CN107828105B - Silicone-free gel-like thermally conductive composition - Google Patents
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Abstract
A gel-like heat-conducting composition without silicone relates to the field of heat-conducting interface materials. In particular to a heat conducting gel which is applied to electronic products and communication equipment and is used for heat conduction of a contact interface of a heating element and a heat radiating fin, and does not contain organic silicon. The heat-conducting gel is composed of base oil without organic silicon, drying oil, heat-conducting filler, thixotropic agent and auxiliary agent, has the advantages of extrudable adhesive dispensing, high heat conductivity, excellent shape retention capability and no organic silicon pollution, and can obviously improve the long-term reliability of electronic products.
Description
Technical Field
The invention relates to the field of heat-conducting interface materials. In particular to a heat conducting gel which is used in electronic products and communication equipment and is used for conducting heat at the contact interface of a heating element and a heat radiating fin, and does not contain organic silicon, which is characterized in that: the heat-conducting gel is composed of base oil without organic silicon, drying oil, heat-conducting filler, thixotropic agent and auxiliary agent, has the advantages of extrudable adhesive dispensing, high heat conductivity, excellent shape retention capability and no organic silicon pollution, and can obviously improve the long-term reliability of electronic products.
Background
The heat generated by the electronic components during working needs to be transferred to the external environment through the radiator, the solid surface of the electronic components in contact with the radiator is microscopically rough and uneven, the actual contact area is small, the rest part is a gap filled with air, the heat conductivity coefficient of the air is very low (about 0.024W/m.K), the heat transfer is not facilitated, and the interface thermal resistance between the device and the radiator is larger. The heat-conducting interface material is mainly used for filling up micro-gaps and uneven surfaces generated when the device is in contact with a radiator, reducing thermal resistance and improving the heat dissipation performance of the device.
The heat-conducting interface material is mainly divided into a heat-conducting gasket, heat-conducting gel, heat-conducting grease, a heat-conducting adhesive and a phase-change heat-conducting interface material. Wherein the heat-conducting gasket and the heat-conducting gel have good long-term reliability and interface filling capability. Compared with a heat-conducting gasket, the heat-conducting gel has many advantages, such as automatic glue dispensing, almost no waste material generation, low compressive stress and better surface contact with devices and heat radiators.
Chinese patent No. cn201380010544.x (putty-like heat transfer material and method for producing the same) provides a putty-like heat transfer material which has good fluidity for extrusion, is easily extruded from a tube or a syringe, and has self-shape retainability in a static state, and a method for producing the same. This putty-like heat transfer material is a thermally conductive gel. However, the organic polymer material used in this patent is polysiloxane (silicone), which can migrate to cause cross-contamination in the device and can cause difficulty in reworkability of parts (e.g., chips, substrates, lids and other hardware); volatilization and condensation of small molecule siloxanes can cause electrical contact failure, affect optical transmission in optical devices, severely affect optical signal transmission and transmission, and cause coating defects on devices and substrates.
To address these problems, non-silicone based thermal interface materials can be used that avoid the risks of functional problems, component rework, cross contamination due to silicone migration and volatile contamination.
US20100181663 discloses a thermal conductive paste using non-silicon organic matter and metal powder aluminum powder, which greatly reduces the dielectric strength of the thermal conductive material, and may cause short circuit or electrical breakdown of components.
Patent WO/2008/126829, WO/2009/025304, JP2011111517 disclose silicone-free thermal grease compositions, but thermal grease is only suitable for very thin thermal interfaces, for example, the thickness of 30-50 microns, and is not suitable for thermal interfaces filled with a certain thickness (more than 0.1 mm), and when the thickness is too large, the thermal grease is easy to flow, and the sliding causes the problems of poor heat dissipation and failure of components. Furthermore, the thermal grease tends to dry after long-term use.
Disclosure of Invention
The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a heat conductive gel mainly comprising a non-silicon base oil, a reactive curable drying oil and a heat conductive powder, which has high heat conductivity, does not cause any contamination of silicone, has a fluidity enabling dispensing by extrusion, and can form a certain cross-linked structure by contacting with air after dispensing, and therefore has excellent shape retention ability in a still state, is suitable for filling heat conductive interfaces (0.1 to 5mm) having different thicknesses, and has excellent long-term reliability.
