

  Here, the film forming apparatuses 1 are arranged in 3 rows and 2 columns, but it may be n rows and 2 columns (n is a natural number of 4 or more). In this case, more types of films can be formed in-situ without exposure to the atmosphere. In addition, since the film forming apparatus 1 is used, maintenance efficiency can be improved. Such a film-forming apparatus 10 occupies less area as a whole when compared to a conventional cluster-type vacuum processing system (Japanese Patent Laid-Open No. 2001-127133) when a plurality of film-forming apparatuses 1 are added. This is preferable. Thus, the film-forming apparatus 10 of the present invention to which the film-forming apparatus 1 of the present invention is applied can simultaneously reduce the installation area of the main body portion of the film-forming apparatus 10 and improve the maintenance efficiency. .

A reference example of the film forming apparatus of the present invention will be described. FIG. 6 is a perspective view showing a reference example of the film forming apparatus of the present invention. The serial film forming apparatus 10 a includes a plurality of film forming apparatuses 1 connected laterally through gate valves 51. The film forming apparatuses 1 on both sides may be a load chamber and an unload chamber. When the number of films to be formed increases, the film forming apparatus 1 can be further connected through the gate valve 51.

  During the maintenance work, the film forming chamber lid 6a of the film forming chamber 6 is moved only in the X direction on the rail 26. By charging and separating the distance between the film forming chamber lid 6a and the film forming chamber main body 6b, it becomes possible to maintain both of them simultaneously.

  In FIG. 5, when the substrate 1 is moved to each film forming apparatus 1, the central transfer chamber 9 is interposed. In the case of FIG. 6, when the kind and order of the laminated films to be formed are determined, it can be used when the films are continuously formed without using the central transfer chamber. In that case, the area of the central transfer chamber can be saved.

FIG. 1 is a conceptual diagram showing a configuration of an embodiment of a film forming apparatus of the present invention. FIG. 2 is a perspective view showing the configuration of the embodiment of the moving mechanism of the present invention. FIG. 3 is a conceptual diagram showing the configuration of the embodiment of the film forming apparatus of the present invention. FIG. 4 is a perspective view showing the configuration of the embodiment of the film forming apparatus of the present invention. FIG. 5 is a perspective view showing an application example of the embodiment of the film forming apparatus of the present invention. FIG. 6 is a perspective view showing a reference example of the film forming apparatus of the present invention.

DESCRIPTION OF SYMBOLS 1 Film forming apparatus 2 Substrate table 3 Ladder electrode 4 Depositing plate 5 Heat equalizing plate 6 Film forming chamber 6a Film forming chamber lid 6b Film forming chamber main body 7 Support part 9 Central transfer chamber 10, 10a Film forming device 11 Heat equalizing plate Moving mechanism 11a Driving unit 11b Supporting unit 12 High-frequency cable 13 Matching box 14 Holding unit 15 Base 19 Door 20 Moving mechanism 21 X-direction moving mechanism 22 Y-direction moving mechanism 24 Holding unit 25 Slider 26 Rail 27 Slider 28 Rail 31 For high vacuum exhaust Pump 32, 34 Valve 35 Low vacuum pump 41, 48 Conveyor 42, 47 Delivery platform 43, 46 Substrate delivery device 44 Load chamber

Claims (8)

A film forming chamber body provided with one electrode for discharge during film formation and a film forming chamber lid provided with the other electrode for discharge and covering the opening of the film forming chamber main body, and a film on the substrate A film forming chamber for forming a film;
A mechanism for moving the film forming chamber lid in a predetermined direction to open or close the film forming chamber lid;
Comprising
The deposition chamber body and a lid for said deposition chamber is inclined a predetermined angle with respect to the vertical direction,
The moving mechanism includes a first direction moving mechanism that moves the film forming chamber lid in a first direction away from the film forming chamber main body, and a second direction orthogonal to the first direction. A film forming apparatus provided with a second direction moving mechanism for moving the film chamber lid to a position where they do not overlap each other. The film forming apparatus according to claim 1,
The film forming apparatus, wherein the first direction is a normal direction to the opening surface. In the film forming apparatus according to claim 1 or 2,
The first direction moving mechanism includes:
A first track extending in the first direction;
A film forming apparatus comprising: a first support portion that supports the film forming chamber lid so as to be movable on the first track. In the film forming apparatus of any one of Claims 1 thru | or 3,
The film forming apparatus, wherein the second direction is a direction parallel to the opening surface of the opening. The film forming apparatus according to any one of claims 1 to 4,
The second moving mechanism includes:
A second track extending in the second direction;
A film forming apparatus comprising: a second support portion that supports the first direction moving mechanism so as to be movable on the second track. In the film forming apparatus according to any one of claims 1 to 5,
The film forming chamber body is
A film forming apparatus having a plurality of doors provided on a side surface opposite to the film forming chamber lid in the film forming chamber main body. A central transfer device in which a transfer device for transferring a substrate moves;
A plurality of film forming apparatuses according to any one of claims 1 to 6, wherein the plurality of film forming apparatuses are connected to the central transfer apparatus via a gate valve and transfer the substrate by the transfer apparatus.
Each of the plurality of film forming apparatuses is a parallel type film forming apparatus connected to the central transfer device so as to be adjacent to each other. (A) a film-forming chamber body provided with one electrode for discharging during film formation; and a film-forming chamber lid provided with the other electrode for discharging while closing the opening of the film-forming chamber body, Each of the film forming chamber main body and the film forming chamber lid is inclined at a predetermined angle with respect to the vertical direction, and the film forming chamber cover can be moved in the film forming chamber for forming a film on the substrate. Moving in a first direction away from the film forming chamber main body using a first direction moving mechanism of the moving mechanism to be held in, and separating the film forming chamber lid from the film forming chamber main body,
(B) The film forming chamber lid moved in the first direction is moved in the second direction perpendicular to the first direction by using the second direction moving mechanism of the moving mechanism. And a step of moving the membrane chamber lid to a position where they do not overlap each other.

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