24952twf.doc/d Ο ❹ 200927896 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種研磨墊及研磨方法，且特別是有 關於-種具有齡均自度的研磨墊及制此研磨墊的 方法。 【先前技術】 ^隨著科技產業的元件精密度提高，為了確保元件的可 #度’在製作積體電路元件或其他元件時’提供極度平坦 的晶圓表面或基底表面是十分重要的。 在平坦化技術中研磨製程經常為產業所使用，例如化 學機械研磨法(chemical mechanical p〇lishing，CMp)是現今 較常使狀全面性平坦化的技術。在研磨製程巾所使用之 =磨墊’其主要基材通常為高分子㈣。研磨塾的製造過 ，’是由-些城物經舰合，及產生聚合反應所形成。 混口的過転，通常這些組成物可以彼此分散均勻。但在 ，合停止後’組成物畴時或是在製造研磨墊的成型過 組成物可能有聚紐現象，*無法維持混合過程 的均勻/刀散狀態。經聚合反應後形成之研磨塾， 因而受影響。 一” 【發=容】需要—種較均勻的研磨墊以供產業的需求。 的均=明提供—種研磨墊’其組成物使研磨墊具有較佳 本發明另提供-種研磨方法，使用具有組成物均句分 4 200927896 24952twf.doc/d 布之研磨墊，以得到較佳的研磨效果。 本發明提出一種研磨墊，此研磨墊的組成物包括高分 子基材、添加物及流變特性改變劑（rhe〇l〇gy altedng agent)，其中添加物為選自於低密度添加物、高密度添加 物及其組合所組成之群組，而流變特性改變劑之間具有一 結構選自於氫鍵鍵結、締合、以紋向及其組合所組成之 群組。 〇 本發明另提出一種研磨墊，此研磨墊的組成物包括高 分子基材、添加物及流變特性改變劑，其中添加物為選自 於低岔度添加物、高密度添加物及其組合所組成之群組， 而"I L變特性改變劑使此組成物在施加高於過渡剪切速率狀 態下具有低黏度及低於此過渡剪切速率狀態下具有高黏 度。 本發明另提出一種研磨墊，此研磨墊包括高分子基 材、添加物及流變特性改變劑，其中流變特性改變劑於高 分子基材中構成一網狀結構，而分布於高分子基材中之添 Ο 加物為選自於低密度添加物、高密度添加物及其組合所組 成之群組。 本發明提供一種研磨方法’適於用以研磨基底。首 先，提供一研磨墊。接著，對基底施加一壓力以壓置於研 磨墊上，並對基底及研磨墊提供一相對運動。上述研磨墊 具有的組成物包括南分子基材、添加物及流變特性改變 劑，其中添加物為選自於低密度添加物、高密度添加物及 其組合所組成之群組，而流變特性改變劑之間具有一結構 5 200927896 24952twf.doc/d 選自於氫鍵鍵結、締合、空間定向及其組合所組成之群組。 本發明另提供一種研磨方法，適於用以研磨基底。首 先，提供一研磨墊。接著，對基底施加一壓力以壓置於研 磨墊上，並對基底及研磨墊提供一相對運動。上述研磨墊 具有的組成物包括高分子基材、添加物及流變特性改變 劑，其中添加物為選自於低密度添加物、高密度添加物及 其^合所組成之群組，而流變特性改變劑使此組成物在施 ❹ 加冋於過渡剪切速率狀態下具有低黏度及低於此過渡剪切 速率狀態下具有高黏度。 本發明另提供一種研磨方法，適於用以研磨基底。首 先，提供y研磨墊。接著，對基底施加一壓力以壓置於研 磨墊上，並對基底及研磨墊提供一相對運動。上述研磨墊 包括尚分子基材、添加物及流變特性改變劑，其中流變特 性改變劑於南分子基材中構成一網狀結構，而分布於高分 子基材中之添加物為選自於低密度添加物、高密度添加物 及其組合所組成之群組。 〇 I發明之研磨塾’其組成物可轉持在均自分散的狀 態，進而使研磨塾的均勻性得以改善，並得到較佳的研磨 效果。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 牛較佳實關’她合騎圖式，作詳細說明如下。 【實施方式】 _本發明所提出之一種研磨墊，其具有能夠使具有不同 讀添加物的組成物減少因為密度差異而分層的機會，並 24952twf.doc/d 200927896 可使添加物能均勻分散在高分子基材中。此研磨墊包括高 分子基材、添加物以及流變特性改變劑。其中，添加物在 研磨藝纟且成物中的重量百分比為介於〇1%至3〇%之間，且 變特性改變劑在研磨整組成物中的重量百分比為介於 0.5%至30%之間。在一實施例中，添加物在研磨墊中的重 1百分比為介於1%至2〇%之間，且流變特性改變劑在研 磨墊中的重量百分比為介於2〇/。至20%之間。 ❹ 尚分子基材例如是聚酯(polyester)、聚醚(polyether)、 水酉日（polyurethane)、聚碳酸醋（p〇iycarb〇nate)、聚丙稀酸 醋(polyacrylate)、聚丁二烯(p〇iybutadiene)、或其餘經由合 適之熱固性樹脂（thermosetting resin)或熱塑性樹脂 (thermoplastic resin)所合成之聚合物基材等。 添加物為選自於低密度添加物、高密度添加物及其組 合所組成之群組。相對於一般的高分子基材的密度(密度約 0.8〜2.3 g/cm3)，添加物與高分子基材之密度差會大於高分 子基材密度之20%，例如密度差達50%以上。 Ο 低密度添加物之密度約介於0.001至1.0 g/cm3之間。 低费度添加物例如是微球體(micro sphere)、不具反應性氣 體或是發泡劑。