The heat conductive gel of the present invention is characterized by containing:
(a) the base oil without organosilicon can be mineral base oil and synthetic base oil, preferably synthetic base oil. The synthetic base oil includes polyalphaolefin, synthetic polybutene, polyester, polyether, phosphate, fluorine-containing base oil, etc., preferably polyalphaolefin. Base oils selected for having a kinematic viscosity at 40 ℃ in the range of 300-2,000 cSt, preferably at 40 ℃ of 1,000-2,000 cSt; the mass percentage of the base oil in the formula is 2-15%, and the preferable percentage is 3-10%.
(b) Drying oil and its derivative, compound containing allyl ether containing alpha-position hydrogen, preferably drying oil. The drying oil is oil which is easy to oxidize and dry in air to form a flexible solid film with high elasticity, is glyceride of unsaturated fatty acid such as linolenic acid and linoleic acid, and is preferably linseed oil, tung oil and catalpa oil. The mass percentage of the components capable of being cured by reaction in the formula is 1-7%, and the preferable percentage is 2-5%.
(c) The heat conducting filler is one or more of aluminum oxide, zinc oxide, aluminum nitride and boron nitride, and preferably spherical aluminum oxide; the large-particle-diameter thermally conductive filler preferably has an average particle diameter (D50) of 25 to 60 μm; the small-particle-diameter heat-conductive filler preferably has an average particle diameter of 2 to 8 μm; nanometer heat-conducting filler with the average particle size of 10nm-100nm can be selectively added, the preferable nanometer heat-conducting filler is nanometer aluminum oxide and nanometer zinc oxide, and the adding amount of the nanometer heat-conducting filler is not more than 5 percent of the total weight of the heat-conducting filler. The mass percentage of the heat-conducting filler in the formula is 70-95%, and the preferred percentage is 80-90%.
(d) At least one thixotropic agent, which may be selected from fumed silica, precipitated silica, organobentonite, hydrogenated castor oil, polyamide wax or polyethylene wax. The mass percentage of the thixotropic agent in the formula is 0.2-2%.
(e) At least one antioxidant selected from phenolic or amine antioxidants, such as alkyl diphenylamine, phenyl-alpha-naphthylamine, 2, 6-di-tert-butylphenol, mixed phenolic antioxidants, etc. The trade names are Irganox 1010, Irganox 1076, etc. The mass percentage of the antioxidant in the formula is 0.2-1%.
In conclusion, the heat-conducting gel without the organic silicon provided by the invention has the advantages that the heat-conducting gel without the organic silicon comprises the components of the base oil without the organic silicon, the drying oil, the heat-conducting filler, the thixotropic agent, the antioxidant and the like, a product with good fluidity, high heat conductivity and no organic silicon pollution can be obtained by adjusting the component proportion, the fluidity can be kept unchanged at normal temperature for a long time, and the product can be normally extruded and dispensed after being stored for a long time. The heat-conducting gel prepared by the invention has excellent insulating property and dielectric strength because any metal or other electric-conducting fillers are not used. After the glue is dispensed, the product is contacted with air, the drying oil is subjected to a crosslinking reaction to form a certain crosslinking structure, the product has excellent shape retention capacity, is suitable for filling heat conduction interfaces (0.1-5mm) with different thicknesses, and has excellent long-term reliability.
Detailed Description
The gel heat-conducting composition without the organic silicon comprises, by mass, 4-20% of base oil without the organic silicon, 2-10% of components capable of being cured by reaction, 70-95% of heat-conducting fillers with two or more particle sizes, 0.5-3% of thixotropic agents and 0.2-1% of antioxidants.
