CN103409116A - Insulating enhanced heat conduction interface material and preparation method thereof - Google Patents
Insulating enhanced heat conduction interface material and preparation method thereof Download PDFInfo
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- CN103409116A CN103409116A CN2013103260608A CN201310326060A CN103409116A CN 103409116 A CN103409116 A CN 103409116A CN 2013103260608 A CN2013103260608 A CN 2013103260608A CN 201310326060 A CN201310326060 A CN 201310326060A CN 103409116 A CN103409116 A CN 103409116A
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Abstract
The invention relates to an insulating enhanced heat conduction interface material and a preparation method thereof. The material comprises a silica gel gasket semi-finished product and a surface dielectric layer material, wherein the silica gel gasket semi-finished product comprises the following components in parts by weight: 100 parts of resin base bodies, 250-400 parts of heat conduction filler and an additive of which weight is 1-10 percent of that of the heat conduction filler; the surface dielectric layer material comprises insulating silicone cloth. The heat conduction interface material prepared by the invention has not only an inherent property of the heat conduction interface material, but also stronger mechanical strength and insulating performance.
Description
Technical field
The present invention relates to a kind of insulation enhancement type heat-conducting interface material and preparation method thereof, be applicable to the electron production field that not only needs heat conductivility but also need electrical insulation characteristics.
Background technology
Now, heat-conducting interface material is of a great variety, but function singleness.For heat-conducting interface material, the demand that the thermal conductivity of himself and autohension more and more can not satisfying the markets.Day by day under the overall situation of light, thin, short, little future development, the cry of functional diversity grows to even greater heights at electronic machine and equipment.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of insulation enhancement type heat-conducting interface material and preparation method thereof, the present invention is compound surface medium layer material in the moulding heat-conducting pad, the heat-conducting interface material of preparing had both had the intrinsic performance of heat-conducting interface material, had again stronger mechanical strength and insulating property.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of insulation enhancement type heat-conducting interface material comprises: silica gel pad work in-process and surface dielectric layer material, and the silica gel pad work in-process are the cream state, have mobility,
Wherein, described silica gel pad work in-process comprise that the heat-conducting filler of resin matrix, 250～400 weight parts of 100 weight parts and weight are 1%～10% auxiliary agents of heat-conducting filler weight, and described surface dielectric layer material comprises insulation silica gel cloth.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described heat-conducting filler comprises one or more the mixture in aluminum oxide, zinc oxide, boron nitride, aluminium nitride, titanium oxide or aluminium hydroxide.
Further, described auxiliary agent comprises one or more the mixture in silane coupling agent, aluminate coupling agent, titanate coupling agent, silane crosslinker, dispersion agent, defoamer.
The present invention also provides a kind of preparation method of the enhancement type heat-conducting interface material that insulate, and comprising:
1) get the side surface that surface treatment agent is coated in the surface dielectric layer material, coating thickness is 0.1～0.15mm, 100 ℃～150 ℃ bakings 5～10 minutes, until surface treatment agent is dried fully;
2) take resin matrix and auxiliary agent, mix, stir, after having stirred, add heat-conducting filler in said mixture, stir, obtain the silica gel pad work in-process;
3) by 2) the silica gel pad work in-process that obtain are coated on 1) side surface (being that face of surface media coated materials surface treatment agent) of the surface dielectric layer material processed, use format roll or scraper moulding desired thickness (0.1～0.15mm) heat-conducting interface material, solidify, obtain
Wherein, described silica gel pad work in-process comprise that the heat-conducting filler of resin matrix, 250～400 weight parts of 100 weight parts and weight are 1%～10% auxiliary agents of heat-conducting filler weight.
On the basis of technique scheme, the present invention can also do following improvement.
Further, in step 1), described surface treatment agent comprises one or more mixing in dimethyl silicone oil, kerosene, alcohol, acetone, toluene, natural rubber, isoprene-isobutylene rubber, silicon rubber, terpolymer EP rubber.
The beneficial effect that adopts this step is to strengthen surface dielectric layer material and the half-finished adhesivity of silica gel pad.
Further, in step 2) in, described stirring technique condition is: be vacuum defoamation under-0.1MPa 20～40 minutes in vacuum tightness.
Further, in step 3), describedly be cured as 130 ℃ and solidified 20～40 minutes.
The beneficial effect that adopts above-mentioned further scheme is to make the material deaeration, and after hot setting, the product surface light is smooth, thereby can guarantee the heat-conducting effect of material.
The invention has the beneficial effects as follows:
The present invention is compound surface medium layer material in the moulding heat-conducting pad, and the heat-conducting interface material of preparing had both had the intrinsic performance of heat-conducting interface material, had again stronger mechanical strength and insulating property.
Embodiment
Below principle of the present invention and feature are described, example, only be used to explaining the present invention, is not intended to limit scope of the present invention.
