PL2281022T3 - Przewodząca ciepło masa klejąca przylepcowa - Google Patents

Przewodząca ciepło masa klejąca przylepcowa

Info

Publication number
PL2281022T3
PL2281022T3 PL09783325T PL09783325T PL2281022T3 PL 2281022 T3 PL2281022 T3 PL 2281022T3 PL 09783325 T PL09783325 T PL 09783325T PL 09783325 T PL09783325 T PL 09783325T PL 2281022 T3 PL2281022 T3 PL 2281022T3
Authority
PL
Poland
Prior art keywords
thermally conductive
conductive adhesive
adhesive mass
aluminum oxide
oxide particles
Prior art date
Application number
PL09783325T
Other languages
English (en)
Inventor
KLAUS KEITE-TELGENBüSCHER
Anja Staiger
Florian Meyer
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2281022T3 publication Critical patent/PL2281022T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
PL09783325T 2008-10-01 2009-09-23 Przewodząca ciepło masa klejąca przylepcowa PL2281022T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008049850A DE102008049850A1 (de) 2008-10-01 2008-10-01 Wärmeleitende Haftklebemasse
EP09783325A EP2281022B1 (de) 2008-10-01 2009-09-23 Wärmeleitende haftklebemasse
PCT/EP2009/062320 WO2010037676A1 (de) 2008-10-01 2009-09-23 Wärmeleitende haftklebemasse

Publications (1)

Publication Number Publication Date
PL2281022T3 true PL2281022T3 (pl) 2012-03-30

Family

ID=41479036

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09783325T PL2281022T3 (pl) 2008-10-01 2009-09-23 Przewodząca ciepło masa klejąca przylepcowa

Country Status (11)

Country Link
US (1) US20110193010A1 (pl)
EP (1) EP2281022B1 (pl)
JP (1) JP2012504668A (pl)
KR (1) KR101590499B1 (pl)
CN (1) CN102057007B (pl)
AT (1) ATE534714T1 (pl)
DE (1) DE102008049850A1 (pl)
ES (1) ES2375835T3 (pl)
MX (1) MX2010013299A (pl)
PL (1) PL2281022T3 (pl)
WO (1) WO2010037676A1 (pl)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009055099A1 (de) * 2009-12-21 2011-06-22 tesa SE, 20253 Hitzeaktiviert verklebbare Flächenelemente
CN102906823B (zh) * 2010-06-09 2014-04-02 海洋王照明科技股份有限公司 导电胶混合物、荧光屏阳极板及其制造方法
JPWO2012132656A1 (ja) * 2011-03-29 2014-07-24 日本ゼオン株式会社 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品
CN102321444B (zh) * 2011-05-30 2012-11-07 天津安品有机硅材料有限公司 导热性丙烯酸压敏胶组合物和丙烯酸导热贴片
EP2793258A4 (en) * 2011-12-12 2015-11-11 Mitsubishi Materials Corp POWER MODULE SUBSTRATE, SUBSTRATE FOR A POWER MODULE WITH A COOLING BODY, POWER MODULE, PASTE FOR PRODUCING A RIVER COMPONENT INHIBITING PREVENTION LAYER AND BINDING METHOD FOR A PRODUCT TO BE BINDED
CN102569223B (zh) * 2012-01-11 2016-09-14 华为技术有限公司 一种功率器件绝缘散热结构及电路板、电源设备
CN104321400A (zh) * 2012-06-04 2015-01-28 日本瑞翁株式会社 导热性压敏粘接剂组合物、导热性压敏粘接性片状成形体、它们的制造方法、以及电子仪器
TWI513068B (zh) * 2013-07-12 2015-12-11 Lite On Opto Technology Changzhou Co Ltd 發光二極體結構、發光二極體結構的金屬支架、及承載座模組
US9583689B2 (en) * 2013-07-12 2017-02-28 Lite-On Opto Technology (Changzhou) Co., Ltd. LED package
CN104282823A (zh) * 2013-07-12 2015-01-14 光宝科技股份有限公司 发光二极管封装结构
EP3061786A4 (en) 2013-10-24 2017-05-17 DIC Corporation Resin composition, heat-dissipating material, and heat-dissipating member
TW201606037A (zh) * 2014-05-27 2016-02-16 漢高智慧財產控股公司 用於熱管理應用之增強的壓敏黏著劑
JP6505380B2 (ja) * 2014-06-12 2019-04-24 Dic株式会社 粘着シート、その製造方法及び物品
CN105778846A (zh) * 2014-12-23 2016-07-20 常熟市嘉邦胶带有限责任公司 导热胶带用的导热胶
KR20180113210A (ko) * 2016-02-26 2018-10-15 히타치가세이가부시끼가이샤 접착 필름 및 다이싱·다이 본딩 필름
KR101722069B1 (ko) 2016-06-17 2017-03-31 주식회사 이노폴이 열전도성 박막 시트 및 이의 제조방법
CN107688252A (zh) * 2016-08-04 2018-02-13 鸿富锦精密工业（深圳）有限公司 内嵌式触控液晶显示面板
JP6898328B2 (ja) * 2016-08-05 2021-07-07 神島化学工業株式会社 希土類オキシ硫化物蓄冷材
JP6863662B2 (ja) * 2017-07-20 2021-04-21 株式会社ザクティ 空撮カメラ及び電子機器並びにそれを備えた無人飛行体
CN107828105B (zh) * 2017-11-09 2021-03-16 北京北化新橡特种材料科技股份有限公司 不含有机硅的凝胶状导热组合物
DE102019209571A1 (de) * 2019-06-28 2020-12-31 Tesa Se Haftklebmasse mit hohem Füllstoffanteil
JP6870903B2 (ja) * 2020-03-24 2021-05-12 株式会社ザクティ 空撮カメラ及び電子機器並びにそれを備えた無人飛行体
US20220362063A1 (en) * 2021-05-17 2022-11-17 Shawsheen Rubber Co, Inc. Cooling cohesive tape
JP2025070371A (ja) * 2023-10-19 2025-05-02 デンカ株式会社 アルミナ粉末、樹脂組成物、及び接着剤

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251466A (ja) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
TW197458B (pl) * 1991-02-14 1993-01-01 Ciba Geigy Ag
CA2093191A1 (en) 1992-04-15 1993-10-16 Richard J. Webb Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
CN1107694C (zh) 1996-11-29 2003-05-07 日东电工株式会社 导热和压敏性粘合剂及其粘合片类
CA2273890C (en) 1996-12-04 2006-03-14 Nitto Denko Corporation Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same
JP2001279196A (ja) * 2000-03-30 2001-10-10 Sliontec Corp 無基材熱伝導性粘着テープ・シート及びその製造方法
US7229683B2 (en) * 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
DE102007007617A1 (de) * 2007-02-13 2008-08-14 Tesa Ag Intrinsisch erwärmbare heißschmelzklebrige Flächengebilde

Also Published As

Publication number Publication date
US20110193010A1 (en) 2011-08-11
DE102008049850A1 (de) 2010-04-08
KR101590499B1 (ko) 2016-02-01
JP2012504668A (ja) 2012-02-23
WO2010037676A1 (de) 2010-04-08
EP2281022B1 (de) 2011-11-23
CN102057007B (zh) 2013-03-20
CN102057007A (zh) 2011-05-11
MX2010013299A (es) 2010-12-21
EP2281022A1 (de) 2011-02-09
ATE534714T1 (de) 2011-12-15
ES2375835T3 (es) 2012-03-06
KR20110059818A (ko) 2011-06-07

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