其中’微球體例如是Advancell®(Sekisui Chemical Company)或是 Expancel®(Akzo Nobel)等微細中 空球(hallow micro-balloon);或是核心具有液體的微囊體 (liquid core micro-capsulate)，如 Hydrocapsule®(Analytical24952twf.doc/d Ο ❹ 200927896 IX. Description of the Invention: [Technical Field] The present invention relates to a polishing pad and a polishing method, and in particular to a polishing pad having an average degree of self-determination The method of polishing the pad. [Prior Art] As the precision of the components of the technology industry is improved, it is important to provide an extremely flat wafer surface or substrate surface in order to ensure that the component can be made in an integrated circuit component or other component. In the planarization technique, the polishing process is often used in the industry. For example, chemical mechanical polishing (CMp) is a technique that is now more generally flattened. The polishing pad used in the polishing pad is usually a polymer (four). The manufacture of grinding rafts has been formed by the combination of some of the city objects and the polymerization. Over-mixed, usually these compositions can be evenly dispersed from each other. However, when the composition is stopped, the formed composition of the polishing pad or the formed composition of the polishing pad may have a bunching phenomenon, and * the uniform/knife dispersing state of the mixing process cannot be maintained. The abrasive crucible formed after the polymerization reaction is thus affected. A" [fat = capacity] need - a more uniform polishing pad for the needs of the industry. The = provide a kind of polishing pad 'the composition of the polishing pad is better to provide a grinding method, the use of A polishing pad having a composition of 4 200927896 24952 twf.doc/d cloth for better polishing effect. The invention provides a polishing pad, the composition of which comprises a polymer substrate, an additive and a rheology a modifier (rhe〇l〇gy altedng agent), wherein the additive is selected from the group consisting of low density additives, high density additives, and combinations thereof, and the rheological property modifier has a structural choice From the group consisting of hydrogen bonding, association, graining, and combinations thereof. The present invention further provides a polishing pad comprising a polymer substrate, an additive, and a change in rheological properties. The additive, wherein the additive is selected from the group consisting of low-twist additives, high-density additives, and combinations thereof, and the "IL property change agent causes the composition to be applied at a state higher than the transition shear rate With low viscosity and The invention has a high viscosity in the state of the transition shear rate. The invention further provides a polishing pad comprising a polymer substrate, an additive and a rheological property modifier, wherein the rheological