TW200720017A - Water-based polishing pads having improved adhesion properties and methods of manufacture - Google Patents

Water-based polishing pads having improved adhesion properties and methods of manufacture

Info

Publication number
TW200720017A
TW200720017A TW095129494A TW95129494A TW200720017A TW 200720017 A TW200720017 A TW 200720017A TW 095129494 A TW095129494 A TW 095129494A TW 95129494 A TW95129494 A TW 95129494A TW 200720017 A TW200720017 A TW 200720017A
Authority
TW
Taiwan
Prior art keywords
water
manufacture
methods
adhesion properties
improved adhesion
Prior art date
Application number
TW095129494A
Other languages
English (en)
Chinese (zh)
Inventor
Chau Duong
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200720017A publication Critical patent/TW200720017A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095129494A 2005-09-19 2006-08-11 Water-based polishing pads having improved adhesion properties and methods of manufacture TW200720017A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71848905P 2005-09-19 2005-09-19

Publications (1)

Publication Number Publication Date
TW200720017A true TW200720017A (en) 2007-06-01

Family

ID=37776011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129494A TW200720017A (en) 2005-09-19 2006-08-11 Water-based polishing pads having improved adhesion properties and methods of manufacture

Country Status (7)

Country Link
US (2) US20070066195A1 (enExample)
JP (1) JP2007088464A (enExample)
KR (1) KR20070032609A (enExample)
CN (1) CN1935461A (enExample)
DE (1) DE102006042674A1 (enExample)
FR (1) FR2890882A1 (enExample)
TW (1) TW200720017A (enExample)

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* Cited by examiner, † Cited by third party
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TWI894253B (zh) * 2020-04-18 2025-08-21 美商杜邦電子材料控股股份有限公司 形成槓桿式多孔拋光墊之方法

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US7655117B2 (en) 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
CN102672630B (zh) 2006-04-19 2015-03-18 东洋橡胶工业株式会社 抛光垫的制造方法
US7311590B1 (en) * 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
TW200927896A (en) * 2007-12-28 2009-07-01 Iv Technologies Co Ltd Polishing pad and polishing method
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
US8177603B2 (en) * 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
TWI518176B (zh) * 2015-01-12 2016-01-21 三芳化學工業股份有限公司 拋光墊及其製造方法
CN107717762A (zh) * 2017-10-26 2018-02-23 东莞金太阳研磨股份有限公司 一种磨具用的聚酯薄膜基材的处理工艺
CN112423935B (zh) * 2018-06-29 2023-07-21 圣戈班磨料磨具有限公司 磨料制品及其形成方法
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
CN112318363B (zh) * 2020-11-06 2022-03-11 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法
CN113442056B (zh) * 2021-07-15 2022-12-02 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法

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US20080063856A1 (en) 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI894253B (zh) * 2020-04-18 2025-08-21 美商杜邦電子材料控股股份有限公司 形成槓桿式多孔拋光墊之方法

Also Published As

Publication number Publication date
US20080188163A1 (en) 2008-08-07
KR20070032609A (ko) 2007-03-22
US20070066195A1 (en) 2007-03-22
DE102006042674A1 (de) 2007-03-22
CN1935461A (zh) 2007-03-28
JP2007088464A (ja) 2007-04-05
US8272922B2 (en) 2012-09-25
FR2890882A1 (fr) 2007-03-23

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