KR20070032609A - 개선된 접착성을 갖는 수성 연마 패드 및 제조방법 - Google Patents

개선된 접착성을 갖는 수성 연마 패드 및 제조방법 Download PDF

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Publication number
KR20070032609A
KR20070032609A KR1020060089922A KR20060089922A KR20070032609A KR 20070032609 A KR20070032609 A KR 20070032609A KR 1020060089922 A KR1020060089922 A KR 1020060089922A KR 20060089922 A KR20060089922 A KR 20060089922A KR 20070032609 A KR20070032609 A KR 20070032609A
Authority
KR
South Korea
Prior art keywords
polishing pad
polishing
aqueous
microspheres
cellulose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060089922A
Other languages
English (en)
Korean (ko)
Inventor
듀옹 챠우
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20070032609A publication Critical patent/KR20070032609A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020060089922A 2005-09-19 2006-09-18 개선된 접착성을 갖는 수성 연마 패드 및 제조방법 Withdrawn KR20070032609A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71848905P 2005-09-19 2005-09-19
US60/718,489 2005-09-19

Publications (1)

Publication Number Publication Date
KR20070032609A true KR20070032609A (ko) 2007-03-22

Family

ID=37776011

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060089922A Withdrawn KR20070032609A (ko) 2005-09-19 2006-09-18 개선된 접착성을 갖는 수성 연마 패드 및 제조방법

Country Status (7)

Country Link
US (2) US20070066195A1 (enExample)
JP (1) JP2007088464A (enExample)
KR (1) KR20070032609A (enExample)
CN (1) CN1935461A (enExample)
DE (1) DE102006042674A1 (enExample)
FR (1) FR2890882A1 (enExample)
TW (1) TW200720017A (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7655117B2 (en) 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
CN102672630B (zh) 2006-04-19 2015-03-18 东洋橡胶工业株式会社 抛光垫的制造方法
US7311590B1 (en) * 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
TW200927896A (en) * 2007-12-28 2009-07-01 Iv Technologies Co Ltd Polishing pad and polishing method
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
US8177603B2 (en) * 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
TWI518176B (zh) * 2015-01-12 2016-01-21 三芳化學工業股份有限公司 拋光墊及其製造方法
CN107717762A (zh) * 2017-10-26 2018-02-23 东莞金太阳研磨股份有限公司 一种磨具用的聚酯薄膜基材的处理工艺
CN112423935B (zh) * 2018-06-29 2023-07-21 圣戈班磨料磨具有限公司 磨料制品及其形成方法
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad
CN112318363B (zh) * 2020-11-06 2022-03-11 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法
CN113442056B (zh) * 2021-07-15 2022-12-02 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862074A (en) * 1971-11-30 1975-01-21 Environmental Enterprises Inc Aqueous polymeric compositions of nonionic urethane polymer and acrylic polymer
JPH0726080B2 (ja) * 1987-11-30 1995-03-22 サンスター技研株式会社 高防錆性付与構造用接着剤
DE4127605A1 (de) * 1991-08-21 1993-02-25 Hoechst Ag Haertbare ueberzugsmassen
US6379794B1 (en) * 1992-06-17 2002-04-30 Ppg Industries Ohio, Inc. Acrylic impregnant for fibers
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5643669A (en) * 1996-02-08 1997-07-01 Minnesota Mining And Manufacturing Company Curable water-based coating compositions and cured products thereof
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6169043B1 (en) * 1998-06-17 2001-01-02 Milliken & Company Polyurethane/polyacrylate dispersion coating for airbag fabrics
US6354915B1 (en) * 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
JP4450337B2 (ja) * 1999-02-22 2010-04-14 大日本印刷株式会社 化粧シート
JP2003516872A (ja) * 1999-12-14 2003-05-20 ロデール ホールディングス インコーポレイテッド 高分子又は高分子複合材研磨パッドの製造方法
GB0005612D0 (en) * 2000-03-09 2000-05-03 Avecia Bv Aqueous polymer compositions
WO2001091975A1 (en) * 2000-05-31 2001-12-06 Jsr Corporation Abrasive material
US7112121B2 (en) * 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
AU2001291143A1 (en) * 2000-10-06 2002-04-22 Cabot Microelectronics Corporation Polishing pad comprising a filled translucent region
US20020098784A1 (en) * 2001-01-19 2002-07-25 Saket Chadda Abrasive free polishing in copper damascene applications
US20030104770A1 (en) * 2001-04-30 2003-06-05 Arch Specialty Chemicals, Inc. Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
US6811470B2 (en) * 2001-07-16 2004-11-02 Applied Materials Inc. Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
US6805722B2 (en) * 2002-10-01 2004-10-19 3M Innovative Properties Company Apparatus and method for forming a spiral wound abrasive article, and the resulting article
US20040224259A1 (en) * 2002-12-12 2004-11-11 Shipley Company, L.L.C. Functionalized polymer
US7066801B2 (en) * 2003-02-21 2006-06-27 Dow Global Technologies, Inc. Method of manufacturing a fixed abrasive material
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US6918821B2 (en) * 2003-11-12 2005-07-19 Dow Global Technologies, Inc. Materials and methods for low pressure chemical-mechanical planarization
US7222011B2 (en) * 2004-07-23 2007-05-22 General Motors Corporation Engine and driveline torque transfer device control
KR20060099398A (ko) 2005-03-08 2006-09-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 수계 연마 패드 및 제조 방법
US20080063856A1 (en) 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area

Also Published As

Publication number Publication date
TW200720017A (en) 2007-06-01
US20080188163A1 (en) 2008-08-07
US20070066195A1 (en) 2007-03-22
DE102006042674A1 (de) 2007-03-22
CN1935461A (zh) 2007-03-28
JP2007088464A (ja) 2007-04-05
US8272922B2 (en) 2012-09-25
FR2890882A1 (fr) 2007-03-23

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20060918

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid