PL2281022T3 - Thermally conductive adhesive mass - Google Patents

Thermally conductive adhesive mass

Info

Publication number
PL2281022T3
PL2281022T3 PL09783325T PL09783325T PL2281022T3 PL 2281022 T3 PL2281022 T3 PL 2281022T3 PL 09783325 T PL09783325 T PL 09783325T PL 09783325 T PL09783325 T PL 09783325T PL 2281022 T3 PL2281022 T3 PL 2281022T3
Authority
PL
Poland
Prior art keywords
thermally conductive
conductive adhesive
adhesive mass
aluminum oxide
oxide particles
Prior art date
Application number
PL09783325T
Other languages
Polish (pl)
Inventor
KLAUS KEITE-TELGENBüSCHER
Anja Staiger
Florian Meyer
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2281022T3 publication Critical patent/PL2281022T3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

Highly cohesive, thermally conductive adhesive mass, comprising a polymer and aluminum oxide particles, in which more than 95 wt. % of the aluminum oxide particles are alpha aluminum oxide.
PL09783325T 2008-10-01 2009-09-23 Thermally conductive adhesive mass PL2281022T3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008049850A DE102008049850A1 (en) 2008-10-01 2008-10-01 Thermally conductive pressure-sensitive adhesive
EP09783325A EP2281022B1 (en) 2008-10-01 2009-09-23 Thermally conductive adhesive mass
PCT/EP2009/062320 WO2010037676A1 (en) 2008-10-01 2009-09-23 Thermally conductive adhesive mass

Publications (1)

Publication Number Publication Date
PL2281022T3 true PL2281022T3 (en) 2012-03-30

Family

ID=41479036

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09783325T PL2281022T3 (en) 2008-10-01 2009-09-23 Thermally conductive adhesive mass

Country Status (11)

Country Link
US (1) US20110193010A1 (en)
EP (1) EP2281022B1 (en)
JP (1) JP2012504668A (en)
KR (1) KR101590499B1 (en)
CN (1) CN102057007B (en)
AT (1) ATE534714T1 (en)
DE (1) DE102008049850A1 (en)
ES (1) ES2375835T3 (en)
MX (1) MX2010013299A (en)
PL (1) PL2281022T3 (en)
WO (1) WO2010037676A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009055099A1 (en) * 2009-12-21 2011-06-22 tesa SE, 20253 Heat activated adhesive surface elements
WO2011153695A1 (en) * 2010-06-09 2011-12-15 海洋王照明科技股份有限公司 Conductive glue mixture, fluorescent screen anode plate and manufacture method thereof
JPWO2012132656A1 (en) * 2011-03-29 2014-07-24 日本ゼオン株式会社 Thermally conductive pressure-sensitive adhesive composition, thermally conductive and pressure-sensitive adhesive sheet-like molded product, production method thereof, and electronic component
CN102321444B (en) * 2011-05-30 2012-11-07 天津安品有机硅材料有限公司 Heat-conducting acrylic pressure-sensitive adhesive composition and acrylic heat-conducting patch
KR101983420B1 (en) * 2011-12-12 2019-05-29 미쓰비시 마테리알 가부시키가이샤 Power module substrate, substrate for power module with heat sink, power module, paste for forming flux component penetration prevention layer, and bonding method for article to be bonded
CN102569223B (en) * 2012-01-11 2016-09-14 华为技术有限公司 A kind of power device insulated heat radiation structure and circuit board, power-supply device
JPWO2013183389A1 (en) * 2012-06-04 2016-01-28 日本ゼオン株式会社 Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet-like molded product, production method thereof, and electronic device
CN104282821B (en) * 2013-07-12 2017-03-29 光宝光电(常州)有限公司 Light emitting diode construction, light emitting diode construction metallic support and load bearing seat module
CN104282823A (en) * 2013-07-12 2015-01-14 光宝科技股份有限公司 Light emitting diode packaging structure
US9583689B2 (en) * 2013-07-12 2017-02-28 Lite-On Opto Technology (Changzhou) Co., Ltd. LED package
EP3061786A4 (en) 2013-10-24 2017-05-17 DIC Corporation Resin composition, heat-dissipating material, and heat-dissipating member
TW201606037A (en) * 2014-05-27 2016-02-16 漢高智慧財產控股公司 Enhanced pressure sensitive adhesive for thermal management applications
JP6505380B2 (en) * 2014-06-12 2019-04-24 Dic株式会社 Adhesive sheet, method for producing the same, and article
CN105778846A (en) * 2014-12-23 2016-07-20 常熟市嘉邦胶带有限责任公司 Heat conducing glue for heat conducing adhesive tape
WO2017145624A1 (en) * 2016-02-26 2017-08-31 日立化成株式会社 Adhesive film and dicing/die bonding film
KR101722069B1 (en) 2016-06-17 2017-03-31 주식회사 이노폴이 Thermoconductive thin layer sheet and preparation method thereof
CN107688252A (en) * 2016-08-04 2018-02-13 鸿富锦精密工业（深圳）有限公司 Embedded touch liquid crystal display panel
CN109312215B (en) * 2016-08-05 2021-03-26 神岛化学工业株式会社 Rare earth oxysulfide cold storage material
JP6863662B2 (en) * 2017-07-20 2021-04-21 株式会社ザクティ Aerial camera and electronic equipment and unmanned aerial vehicle equipped with it
CN107828105B (en) * 2017-11-09 2021-03-16 北京北化新橡特种材料科技股份有限公司 Silicone-free gel-like thermally conductive composition
DE102019209571A1 (en) * 2019-06-28 2020-12-31 Tesa Se Pressure-sensitive adhesive with a high filler content
JP6870903B2 (en) * 2020-03-24 2021-05-12 株式会社ザクティ Aerial camera and electronic equipment and unmanned aerial vehicle equipped with it

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251466A (en) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd Thermally conductive liquid silicone rubber composition
TW197458B (en) * 1991-02-14 1993-01-01 Ciba Geigy Ag
CA2093191A1 (en) 1992-04-15 1993-10-16 Richard J. Webb Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
CN1107694C (en) 1996-11-29 2003-05-07 日东电工株式会社 Thermally conductive pressure-sensitive adhesive and adhesive sheet containing same
KR20000057373A (en) 1996-12-04 2000-09-15 가마이 고로 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same
JP2001279196A (en) * 2000-03-30 2001-10-10 Sliontec Corp Substrate-free, thermally conductive pressure-sensitive adhesive tape or sheet and method for manufacturing the same
US7229683B2 (en) * 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
DE102007007617A1 (en) * 2007-02-13 2008-08-14 Tesa Ag Intrinsically heatable hot melt tacky fabrics

Also Published As

Publication number Publication date
KR101590499B1 (en) 2016-02-01
ATE534714T1 (en) 2011-12-15
KR20110059818A (en) 2011-06-07
ES2375835T3 (en) 2012-03-06
JP2012504668A (en) 2012-02-23
WO2010037676A1 (en) 2010-04-08
MX2010013299A (en) 2010-12-21
US20110193010A1 (en) 2011-08-11
CN102057007B (en) 2013-03-20
DE102008049850A1 (en) 2010-04-08
EP2281022B1 (en) 2011-11-23
EP2281022A1 (en) 2011-02-09
CN102057007A (en) 2011-05-11

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