Embodiment 1
By dimethyl silicone oil, alcohol and terpolymer EP rubber mixed processing agent (1:1:1 in mass ratio), be coated in silica gel cloth surface, and coating thickness is 0.1～0.15mm, and baking is 10 minutes under 120 ℃, until surface treatment agent is dried fully.
Accurately take silicone resin 100 weight parts, and add the Pt catalyzer of 25 weight parts, add in mixing and blending machine, in vacuum tightness, be-stirred 40 minutes under 0.1MPa, after having stirred, to the aluminum oxide added in said mixture in 350 part, in vacuum tightness, be-stir discharging after 35 minutes under 0.1MPa, obtain the silica gel pad work in-process, the silica gel pad work in-process are coated on to the surface-treated side surface of silica gel cloth, coating thickness 0.5mm～10mm, 130 ℃ solidified 20 minutes, the enhancement type that must insulate heat-conducting interface material.
Embodiment 2
By dimethyl silicone oil, kerosene and silicon rubber mixed processing agent are mixed according to quality 1:1:1 ratio, are coated in silica gel cloth surface, and coating thickness is 0.1～0.15mm, and baking is 10 minutes at the temperature of 120 ℃, until surface treatment agent is dried fully.
Accurately take silicone resin 100 weight parts, and add the phthalate ester coupling agent of 25 weight parts, add in mixing and blending machine, in vacuum tightness, be-stirred 40 minutes under 0.1MPa, after having stirred, to the aluminium hydroxide that adds 350 parts in said mixture, in vacuum tightness, be-stir discharging after 35 minutes under 0.1MPa, obtain the silica gel pad work in-process, the silica gel pad work in-process are coated on to the surface-treated side surface of silica gel cloth, thickness is 0.5mm～10mm, and 130 ℃ solidified 20 minutes, the enhancement type that must insulate heat-conducting interface material.
The present invention to the insulation enhancement type heat-conducting interface material of embodiment 1,2 preparation and not the heat-conducting interface material for preparing of compound surface medium layer contrast, test dielectric breakdown voltage intensity and tensile property, experimental result is as shown in table 1.
Table 1 test result
| ? | Dielectric breakdown voltage intensity | Tensile property |
| Without the medium heat conduction boundary material | 6kV/mm | 56psi |
| Embodiment 1 | 11kV/mm | 134psi |
| Embodiment 2 | 12kV/mm | 147psi |
From above-described embodiment, can illustrate, heat-conducting interface material is after the insulation enhancement process, and anti-dielectric breakdown voltage intensity and tensile strength obviously are better than not processing material.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. insulation enhancement type heat-conducting interface material, it is characterized in that, comprise: silica gel pad work in-process and surface dielectric layer material, wherein, described silica gel pad work in-process comprise that the heat-conducting filler of resin matrix, 250～400 weight parts of 100 weight parts and weight are 1%～10% auxiliary agents of heat-conducting filler weight, and described surface dielectric layer material comprises insulation silica gel cloth.
2. a kind of insulation enhancement type heat-conducting interface material according to claim 1, is characterized in that, described heat-conducting filler comprises one or more the mixing in aluminum oxide, zinc oxide, boron nitride, aluminium nitride, titanium oxide or aluminium hydroxide.
3. a kind of insulation enhancement type heat-conducting interface material according to claim 1, is characterized in that, described auxiliary agent comprises one or more mixing in silane coupling agent, aluminate coupling agent, titanate coupling agent, silane crosslinker, dispersion agent, defoamer.
4. the preparation method of enhancement type heat-conducting interface material that insulate, is characterized in that, comprising:
1) get the side surface that surface treatment agent is coated in the surface dielectric layer material, coating thickness is 0.1～0.15mm, 100 ℃～150 ℃ bakings 5～10 minutes, until surface treatment agent is dried fully;
2) take resin matrix and auxiliary agent, mix, stir, after having stirred, add heat-conducting filler in said mixture, stir, obtain the silica gel pad work in-process;
3) by 2) the silica gel pad work in-process that obtain are coated on 1) side surface of the surface dielectric layer material processed, use the heat-conducting interface material of format roll or scraper moulding desired thickness, solidify, obtain,
Wherein, described silica gel pad work in-process comprise that the heat-conducting filler of resin matrix, 250～400 weight parts of 100 weight parts and weight are 1%～10% auxiliary agents of heat-conducting filler weight.
5. the preparation method of a kind of enhancement type heat-conducting interface material that insulate according to claim 4, it is characterized in that, in step 1), described surface treatment agent comprises in dimethyl silicone oil, kerosene, alcohol, acetone, toluene, natural rubber, isoprene-isobutylene rubber, silicon rubber, terpolymer EP rubber the mixture of one or more.
6. the preparation method of a kind of enhancement type heat-conducting interface material that insulate according to claim 4, is characterized in that, in step 2) in, described stirring technique condition is: be vacuum defoamation under-0.1MPa 20～40 minutes in vacuum tightness.