property modifier is in the polymer substrate The ruthenium structure is composed of a low-density additive, a high-density additive, and a combination thereof. The present invention provides a method of grinding. For polishing the substrate. First, a polishing pad is provided. Then, a pressure is applied to the substrate to press on the polishing pad, and a relative movement is provided to the substrate and the polishing pad. The polishing pad has a composition including a southern molecular substrate, An additive and a rheological property modifier, wherein the additive is selected from the group consisting of low density additives, high density additives, and combinations thereof, and the rheological property modifier has a structure between 5 200927896 24952twf.doc /d is selected from the group consisting of hydrogen bonding, association, spatial orientation, and combinations thereof. The present invention further provides a grinding method suitable for grinding a substrate. a polishing pad. Then, a pressure is applied to the substrate to press on the polishing pad, and a relative movement is provided to the substrate and the polishing pad. The polishing pad has a composition including a polymer substrate, an additive, and a rheological property modifier. Wherein the additive is selected from the group consisting of a low density additive, a high density additive, and a combination thereof, and the rheological property modifier causes the composition to have a tensile shear rate state Low viscosity and high viscosity below this transitional shear rate state. The present invention further provides a grinding method suitable for grinding a substrate. First, a y polishing pad is provided. Next, a pressure is applied to the substrate to press the polishing. And providing a relative movement to the substrate and the polishing pad. The polishing pad comprises a molecular substrate, an additive and a rheological property modifying agent, wherein the rheological property modifying agent forms a network structure in the south molecular substrate, and The additive distributed in the polymer substrate is selected from the group consisting of low density additives, high density additives, and combinations thereof. The 塾I invented abrasive 塾' composition can be transferred to a self-dispersing state, thereby improving the uniformity of the polishing mash and obtaining a better grinding effect. In order to make the above features and advantages of the present invention more comprehensible, the following is a preferred embodiment of the present invention. [Embodiment] A