TW200704477A - Polishing pad comprising magnetically sensitive particles and method for the use thereof - Google Patents

Polishing pad comprising magnetically sensitive particles and method for the use thereof

Info

Publication number
TW200704477A
TW200704477A TW095122107A TW95122107A TW200704477A TW 200704477 A TW200704477 A TW 200704477A TW 095122107 A TW095122107 A TW 095122107A TW 95122107 A TW95122107 A TW 95122107A TW 200704477 A TW200704477 A TW 200704477A
Authority
TW
Taiwan
Prior art keywords
polishing pad
magnetically sensitive
polishing
sensitive particles
provides
Prior art date
Application number
TW095122107A
Other languages
Chinese (zh)
Inventor
Ronald Myers
Abaneshwar Prasad
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200704477A publication Critical patent/TW200704477A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Abstract

The invention provides polishing pads comprising a deformable polishing pad body and magnetically sensitive particles dispersed therein, wherein one or more properties of the polishing pad are altered when in the presence of an applied magnetic field. The invention further provides a polishing system and a method for polishing a substrate involving such a polishing pad.
TW095122107A 2005-06-21 2006-06-20 Polishing pad comprising magnetically sensitive particles and method for the use thereof TW200704477A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/158,185 US20060286906A1 (en) 2005-06-21 2005-06-21 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Publications (1)

Publication Number Publication Date
TW200704477A true TW200704477A (en) 2007-02-01

Family

ID=37441575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122107A TW200704477A (en) 2005-06-21 2006-06-20 Polishing pad comprising magnetically sensitive particles and method for the use thereof

Country Status (8)

Country Link
US (1) US20060286906A1 (en)
EP (1) EP1915234A2 (en)
JP (1) JP2008546551A (en)
KR (1) KR20080020629A (en)
CN (1) CN101203355A (en)
IL (1) IL187704A0 (en)
TW (1) TW200704477A (en)
WO (1) WO2007001700A2 (en)

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WO2019139586A1 (en) * 2018-01-11 2019-07-18 Intel Corporation Magnetic polishing pad and platen structures for chemical mechanical polishing
US20220023991A1 (en) * 2018-11-27 2022-01-27 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
CN109759966B (en) * 2019-02-22 2023-07-28 华侨大学 Manufacturing method of flexible polishing particle magnetic arrangement polishing disc
JP7264775B2 (en) * 2019-09-03 2023-04-25 エヌ・ティ・ティ・アドバンステクノロジ株式会社 Optical connector polishing pad
CN110788743B (en) * 2019-09-23 2021-11-09 湖南科技大学 Magnetic field controllable slow-release magnetic substance thickening fluid flow polishing pad and polishing method
JP7105334B2 (en) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド Polishing pad and method for manufacturing semiconductor device using the same
CN112608597B (en) * 2020-12-04 2022-03-04 四川大学 High-energy-storage-density polymer composite material and preparation method thereof
JP2022158419A (en) * 2021-04-02 2022-10-17 株式会社荏原製作所 Polishing pad, polishing device, and polishing method
CN113263438A (en) * 2021-05-20 2021-08-17 湘潭大学 Bearing head for controlling polishing pressure and using method thereof

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Also Published As

Publication number Publication date
WO2007001700A3 (en) 2007-02-22
JP2008546551A (en) 2008-12-25
EP1915234A2 (en) 2008-04-30
KR20080020629A (en) 2008-03-05
CN101203355A (en) 2008-06-18
IL187704A0 (en) 2008-08-07
WO2007001700A2 (en) 2007-01-04
US20060286906A1 (en) 2006-12-21

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