(a) Silicone-free base oils
The component (a) of the present invention is a mineral base oil or a synthetic base oil containing no silicone. Mineral base oils are obtained from petroleum derived mixtures of refined liquid hydrocarbons, mainly saturated mixtures of naphthenic and paraffinic hydrocarbons, crude oil by atmospheric and vacuum fractionation, solvent extraction and dewaxing, hydrorefining. The synthetic base oil is base oil formed by adopting refined micromolecular compounds to be prepared into macromolecules through chemical reactions such as polymerization, catalysis and the like, has good quality, and has the capabilities of thermal stability, oxidation resistance reaction and viscosity change resistanceMuch stronger than mineral base oils. Synthetic base oils include many types, such as polyalphaolefins, synthetic polybutenes, polyesters, polyethers, phosphate esters, fluorine-containing base oils, and the like. Among them, polyalphaolefins are a class of saturated olefin oligomers consisting of alpha-olefins (mainly C)8-C10) The relatively regular alkane obtained by oligomerization and hydrogenation under the catalytic action has excellent high and low temperature performance, thermal stability, hydrolytic stability and oxidation stability, and is suitable for preparing gel heat conduction materials without organic silicon. By selecting the base oil with different viscosities and adjusting the content of the base oil in the composition, the gel-like heat conduction material with different viscosities and heat conduction coefficients can be prepared. The base oil selected has a kinematic viscosity at 40 ℃ in the range of 300-2,000 cSt, preferably a base oil having a kinematic viscosity at 40 ℃ of 1,000-2,000 cSt. If the kinematic viscosity of the base oil is less than 300cSt at 40 ℃, the resulting thermally conductive gel may be subject to a relatively severe risk of oil bleeding during long-term use. If the kinematic viscosity of the base oil at 40 ℃ is too high, higher than 3000cSt, a sufficient amount of the heat conductive filler cannot be filled, and the heat conductive gel prepared has a low heat conductivity. The mass percentage of the selected base oil in the formula is 2-15%, and the preferable percentage is 3-10%. If the content of the base oil is too low, the prepared heat-conducting gel has poor fluidity during extrusion, the use efficiency of the heat-conducting gel is influenced, and the extrusion precision of the heat-conducting gel is reduced.
(b) Reaction curable composition
The component (b) of the present invention is a reaction-curable component, i.e., a drying oil derivative, or a compound having an allyl ether having a hydrogen atom at the α -position. The drying oil is glyceride of unsaturated fatty acid such as linolenic acid, linoleic acid, etc., such as linseed oil, tung oil, catalpa oil, oil containing a large amount of unsaturated fatty acid, such as fatty acid containing two double bonds, fatty acid containing three double bonds, and especially when the double bonds are conjugated, the drying oil is easy to oxidize and dry in air to form flexible solid film with high elasticity. In the present invention, the drying oil may be used as it is, or may be used as a derivative obtained by reacting the drying oil with other compounds to form the drying oil, so as to improve the compatibility of the drying oil with some base oils. For example, the drying oil may be reacted with a polyol to produce an esterified drying oil. Compounds having allyl ethers with alpha-hydrogens can also be oxidatively crosslinked in air including, but not limited to, ethylene glycol monoallyl ether, polypropylene glycol monoallyl ether, 1,2 butanediol monoallyl ether, 1,3 butanediol monoallyl ether, glycerol diallyl ether, pentaerythritol monoallyl ether, pentaerythritol diallyl ether, pentaerythritol triallyl ether, allyl glycidyl ether, and the like. These reaction-curable compounds may be used alone, or 2 or more of them may be used in combination. Among them, drying oils are more readily available, environmentally friendly, and more compatible with most non-silicon base oils, and therefore, drying oils are preferably used. The mass percentage of the components capable of being cured by reaction is 1-7%, and the preferable percentage is 2-5%. If the content of the reactive curing component is higher, the cured heat-conducting gel is harder and drier, the heat-conducting property is reduced, and the long-term stability is also reduced.
(c) Heat conductive filler
The component (c) in the present invention is a heat conductive filler, the heat conductive filler is one or more of alumina, zinc oxide, aluminum nitride, and boron nitride, and various shapes such as spherical, scaly, and polyhedral shapes can be used, and spherical alumina is preferable as the heat conductive filler. In the case where at least 2 kinds of inorganic particles having different average particle diameters are used in combination, it is preferable that the heat conductive particles are filled with a heat conductive filler having a small particle diameter between large particle diameters so as to be filled in a state close to a densely filled state, and a heat conductive network chain is more easily formed, thereby obtaining high heat conductive performance. In general, the thermally conductive filler having a large particle diameter is preferably such that the average particle diameter (D50, 50% particle diameter measured by laser diffraction light scattering method) is 25 to 60 μm; the thermally conductive filler having a small particle diameter preferably has an average particle diameter of 2 to 8 μm. The proportion of the large-particle-size heat conductive filler to the small-particle-size heat conductive filler in the heat conductive filler follows the closest packing principle of spherical particles, such as the Horsfield packing model. In the present invention, the volume ratio of the large-particle size heat-conducting filler to the small-particle size heat-conducting filler is 55/45 to 75/25, so that the heat-conducting gel has high fluidity while obtaining high heat-conducting performance.
