CN110157388A - A kind of high thermal conductivity cream and preparation method thereof - Google Patents
A kind of high thermal conductivity cream and preparation method thereof Download PDFInfo
- Publication number
- CN110157388A CN110157388A CN201910469054.5A CN201910469054A CN110157388A CN 110157388 A CN110157388 A CN 110157388A CN 201910469054 A CN201910469054 A CN 201910469054A CN 110157388 A CN110157388 A CN 110157388A
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- China
- Prior art keywords
- thermal conductivity
- high thermal
- coupling agent
- composite heat
- conducting filler
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
Abstract
The invention discloses a kind of high thermal conductivity cream, and prepare raw material includes following components by mass percentage: silicone oil 10%-30%, composite heat-conducting filler 60%-80%, coupling agent 3%-8%, white carbon black 2%-6% and thixotropic agent 1%-3%；The composite heat-conducting filler includes following components by mass percentage: inorganic compound ceramic powder 60%-70%, graphene 20%-30% and Nano diamond 5%-15%, wherein the inorganic compound ceramic powder is handled by surface treating agent nanosizing cladding.The present invention also provides the preparation methods of the high thermal conductivity cream.The thermal coefficient of high thermal conductivity cream prepared by the present invention is high, and perfect heat-dissipating, the compatibility between matrix and other compositions is good, and is less prone to the problem of condensate oil is layered.
Description
Technical field
The present invention relates to heat-conducting interface material technical field, in particular to a kind of high thermal conductivity cream and preparation method thereof.
Background technique
With the miniaturization of electronic product and the continuous improvement of performance, the calorific value of electronic components of high power in electronic product
It is continuously improved, how effectively quickly to conduct the amount of heat of generation to product, it has also become design of electronic products therewith
An important topic.For the heat dissipation problem for solving electronic component, it will usually in the surface of electronic component installation heat dissipation dress
Set or coat heat sink material, such as heat-conducting cream.
However, there are the following problems for traditional heat-conducting cream:
1. thermal coefficient is low, heat dissipation performance is insufficient for the radiating requirements of more high-power, more complicated environment；
2. the bad dispersibility of heat filling, and the poor compatibility between matrix；
3. the problem of after a long time placement, being easy to appear condensate oil layering.
Summary of the invention
In order to solve the above technical problems, the purpose of the present invention is to provide a kind of high thermal conductivity cream and preparation method thereof, the height
The thermal coefficient of heat-conducting cream is high, and perfect heat-dissipating, the compatibility between matrix and other compositions is good, and is less prone to condensate oil layering
The problem of.
To realize above-mentioned technical purpose and the technique effect, the invention is realized by the following technical scheme: Yi Zhonggao
Heat-conducting cream, prepare raw material includes following components by mass percentage: silicone oil 10%-30%, composite heat-conducting filler 60%-
80%, coupling agent 3%-8%, white carbon black 2%-6% and thixotropic agent 1%-3%；
The composite heat-conducting filler includes following components by mass percentage: inorganic compound ceramic powder 60%-70%, stone
Black alkene 20%-30% and Nano diamond 5%-15%, wherein the inorganic compound ceramic powder passes through surface treating agent nanosizing
Cladding processing.
Preferably, the silicone oil is macromolecule silicone oil.
Preferably, the coupling agent is silane coupling agent, titanate coupling agent, aluminate coupling agent, phosphate coupling agent
One or more of mixture.
Preferably, the thixotropic agent is bentonite.
Preferably, the composite heat-conducting filler is to be matched to form by the powder pole of different-grain diameter.
The present invention also provides a kind of preparation methods of high thermal conductivity cream, include the following steps:
(1) by coupling agent and dehydrated alcohol according to 1:2 quality proportioning after mixing, stand 30-40 minutes at room temperature,
To coupling agent complete alcoholysis, then composite heat-conducting filler is added in coupling agent alcoholic solution, is sufficiently stirred, and stand at room temperature
It 24 hours, is then dried, obtains the composite heat-conducting filler through coupling agent treatment；
(2) by silicone oil, thixotropic agent, white carbon black and step (1), treated that composite heat-conducting filler is added to kneader together
In, and under vacuum conditions, it is stirred, deaeration, then grinder is recycled to carry out grinding distribution, obtain high thermal conductivity cream.
Preferably, the vacuum degree in step (2) is 0.06Mpa.
