JP2007123942A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2007123942A JP2007123942A JP2007030095A JP2007030095A JP2007123942A JP 2007123942 A JP2007123942 A JP 2007123942A JP 2007030095 A JP2007030095 A JP 2007030095A JP 2007030095 A JP2007030095 A JP 2007030095A JP 2007123942 A JP2007123942 A JP 2007123942A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 135
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 abstract 2
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
- H01L2225/06568—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
【解決手段】本発明は、略中央部に穴が設けられている配線板5と、配線板5の穴内に配置される半導体チップ2と、配線板5に設けられ半導体チップ2とリード線4を介して導通する接続端子6と、配線板5の穴の外側における上面および下面に設けられ、接続端子6と導通する上接続端子9および下接続端子8とを備える半導体パッケージ1を積層して成る半導体装置において、配線板5の穴内には、半導体チップ1、リード線4及び接続端子6を保護するモールド部7が設けられ、当該モールド部7の上面が配線板5の穴の外側における上面を越えないように配置されており、積層された半導体パッケージ1間において対向するパッド間がはんだで接続されることにより、はんだの周辺ならびに積層された半導体パッケージ間に空間が設けられるものである。
【選択図】図5
Description
Claims (5)
- 略中央部に穴が設けられている配線板と、
前記配線板の穴内に配置される半導体チップと、
前記配線板に設けられ前記半導体チップとリード線を介して導通する接続端子と、
前記配線板の穴の外側における上面および下面に設けられ、前記接続端子と導通するパッドとを備える半導体パッケージを積層して成る半導体装置において、
前記配線板の穴内には、前記半導体チップ、前記リード線及び前記接続端子を保護する封止部材が設けられ、当該封止部材の上面が前記配線板の穴の外側における上面を越えないように配置されており、
前記積層された半導体パッケージ間において対向する前記パッド間がはんだで接続されることにより、前記はんだの周辺ならびに前記積層された前記半導体パッケージ間に空間が設けられる
ことを特徴とする半導体装置。 - 前記配線板の穴の周縁には段差部が設けられ、その段差部に前記接続端子が設けられている
ことを特徴とする請求項1記載の半導体装置。 - 前記配線板の穴の周縁には複数の段差部が設けられ、その複数の段差部に前記接続端子が各々設けられている
ことを特徴とする請求項1記載の半導体装置。 - 前記パッドは前記配線板の表面および裏面にグリッド状に配置されている
ことを特徴とする請求項1記載の半導体装置。 - 前記半導体チップの前記リード線が接続されていない側の面が前記穴から露出している
ことを特徴とする請求項1記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007030095A JP2007123942A (ja) | 2007-02-09 | 2007-02-09 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007030095A JP2007123942A (ja) | 2007-02-09 | 2007-02-09 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002295672A Division JP3941654B2 (ja) | 2002-10-09 | 2002-10-09 | 半導体パッケージの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007123942A true JP2007123942A (ja) | 2007-05-17 |
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ID=38147343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007030095A Pending JP2007123942A (ja) | 2007-02-09 | 2007-02-09 | 半導体装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3050073A1 (fr) * | 2016-04-12 | 2017-10-13 | Mbda France | Systeme electronique pourvu d'une pluralite de fonctions electroniques interconnectees |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252342A (ja) * | 1993-02-22 | 1994-09-09 | Hitachi Ltd | 半導体装置 |
JPH0969587A (ja) * | 1995-08-30 | 1997-03-11 | Nec Kyushu Ltd | Bga型半導体装置及びbgaモジュール |
JPH1056109A (ja) * | 1996-08-12 | 1998-02-24 | Hitachi Ltd | 半導体装置 |
JPH11354566A (ja) * | 1998-06-08 | 1999-12-24 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2000340714A (ja) * | 1999-05-20 | 2000-12-08 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
JP2002076175A (ja) * | 2000-09-04 | 2002-03-15 | Sony Corp | 半導体パッケージおよびその製造方法 |
JP2003133480A (ja) * | 2001-10-30 | 2003-05-09 | Sharp Corp | 半導体装置及び積層型半導体装置並びに半導体装置の製造方法及び積層型半導体装置の製造方法 |
-
2007
- 2007-02-09 JP JP2007030095A patent/JP2007123942A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252342A (ja) * | 1993-02-22 | 1994-09-09 | Hitachi Ltd | 半導体装置 |
JPH0969587A (ja) * | 1995-08-30 | 1997-03-11 | Nec Kyushu Ltd | Bga型半導体装置及びbgaモジュール |
JPH1056109A (ja) * | 1996-08-12 | 1998-02-24 | Hitachi Ltd | 半導体装置 |
JPH11354566A (ja) * | 1998-06-08 | 1999-12-24 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2000340714A (ja) * | 1999-05-20 | 2000-12-08 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
JP2002076175A (ja) * | 2000-09-04 | 2002-03-15 | Sony Corp | 半導体パッケージおよびその製造方法 |
JP2003133480A (ja) * | 2001-10-30 | 2003-05-09 | Sharp Corp | 半導体装置及び積層型半導体装置並びに半導体装置の製造方法及び積層型半導体装置の製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3050073A1 (fr) * | 2016-04-12 | 2017-10-13 | Mbda France | Systeme electronique pourvu d'une pluralite de fonctions electroniques interconnectees |
EP3232471A1 (fr) * | 2016-04-12 | 2017-10-18 | MBDA France | Système électronique pourvu d'une pluralité de fonctions électroniques interconnectées |
WO2017178714A1 (fr) * | 2016-04-12 | 2017-10-19 | Mbda France | Système électronique pourvu d'une pluralité de fonctions électroniques interconnectées |
CN109075158A (zh) * | 2016-04-12 | 2018-12-21 | Mbda法国公司 | 设有多个互连的电子功能件的电子系统 |
CN109075158B (zh) * | 2016-04-12 | 2023-05-23 | Mbda法国公司 | 设有多个互连的电子功能件的电子系统 |
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