The nanometer heat-conducting filler with the average particle size of less than 1 micron is added into the heat-conducting filler, the nanometer heat-conducting filler can further fill gaps, the heat conductivity coefficient is improved, and meanwhile, because the nanometer particles have larger specific surface area and have stronger interaction with the polymer, the oil permeability of the heat-conducting gel can be reduced. The preferable nanometer heat conducting filler is nanometer aluminum oxide and nanometer zinc oxide. The addition amount of the nano heat-conducting filler is not more than 5 percent of the total weight of the heat-conducting filler.
The mass percentage of the heat-conducting filler in the formula is 70-95%, and the preferable percentage is 80-90%, wherein, the heat-conducting filler can be untreated or treated by a coupling agent.
(d) Thixotropic agent
At least one thixotropic agent is added, and the thixotropic agent can be selected from fumed silica, precipitated silica, organic bentonite, hydrogenated castor oil, polyamide wax or polyethylene wax. The mass percentage of the thixotropic agent in the formula is 0.2-2%.
(e) Antioxidant agent
At least one antioxidant is added, wherein the antioxidant is selected from phenolic or amine antioxidants, such as alkyl diphenylamine, phenyl-alpha-naphthylamine, 2, 6-di-tert-butylphenol, mixed phenolic antioxidants, etc. The trade names are Irganox 1010, Irganox 1076, etc. The mass percentage of the antioxidant in the formula is 0.2-1%.
The composition of the present invention may contain components other than the above-mentioned components, if necessary, and may further contain an inorganic pigment such as red iron oxide or a silicone-free color paste to adjust the appearance color of the composition, an alkyltrialkoxysilane to be used for the purpose of surface treatment of a filler or the like, and a drying catalyst to accelerate the auto-oxidative crosslinking of the reactive curable component, the drying catalyst (also referred to as a drier) being usually an organic metal compound, generally a carboxylate of a transition metal, such as cobalt naphthenate, manganese soap, lead soap and zirconium soap.
Preparation method of gel-like heat-conducting composition without silicone
The composition described above can be made into a gel-like heat conductive composition by, for example, mixing all the components. Suitable mixing equipment, such as a double planetary mixer, an extruder, such as a twin screw extruder, and the like, can be used to prepare the compositions described herein. The components (a), (c), (d) and (e) can be mixed homogeneously in a double planetary mixer, then the component (b) is added under the protection of an inert gas such as nitrogen, and after mixing homogeneously, the mixture is stored in oxygen-free conditions (for example in a sealed container) until ready for use. For example, the obtained gel-like heat conductive composition is filled into a container suitable for automatic dispensing mounting of electronic parts, such as a dispensing tube or a syringe.
The thermal conductivity of the gel-like heat-conducting composition without the organic silicon prepared by the technical scheme provided by the invention can reach 6W/mK.
Performance test method
(1) Coefficient of thermal conductivity
The measurement was carried out by a thermal conductivity measuring instrument DRL-III manufactured by Hunan Tan instruments Ltd according to the steady-state heat flow method specified in ASTM D-5470.
(2) Speed of dispensing
The heat-conducting gel was dispensed into a 55 ml dispensing syringe with an inner diameter of 2.4 mm at the outlet, and the weight of the heat-conducting gel dispensed in 1 part was measured under a dispensing pressure of 90psi without adding a dispensing needle.
(3) Self shape retention property
The self shape retention was evaluated by extruding a heat conductive gel from a tube or syringe in a spherical shape having a diameter of about 10mm onto the surface of a clean and smooth aluminum plate, weighing 6 to 7g (about 2 to 2.5ml) of the sample, vertically placing the aluminum plate after extrusion, measuring the diameter of the sample immediately after extrusion and 168 hours later, and observing whether or not the position of the sample has slipped down. If the diameter of the sample is within. + -. 1mm of the diameter immediately after extrusion, and the position of the sample does not change or slips down by not more than 1mm, the sample is judged to have self-shape-retaining properties.
(4) Long term reliability of thermal conductivity
Will conduct heat to condenseThe glue is arranged in a testing tool, the thickness of a sample is 1mm, according to a steady-state heat flow method specified by ASTM D-5470, a thermal conductivity coefficient tester DRL-III manufactured by Hunan Tan instruments GmbH is adopted, the equipment is set to have the hot end temperature of 80 ℃ and the cold end temperature of 20 ℃, after heat flow is stable, the temperature of the upper surface and the lower surface of the sample is measured by a thermocouple arranged on the testing tool, and the initial thermal resistance value (R) of the sample is obtained1). Then the tool was put in an oven at 100 ℃ for 1,000 hours, taken out and left at room temperature for 24 hours, and the thermal resistance value (R) of the sample after long-term high-temperature aging was measured under the same test conditions2). The change in thermal resistance before and after high temperature aging was calculated as follows:
the smaller the value of the increase of R2 with respect to R1, the better the long-term reliability of the thermal conductivity of the thermal conductive gel.