The beneficial effects of the present invention are:
(1) the composite heat-conducting filler prepared in raw material of the invention is by inorganic compound ceramic powder, graphene and nanometer Buddha's warrior attendant
Stone composition, and based on inorganic compound ceramic powder, inorganic compound ceramic powder is handled by surface treating agent nanosizing cladding, from
And the compatibility between heat filling and matrix silicone oil is improved, and since inorganic compound ceramic powder surface is coated with nanoscale
Organic-capping layer can play the role of modified and disperse, improve the dispersibility of entire composite heat-conducting filler；Inorganic compounding pottery
Porcelain powder, graphene and Nano diamond are compounded according to reasonable proportion, improve thermal coefficient, so that entire heat-conducting cream tool
There is more excellent heat dissipation performance；
(2) the composite heat-conducting filler in the present invention is the powder pole by different-grain diameter with forming, so as to be formed tightlier
Close packed structures, and then more dense heat conduction network is formed, substantially increase thermal coefficient；
(3) thixotropic agent is added in the present invention, the heat-conducting cream is allowed to keep preferable thixotropy；
(4) present invention is surface-treated composite heat-conducting filler by coupling agent, compound so as to further increase
Compatibility between heat filling and silicone oil；
(5) white carbon black being added in the present invention, can increase viscosity, prevent occurring asking for condensate oil layering after a long time placement
Topic；
(6) matrix in heat-conducting cream of the present invention uses macromolecule silicone oil, not volatile；
(7) the preparation method step of high thermal conductivity cream of the present invention is simple, and high production efficiency, production cost is low, is conducive to industry
Metaplasia produces.
Specific embodiment
The preferred embodiments of the present invention will be described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that so as to make a clearer definition of the protection scope of the present invention.
Embodiment 1
A kind of high thermal conductivity cream, prepare raw material includes following components by mass percentage: macromolecule silicone oil 20%, compound
Heat filling 65%, silane coupling agent 8%, white carbon black 5% and bentonite 2%；
Wherein, composite heat-conducting filler includes following components by mass percentage: inorganic compound ceramic powder 60%, graphene
30% and Nano diamond 10%, wherein the inorganic compound ceramic powder is handled by surface treating agent nanosizing cladding.This is multiple
Closing heat filling is to be matched to form by the powder pole of different-grain diameter.The partial size of inorganic compound ceramic powder is 6-10 nanometers；The graphite
The partial size of alkene is 11-15 nanometers；The partial size of the Nano diamond is 15-22 nanometers.
The preparation method of above-mentioned high thermal conductivity cream, includes the following steps:
(1) by weighed coupling agent and dehydrated alcohol according to 1:2 quality proportioning after mixing, stand 30 points at room temperature
Then composite heat-conducting filler is added in coupling agent alcoholic solution, is sufficiently stirred, and at room temperature to coupling agent complete alcoholysis by clock
24 hours are stood, is then dried, obtains the composite heat-conducting filler through coupling agent treatment；
It (2) will treated, and composite heat-conducting be filled out according to the weighed silicone oil of quality proportioning, thixotropic agent, white carbon black and step (1)
Material is added in kneader together, and under vacuum conditions, is stirred, deaeration, then grinder is recycled to carry out grinding point
It dissipates, obtains high thermal conductivity cream；Vacuum degree in the step (2) is 0.06Mpa.
Embodiment 2
A kind of high thermal conductivity cream, prepare raw material includes following components by mass percentage: macromolecule silicone oil 30%, compound
Heat filling 60%, silane coupling agent 3%, white carbon black 6% and bentonite 1%；
Wherein, composite heat-conducting filler includes following components by mass percentage: inorganic compound ceramic powder 70%, graphene
25% and Nano diamond 5%, wherein the inorganic compound ceramic powder is handled by surface treating agent nanosizing cladding.This is multiple
Closing heat filling is to be matched to form by the powder pole of different-grain diameter.The partial size of inorganic compound ceramic powder is 6-10 nanometers；The graphite
The partial size of alkene is 11-15 nanometers；The partial size of the Nano diamond is 15-22 nanometers.
The preparation method of above-mentioned high thermal conductivity cream, includes the following steps:
(1) by coupling agent and dehydrated alcohol according to 1:2 quality proportioning after mixing, stand 35 minutes at room temperature, to
Then composite heat-conducting filler is added in coupling agent alcoholic solution, is sufficiently stirred, and stand 24 at room temperature by coupling agent complete alcoholysis
Hour, it is then dried, obtains the composite heat-conducting filler through coupling agent treatment；
(2) by silicone oil, thixotropic agent, white carbon black and step (1), treated that composite heat-conducting filler is added to kneader together
In, and under vacuum conditions, it is stirred, deaeration, then grinder is recycled to carry out grinding distribution, obtain high thermal conductivity cream；It should
Vacuum degree in step (2) is 0.06Mpa.