polishing pad proposed by the present invention has an opportunity to reduce the delamination of a composition having different read additives due to density difference, and 24952 twf.doc/d 200927896 allows the additive to be uniformly dispersed. In the polymer substrate. The polishing pad includes a high molecular weight substrate, an additive, and a rheological property modifier. Wherein, the weight percentage of the additive in the abrasive geisha is between 〇1% and 3%, and the weight change agent in the abrasive composition is between 0.5% and 30% between. In one embodiment, the weight percent of the additive in the polishing pad is between 1% and 2%, and the weight percent of the rheological property modifier in the polishing pad is between 2%. Between 20%. The molecular substrate is, for example, polyester, polyether, polyurethane, polycarbonate, polyacrylate, polybutadiene (polybutadiene). P〇iybutadiene), or a polymer substrate or the like which is synthesized via a suitable thermosetting resin or a thermoplastic resin. The additive is selected from the group consisting of low density additives, high density additives, and combinations thereof. The density difference between the additive and the polymer substrate is greater than 20% of the density of the polymer substrate, for example, the density difference is 50% or more, relative to the density of the general polymer substrate (density: about 0.8 to 2.3 g/cm3). Ο The density of low density additives is between about 0.001 and 1.0 g/cm3. Low cost additives are, for example, micro spheres, non-reactive gases or blowing agents. Wherein the 'microspheres are, for example, Advancell® (Sekisui Chemical Company) or Expancel® (Akzo Nobel) or other hollow core-balloons; or liquid core micro-capsulates, such as Hydrocapsule® (Analytical
Research Systems，INC)。不具反應性氣體例如是二氧化 碳、乾燥空氣、氮氣或氬氣。發泡劑包括無機發泡劑以及 24952twf.doc/d 200927896 有機發泡劑。無機發泡劑例如是水，而有機發泡劑例如是 丙烧、丁烧、戊烧、二氯甲烧、氮化氣氣碳化物（如 HCFC-22、HCFC-141b#)或氫化氟碳化物(如 HFC_134a、 HFC-365mfc、HFC-227ea、HFC-245fa 等）。 南密度添加物之密度約介於1.2至8.0g/cm3之間。高 密度添加物例如是研磨顆粒，其可以為氧化鋁顆粒、氣相 製程(fumed)或膠體(c〇u〇idal)氧化;g夕顆粒、氧化鈽顆粒、陶 瓷顆粒、鑽石顆粒或其他合適之研磨顆粒，以形成具有研 磨顆粒添加於高分子基材中之固定研磨顆粒研磨墊(fixed abrasive polishing pad)。 流變特性改變劑之間具有一結構選自於氫鍵鍵結、締 合、空間定向及其组合所組成之群組，流變特性改變劑可 於高分子基材内形成網狀結構使添加物均勻分布。此外， 流變特性改變劑具有使研磨墊的組成物在施加高於一過渡 剪切速率狀態下具有低黏度及低於此過渡剪切速率狀態下 具有高黏度之特性。 詳言之，上述流變特性改變劑與高分子基材之前驅物 (precursor)流體藉由在結構之間的交互作用，可以使流體具 有假塑性(pseudoplasticity)、觸變性(thixotropy)，或是可有 助於提高流體在靜止狀態下的黏度，流變特性改變劑因而 能夠調整流體之流變特性及黏度。流變特性改變劑有時亦 可稱其為增稠劑(thickner)、抗沉降劑(anti-settling agent；)、 流變調節劑(rheology modifier)、流變添加劑(rhe〇i〇gicai additive)或觸變劑(thixotropic agent)。