JP2007088464A - 改善された付着性を有する水性研磨パッド及びその製造方法 - Google Patents

改善された付着性を有する水性研磨パッド及びその製造方法 Download PDF

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Publication number
JP2007088464A
JP2007088464A JP2006252243A JP2006252243A JP2007088464A JP 2007088464 A JP2007088464 A JP 2007088464A JP 2006252243 A JP2006252243 A JP 2006252243A JP 2006252243 A JP2006252243 A JP 2006252243A JP 2007088464 A JP2007088464 A JP 2007088464A
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JP
Japan
Prior art keywords
polishing pad
polishing
dispersion
aqueous
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006252243A
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English (en)
Japanese (ja)
Other versions
JP2007088464A5 (enExample
Inventor
Chau H Duong
チャウ・エイチ・ドン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2007088464A publication Critical patent/JP2007088464A/ja
Publication of JP2007088464A5 publication Critical patent/JP2007088464A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2006252243A 2005-09-19 2006-09-19 改善された付着性を有する水性研磨パッド及びその製造方法 Pending JP2007088464A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71848905P 2005-09-19 2005-09-19

Publications (2)

Publication Number Publication Date
JP2007088464A true JP2007088464A (ja) 2007-04-05
JP2007088464A5 JP2007088464A5 (enExample) 2009-09-17

Family

ID=37776011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006252243A Pending JP2007088464A (ja) 2005-09-19 2006-09-19 改善された付着性を有する水性研磨パッド及びその製造方法

Country Status (7)

Country Link
US (2) US20070066195A1 (enExample)
JP (1) JP2007088464A (enExample)
KR (1) KR20070032609A (enExample)
CN (1) CN1935461A (enExample)
DE (1) DE102006042674A1 (enExample)
FR (1) FR2890882A1 (enExample)
TW (1) TW200720017A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008296333A (ja) * 2007-05-31 2008-12-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
JP2009056585A (ja) * 2007-08-15 2009-03-19 Rohm & Haas Electronic Materials Cmp Holdings Inc ケミカルメカニカルポリッシングのための相互侵入ネットワーク
JP2011530158A (ja) * 2008-04-29 2011-12-15 セミクエスト・インコーポレーテッド 研磨パッド組成物およびその製造方法ならびに使用
US8500932B2 (en) 2006-04-19 2013-08-06 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
CN112318363A (zh) * 2020-11-06 2021-02-05 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法

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US7655117B2 (en) 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
US7311590B1 (en) * 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
TW200927896A (en) * 2007-12-28 2009-07-01 Iv Technologies Co Ltd Polishing pad and polishing method
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
TWI518176B (zh) * 2015-01-12 2016-01-21 三芳化學工業股份有限公司 拋光墊及其製造方法
CN107717762A (zh) * 2017-10-26 2018-02-23 东莞金太阳研磨股份有限公司 一种磨具用的聚酯薄膜基材的处理工艺
CN112423935B (zh) * 2018-06-29 2023-07-21 圣戈班磨料磨具有限公司 磨料制品及其形成方法
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad
CN113442056B (zh) * 2021-07-15 2022-12-02 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法

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JP2000238207A (ja) * 1999-02-22 2000-09-05 Dainippon Printing Co Ltd 化粧シート
JP2001522729A (ja) * 1997-11-06 2001-11-20 ロデール ホールディングス インコーポレイテッド 研磨剤研磨システムを使用したメモリーディスクあるいは半導体デバイスの製造方法及び研磨パッド
JP2002518603A (ja) * 1998-06-17 2002-06-25 ミリケン・アンド・カンパニー エアバッグ布地用ポリウレタン／ポリアクリレート分散コーティング
JP2003516872A (ja) * 1999-12-14 2003-05-20 ロデール ホールディングス インコーポレイテッド 高分子又は高分子複合材研磨パッドの製造方法
US20040166779A1 (en) * 2003-02-24 2004-08-26 Sudhakar Balijepalli Materials and methods for chemical-mechanical planarization
US20040166790A1 (en) * 2003-02-21 2004-08-26 Sudhakar Balijepalli Method of manufacturing a fixed abrasive material

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US6805722B2 (en) * 2002-10-01 2004-10-19 3M Innovative Properties Company Apparatus and method for forming a spiral wound abrasive article, and the resulting article
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JP2001522729A (ja) * 1997-11-06 2001-11-20 ロデール ホールディングス インコーポレイテッド 研磨剤研磨システムを使用したメモリーディスクあるいは半導体デバイスの製造方法及び研磨パッド
JP2002518603A (ja) * 1998-06-17 2002-06-25 ミリケン・アンド・カンパニー エアバッグ布地用ポリウレタン／ポリアクリレート分散コーティング
JP2000238207A (ja) * 1999-02-22 2000-09-05 Dainippon Printing Co Ltd 化粧シート
JP2003516872A (ja) * 1999-12-14 2003-05-20 ロデール ホールディングス インコーポレイテッド 高分子又は高分子複合材研磨パッドの製造方法
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8500932B2 (en) 2006-04-19 2013-08-06 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
US9050707B2 (en) 2006-04-19 2015-06-09 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
JP2008296333A (ja) * 2007-05-31 2008-12-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
WO2008149650A1 (ja) * 2007-05-31 2008-12-11 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
CN101663132B (zh) * 2007-05-31 2011-06-01 东洋橡胶工业株式会社 研磨垫的制造方法
US8409308B2 (en) 2007-05-31 2013-04-02 Toyo Tire & Rubber Co., Ltd. Process for manufacturing polishing pad
JP2009056585A (ja) * 2007-08-15 2009-03-19 Rohm & Haas Electronic Materials Cmp Holdings Inc ケミカルメカニカルポリッシングのための相互侵入ネットワーク
JP2011530158A (ja) * 2008-04-29 2011-12-15 セミクエスト・インコーポレーテッド 研磨パッド組成物およびその製造方法ならびに使用
CN112318363A (zh) * 2020-11-06 2021-02-05 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法
CN112318363B (zh) * 2020-11-06 2022-03-11 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法

Also Published As

Publication number Publication date
TW200720017A (en) 2007-06-01
US20080188163A1 (en) 2008-08-07
KR20070032609A (ko) 2007-03-22
US20070066195A1 (en) 2007-03-22
DE102006042674A1 (de) 2007-03-22
CN1935461A (zh) 2007-03-28
US8272922B2 (en) 2012-09-25
FR2890882A1 (fr) 2007-03-23

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