Embodiment 3
A kind of high thermal conductivity cream, prepare raw material includes following components by mass percentage: macromolecule silicone oil 10%, compound
Heat filling 80%, titanate coupling agent 5%, white carbon black 2% and bentonite 3%；
Wherein, composite heat-conducting filler includes following components by mass percentage: inorganic compound ceramic powder 65%, graphene
20% and Nano diamond 15%, wherein the inorganic compound ceramic powder is handled by surface treating agent nanosizing cladding.This is multiple
Closing heat filling is to be matched to form by the powder pole of different-grain diameter.The partial size of inorganic compound ceramic powder is 6-10 nanometers；The graphite
The partial size of alkene is 11-15 nanometers；The partial size of the Nano diamond is 15-22 nanometers.
The preparation method of above-mentioned high thermal conductivity cream, includes the following steps:
(1) by coupling agent and dehydrated alcohol according to 1:2 quality proportioning after mixing, stand 40 minutes at room temperature, to
Then composite heat-conducting filler is added in coupling agent alcoholic solution, is sufficiently stirred, and stand 24 at room temperature by coupling agent complete alcoholysis
Hour, it is then dried, obtains the composite heat-conducting filler through coupling agent treatment；
(2) by silicone oil, thixotropic agent, white carbon black and step (1), treated that composite heat-conducting filler is added to kneader together
In, and under vacuum conditions, it is stirred, deaeration, then grinder is recycled to carry out grinding distribution, obtain high thermal conductivity cream；It should
Vacuum degree in step (2) is 0.06Mpa.
The thermal coefficient of high thermal conductivity cream prepared by embodiment 1-3 is high, and perfect heat-dissipating is not in after a long time placement
The problem of condensate oil is layered.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (7)
1. a kind of high thermal conductivity cream, which is characterized in that it includes following components that it prepares raw material by mass percentage: silicone oil 10%-
30%, composite heat-conducting filler 60%-80%, coupling agent 3%-8%, white carbon black 2%-6% and thixotropic agent 1%-3%；
The composite heat-conducting filler includes following components by mass percentage: inorganic compound ceramic powder 60%-70%, graphene
20%-30% and Nano diamond 5%-15%, wherein the inorganic compound ceramic powder is coated by surface treating agent nanosizing
Processing.
2. a kind of high thermal conductivity cream according to claim 1, which is characterized in that the silicone oil is macromolecule silicone oil.
3. a kind of high thermal conductivity cream according to claim 1, which is characterized in that the coupling agent is silane coupling agent, metatitanic acid
The mixture of one or more of ester coupling agent, aluminate coupling agent, phosphate coupling agent.
4. a kind of high thermal conductivity cream according to claim 1, which is characterized in that the thixotropic agent is bentonite.
5. a kind of high thermal conductivity cream according to claim 1, which is characterized in that the composite heat-conducting filler is by different-grain diameter
Powder pole with forming.
6. such as a kind of preparation method of high thermal conductivity cream described in any one of claim 1 to 5, which is characterized in that including walking as follows
It is rapid:
(1) by coupling agent and dehydrated alcohol according to 1:2 quality proportioning after mixing, 30-40 minutes are stood at room temperature, to idol
Join agent complete alcoholysis, then composite heat-conducting filler is added in coupling agent alcoholic solution, is sufficiently stirred, and it is small to stand 24 at room temperature
When, it is then dried, obtains the composite heat-conducting filler through coupling agent treatment；
(2) by silicone oil, thixotropic agent, white carbon black and step (1), treated that composite heat-conducting filler is added in kneader together, and
Under vacuum conditions, it is stirred, deaeration, then grinder is recycled to carry out grinding distribution, obtain high thermal conductivity cream.
7. a kind of preparation method of high thermal conductivity cream according to claim 6, which is characterized in that the vacuum degree in step (2)
For 0.06Mpa.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910469054.5A CN110157388A (en) | 2019-05-31 | 2019-05-31 | A kind of high thermal conductivity cream and preparation method thereof |
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| CN201910469054.5A CN110157388A (en) | 2019-05-31 | 2019-05-31 | A kind of high thermal conductivity cream and preparation method thereof |
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| CN110157388A true CN110157388A (en) | 2019-08-23 |
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ID=67630782
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111569103A (en) * | 2020-05-18 | 2020-08-25 | 华引芯（武汉）科技有限公司 | Portable dual-waveband UV LED sterilization and disinfection lamp |
| TWI774360B (en) * | 2021-05-07 | 2022-08-11 | 大陸商河南烯力新材料科技有限公司 | Heat disspation structure and electronic device |
| JP2023508750A (en) * | 2020-03-05 | 2023-03-03 | ダウ グローバル テクノロジーズ エルエルシー | Shear-thinning thermally conductive silicone composition |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023508750A (en) * | 2020-03-05 | 2023-03-03 | ダウ グローバル テクノロジーズ エルエルシー | Shear-thinning thermally conductive silicone composition |
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| CN111569103A (en) * | 2020-05-18 | 2020-08-25 | 华引芯（武汉）科技有限公司 | Portable dual-waveband UV LED sterilization and disinfection lamp |
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Application publication date: 20190823 |