7. the preparation method of a kind of enhancement type heat-conducting interface material that insulate according to claim 4, is characterized in that, in step 3), describedly is cured as 130 ℃ and solidified 20～40 minutes.
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104830066A (en) * | 2015-03-16 | 2015-08-12 | 芜湖荣基密封系统有限公司 | Thermal-conductive and flame-retarding silicone rubber slurry used for preparing ultrathin sealing rubber layer and doped with nano zinc oxide and preparation method thereof |
| CN105368052A (en) * | 2015-11-13 | 2016-03-02 | 深圳德邦界面材料有限公司 | Compound heat conduction silica gel pad and preparation method thereof |
| CN106751871A (en) * | 2017-01-19 | 2017-05-31 | 苏州鸿凌达电子科技有限公司 | Lightweight heat conductive silica gel sheet material and its manufacture craft |
| CN107353432A (en) * | 2017-08-07 | 2017-11-17 | 苏州佰旻电子材料科技有限公司 | A kind of compound polyimide film heat conductive silica gel pad |
| US10174433B2 (en) | 2013-12-05 | 2019-01-08 | Honeywell International Inc. | Stannous methanesulfonate solution with adjusted pH |
| CN109278384A (en) * | 2018-08-01 | 2019-01-29 | 苏州矽美科导热科技有限公司 | A kind of new energy battery pack conduction heat sealable material and preparation method thereof |
| CN109385095A (en) * | 2018-09-30 | 2019-02-26 | 东莞市臻邦新材料科技有限公司 | A kind of high thermal conductivity springs back by force silica gel pad and preparation method thereof |
| CN109504309A (en) * | 2018-12-12 | 2019-03-22 | 深圳德邦界面材料有限公司 | A kind of improved composite heat-conducting gasket of appearance and preparation method thereof |
| US10287471B2 (en) | 2014-12-05 | 2019-05-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US10428257B2 (en) | 2014-07-07 | 2019-10-01 | Honeywell International Inc. | Thermal interface material with ion scavenger |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| CN110698734A (en) * | 2019-10-30 | 2020-01-17 | 华南理工大学 | Nano-selenium heat-conducting and insulating rubber material and preparation method and application thereof |
| US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN113388116A (en) * | 2021-06-24 | 2021-09-14 | 深圳市新纶科技股份有限公司 | Tackifier, heat-conducting gel, heat-conducting interface material, preparation method and application of heat-conducting interface material, and electronic equipment |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
-
2013
- 2013-07-30 CN CN201310326060.8A patent/CN103409116B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10174433B2 (en) | 2013-12-05 | 2019-01-08 | Honeywell International Inc. | Stannous methanesulfonate solution with adjusted pH |
| US10428257B2 (en) | 2014-07-07 | 2019-10-01 | Honeywell International Inc. | Thermal interface material with ion scavenger |
| US10287471B2 (en) | 2014-12-05 | 2019-05-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
| CN104830066A (en) * | 2015-03-16 | 2015-08-12 | 芜湖荣基密封系统有限公司 | Thermal-conductive and flame-retarding silicone rubber slurry used for preparing ultrathin sealing rubber layer and doped with nano zinc oxide and preparation method thereof |
| CN105368052A (en) * | 2015-11-13 | 2016-03-02 | 深圳德邦界面材料有限公司 | Compound heat conduction silica gel pad and preparation method thereof |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| CN106751871A (en) * | 2017-01-19 | 2017-05-31 | 苏州鸿凌达电子科技有限公司 | Lightweight heat conductive silica gel sheet material and its manufacture craft |
| CN107353432A (en) * | 2017-08-07 | 2017-11-17 | 苏州佰旻电子材料科技有限公司 | A kind of compound polyimide film heat conductive silica gel pad |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN109278384A (en) * | 2018-08-01 | 2019-01-29 | 苏州矽美科导热科技有限公司 | A kind of new energy battery pack conduction heat sealable material and preparation method thereof |
| CN109385095A (en) * | 2018-09-30 | 2019-02-26 | 东莞市臻邦新材料科技有限公司 | A kind of high thermal conductivity springs back by force silica gel pad and preparation method thereof |
| CN109504309A (en) * | 2018-12-12 | 2019-03-22 | 深圳德邦界面材料有限公司 | A kind of improved composite heat-conducting gasket of appearance and preparation method thereof |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| CN110698734A (en) * | 2019-10-30 | 2020-01-17 | 华南理工大学 | Nano-selenium heat-conducting and insulating rubber material and preparation method and application thereof |
| CN110698734B (en) * | 2019-10-30 | 2021-08-27 | 华南理工大学 | Nano-selenium heat-conducting and insulating rubber material and preparation method and application thereof |
| CN113388116A (en) * | 2021-06-24 | 2021-09-14 | 深圳市新纶科技股份有限公司 | Tackifier, heat-conducting gel, heat-conducting interface material, preparation method and application of heat-conducting interface material, and electronic equipment |
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| CN103409116B (en) | 2015-07-22 |
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