Detailed Description
The present invention will be further specifically described below with reference to examples. The present invention is not limited to the following examples.
Example 1
Polyalphaolefins having a kinematic viscosity of 1,240cSt at 40 ℃, such as SpectraSyn 100 manufactured by Exxon Mobil, linseed oil is used as a reaction-curable component, spherical alumina of 45 microns and 5 microns, such as DAM-45 and DAW-05 manufactured by Denka, Japan, nano alumina, a thixotropic agent fumed silica, such as Aerosil 200 manufactured by Evonik, and an antioxidant Irganox 1010 are used as a heat conductive filler, and the weight percentages of the components in the composition are shown in Table one.
| Components | Example 1 | Example 2 | Example 3 | Comparative example 1 | Comparative example 2 |
| SpectraSyn 100 | 5.5％ | 4.5％ | 8.5％ | ||
| SpectraSyn 40 | 5.5％ | ||||
| Ketjenlube-165 | 5％ | ||||
| LinseedOil | 3％ | 2％ | 3.5％ | 3％ | |
| DAM-45 | 55％ | 33％ | 55％ | 55％ | 55％ |
| DAM-90 | 26％ | ||||
| DAW-05 | 31.5％ | 32.6％ | 31.5％ | 31.5％ | 31.5％ |
| Nano alumina | 4％ | 1.5％ | 4％ | 4％ | 4％ |
| Aerosil 200 | 0.8％ | 0.2％ | 0.8％ | 0.8％ | 0.8％ |
| Irganox 1010 | 0.2％ | 0.2％ | 0.2％ | 0.2％ | 0.2％ |
Watch 1
The method comprises the steps of uniformly mixing SpectraSyn 100, Dam-45, DAW-05, nano alumina, Aerosil 200 and Irganox 1010 in a double-planetary mixer under vacuum (the vacuum degree is higher than-0.08 MPa), introducing nitrogen for protection, adding linseed oil, and uniformly mixing under vacuum. Pressing into a dispensing syringe under the protection of nitrogen, sealing and storing at low temperature (<5 ℃).
Example 2
The gel-like heat-conducting composition without the organic silicon comprises the components in percentage by weight shown in the table I. The preparation method is also the same as that of the example 1, the components except the linseed oil are firstly mixed uniformly, then the linseed oil is added under the protection of nitrogen, and the mixture is mixed uniformly under vacuum. Pressing into a dispensing syringe under the protection of nitrogen, sealing and storing at low temperature (<5 ℃).
Example 3
The gel-like heat-conducting composition without the organic silicon comprises the components in percentage by weight shown in the table I. A polyester oil having a kinematic viscosity of 770cSt at 40 ℃ such as Ketjenlube-165 manufactured by Italian Mazel is used as a base oil component; linseed oil is adopted as a component capable of being cured by reaction; the heat conductive filler is 45-micron, 5-micron spherical alumina such as DAM-45 and DAW-05 manufactured by Denka of Japan; adding nano aluminum oxide; thixotropic fumed silica, such as Aerosil 200 manufactured by Evonik; the antioxidant is Irganox 1010.
The preparation method is also the same as that of the example 1, the components except the linolenic acid triglyceride are mixed uniformly, and then the linseed oil is added under the protection of nitrogen and is mixed uniformly under vacuum. Pressing into a dispensing syringe under the protection of nitrogen, sealing and storing at low temperature (<5 ℃).
Comparative example 1
The gel-like heat-conducting composition without the organic silicon comprises the components in percentage by weight shown in the table I. Wherein no reaction curable ingredients are added. The preparation is also similar to example 1, all components are mixed homogeneously in a double planetary mixer under vacuum, pressed into dispensing syringes and stored hermetically at low temperatures (<5 ℃).
Comparative example 2
The gel-like heat-conducting composition without the organic silicon comprises the components in percentage by weight shown in the table I. The preparation method of the poly-alpha-olefin is the same as that of the embodiment 1, wherein the adopted poly-alpha-olefin has the kinematic viscosity of 396cSt at 40 ℃, the components except the linseed oil are firstly mixed uniformly, then the linseed oil is added under the protection of nitrogen, and the mixture is uniformly mixed under vacuum. Pressing into a dispensing syringe under the protection of nitrogen, sealing and storing at low temperature (<5 ℃).
The thermal conductivity test, the dispensing speed test, the curing test, the self-shape retention test and the long-term reliability of the thermal conductivity were performed on example 1, example 2, example 3, comparative example 1 and comparative example 2, and the measurement result data are shown in table two:
watch two
The test result shows that the gel-like heat-conducting composition without the organic silicon prepared by the technical scheme provided by the invention has high heat conductivity coefficient, good fluidity and dispensing speed, can be cured in the air after dispensing, has excellent shape retentivity and long-term reliability, greatly improves the reliability of the heat-conducting interface material for the electronic equipment by the performances, and is very beneficial to industrial production.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (8)
1. A silicone-free gel-like heat conductive composition characterized by containing:
(a) the base oil without organic silicon is mineral base oil or synthetic base oil; the kinematic viscosity of the selected base oil at 40 ℃ is in the range of 770-1240cSt, and the mass percentage of the base oil in the formula is 2-15%;
(b) the component capable of being cured by reaction is drying oil or a derivative of the drying oil, and the mass percentage of the component capable of being cured by reaction in the formula is 1-7%;
(c) the heat conducting filler with two or more than two particle sizes is one or more of aluminum oxide, zinc oxide, aluminum nitride and boron nitride, and the average particle size of the heat conducting filler with a large particle size is 25-60 micrometers; the average grain diameter of the heat-conducting filler with small grain diameter is 2-8 microns; the volume ratio of the large-particle-size heat-conducting filler to the small-particle-size heat-conducting filler is 55/45-75/25;
the mass percentage of the heat-conducting filler in the formula is 70-95%;
(d) at least one thixotropic agent selected from fumed silica, precipitated silica, organobentonite, hydrogenated castor oil, polyamide wax or polyethylene wax; the mass percentage of the thixotropic agent in the formula is 0.2-2%;
(e) at least one antioxidant, wherein the antioxidant is selected from phenol type or amine type antioxidants, and the mass percentage of the antioxidant in the formula is 0.2-1%.
2. The composition of claim 1, wherein: synthetic base oils include polyalphaolefins or polyesters.
3. The composition of claim 1, wherein: the synthetic base oil is selected from polyalphaolefins.
4. The composition of claim 1, wherein: the silicone-free base oil is a base oil having a kinematic viscosity at 40 ℃ of 1,000-1240 cSt; the percentage content of the base oil in the formula is 3-10%.
5. The composition of claim 1, wherein:
the drying oil is oleum Lini, oleum Verniciae Fordii or oleum catalpa.
6. The composition of claim 1, wherein: the mass percentage of the components capable of being cured by reaction in the formula is 2-5%.
7. The composition of claim 1, wherein: the antioxidant comprises alkyl diphenylamine, phenyl-alpha-naphthylamine, 2, 6-di-tert-butylphenol or mixed phenol type antioxidant.
8. A process for preparing a composition according to any one of claims 1 to 7, characterized in that: mixing all the components to obtain gel-like heat-conducting composition, mixing the components (a), (c), (d) and (e) uniformly by using a double-planet stirrer or an extruder, adding the component (b) under the protection of inert gas, uniformly mixing, and storing at the temperature of no oxygen and less than 5 ℃ until the gel-like heat-conducting composition is ready for use.
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| CN109913297A (en) * | 2019-03-06 | 2019-06-21 | 江苏龙蟠科技股份有限公司 | A kind of heat transfer lubricating grease and preparation method thereof |
| CN110003438A (en) * | 2019-03-29 | 2019-07-12 | 傲川科技(河源)有限公司 | Thermally conductive gel and preparation method thereof |
| CN110157388A (en) * | 2019-05-31 | 2019-08-23 | 昆山兆科电子材料有限公司 | A kind of high thermal conductivity cream and preparation method thereof |
| CN113913162A (en) * | 2021-09-27 | 2022-01-11 | 平湖阿莱德实业有限公司 | High-thermal-conductivity insulating silicon-free heat-conducting grease and preparation method thereof |
| CN116355572A (en) * | 2023-03-31 | 2023-06-30 | 广州市垠瀚能源科技有限公司 | Heat conducting gel composition, heat conducting gel, preparation method of heat conducting gel and heating component |
| CN117567989A (en) * | 2023-09-16 | 2024-02-20 | 广东长特思智能电器科技有限公司 | Alkane-based high-thermal-conductivity phase-change gel and preparation method thereof |
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