本發明之研磨塾及其 8 200927896 24952twf.doc/d 組成物中的流變特性改變劑可分為無機流變特性改變劑及 有機流變特性改變劑兩類。 以下將分別說明上述之無機流變特性改變劑及有機 流變特性改變劑。以下之說明是用來詳述本發明以使此熟 習該項技術者能夠據以實施，但並祚用以限定本發明之範 〇 ❹ 無機流變特性改變劑 無機流變特性改變劑的組成成分包括表面具有氫氧 基Μ-oh之氧化物。而且，無機流變特性改變劑單位表面 積具有之氫氧基的數量介於〇·5 M-〇H/nm2至2 M^)H/nm2之間。上述表面具有氫氧基m 〇h之氧化物例 如是以刀子式MxOy所表示之化合物，其中Μ為選自於 矽、鋁、鈦、錘、鈽、鎂、鈣及其組合所組成之群組。以 ㈣例’部抑好會帶錢驗(_ QH)形成矽醇基 (1-，)，石夕醇基之間會形成氫鍵鍵結，產生網狀結構，而 ㈡懸浮或沈降，使添加物能於研磨墊及 層狀在ί—實關巾，無顧㈣性改變劑還包括 i體並傕二：例可以為矽酸鎂(MgSi〇3)。將矽酸鎂加入 :成氫鍵連接份由其而表*面具有之氫氧基(调 浮或沈降，使添加產二磨構塾^^^^ 200927896 24952twf.doc/d 有機流變特性改變劑 有機流變特性改變劑主要可分成乳化劑、溶脹型乳 液、聚氨酯類增稠劑及疏水改性聚_四類。 乳化劑包括陽離子型乳化劑、陰離子型乳化劑及非離 子型乳化劑，其中較佳是使用非離子型乳化劑。非離子型 乳化劑為選自於乙醇之脂肪酸酯、乙二醇、聚乙二醇、丙 二醇、甘油、聚甘油、山梨醇、季戊四醇、甘油酯、蔗糖、 0 脂肪胺與脂肪酿胺、聚甘油醚與聚丙烯乙二醇趟所組成之 群組。上述之聚甘油醚可以為脂肪酸酯之聚甘油醚 (polyglycerol ethers 〇f fatty acid esters) ’ 其例如是甘油醋 (glycerides)或山梨醇醋(s〇rbit〇l esters)。 溶脹型乳液例如是疏水改性鹼溶脹型乳液(HASE)。疏 水改性鹼溶脹型乳液(HASE)是屬於一種締合合成類的增 稍劑，其具有驗性彰潤作用。亦即，疏水改性驗溶脹型乳 液(HASE)在鹼性的條件下，其分子鏈會伸展開，而形成網 狀結構’因此其具有增祠之功效。 〇 聚氨酯類增稠劑例如是疏水改性乙氧基聚氨酯流變 改性劑(HEUR)。疏水改性乙氧基聚氨酯流變改性劑(HEUR) 是一種締合合成類的增稠劑，且其外觀是呈煙霧狀而容易 分散，通常會使用於無溶劑體系。疏水改性乙氧基聚氨酯 流變改性劑(HEUR)是一種以聚乙二醇為基礎的低分子量 聚合物，其通常含有經由氨基曱酸連接之不同長度的聚乙 一醇甘油酯單元，且其末端為疏水性基團。因此，非離子 性的疏水改性乙氧基聚氨酯流變改性劑(HEUR)不須在驗 24952twf.doc/d 200927896 性環境下即可在流體中形成網狀結構，並可恢復疏水連接。 疏水改性聚醚與上述之疏水改性驗溶脹型乳液 (HASE)及疏水改性乙氧基聚氨酯流變改性劑(HEUR)具有 相似的特性。疏水改性聚醚之疏水基能阻止解吸，並具有 締合作用，因而亦可以形成網狀結構而達到增稠效果。 除此之外，有機流變特性改變劑也可以是長鏈狀並具 有極性g能基之化合物’其中此類化合物為選自於酿胺類 化合物、胺類化合物、碳醯二胺類化合物、胺基甲酸酯類 化合物及其組合所組成之群組。其中，此類化合物的平均 分子量約介於5000至500000之間，例如是介於5〇〇〇〇至 200000之間。舉例來說，含極性官能基之化合物可以使用 B YK®系列產品(b γκ—chemie)作為流變特性改變劑，例如 BYK®-41〇為具有脲/胺基曱酸酯成份，將Βγκ@_41〇加入 流體中可以藉由空間定向侧*形細狀結構，而達到減 ^添加物發生懸浮或沈降，使添加物能於研磨墊及其組 物中均句分布。 '' ❹ 接著，將說明以上述研磨墊的組成物應用於形成研磨 塾的方法。町所述的方法僅是為了詳細說明本發明之研 形成研磨墊時會產生的特性，以使熟習此 圖1AS 爾以實施，但並非用以限定本發明之範圍。 干立圖分別是依照本發明—實施例之研磨墊的剖面 特'IIS變IS繪示為本發明之研磨墊組成物中加入流變 雜改林同剪切速率下的黏度變化曲線圖。 此口同分子基材之前驅物流體、添加物與流變 200927896 24952twf.doc/d 特性改變劑’並將其攪拌而形成研磨墊組成物的流體混合 物。其中’高分子基材之前驅物流體系選自酯類(ester)、 謎類(ether)、胺酯類(urethane)、後酸S旨類(carbonate)、丙烯 酸酯類(aerylate)、丁二烯類(butadiene)、或其餘合適之熱固 性樹脂或熱塑性樹脂。添加物為選自於低密度添加物、高 密度添加物及其組合所組成之群組。而流變特性改變劑則 選自如前所述之無機流變特性改變劑或有機流變特性改變 ❹ 劑。在一實施例中，流變特性改變劑之間具有一結構選自 於氫鍵鍵結、締合、空間定向及其組合所組成之群組。 此外，如圖2所示，流變特性改變劑具有使流體混合 物在施加高於一過渡剪切速率210狀態下具有一低黏度， 及低於此過渡剪切速率210狀態下具有一高黏度之特=， 例如流體混合物在低於此過渡剪切速率21〇時的黏度為高 於此過渡剪切速率210的黏度的2倍以上，甚至是5倍= 上。經由高於過渡剪切速率210攪拌後，添加物與流&特 性改變劑即可在流體混合物均勻分布。停止攪拌後，流變 〇 特性改變劑所形成網狀結構，或使流體混合物的黏度2高 的特性，可減少低密度添加物懸浮於上層，及減少=密= 添加物沉降於下層。因此，在組成物貯存時或是在製造^ 磨塾的成型過粒，添加物於流體混合物中仍可保持均勺八 布。在一實施例中，此過渡剪切速率為介於5至20卬瓜: 間，流體混合物在低於此過渡剪切速率(例如為或 土時的黏度為高於此過渡剪切速率(例如為10() 度的U)倍以上。特別說明的是，過渡剪切速率之區間範圍 12 200927896 24952twf.doc/d 會隨組成物之用量或是桶槽尺寸不同而有不同的區 圍，但產業界常用之擾拌設備所提供的剪切速率通常可達 1000 rpm以上，因此可輕易超過此過渡剪切速率。上述流 _性改㈣所造成流變龍改變之雜，仙黏产^ 切速率之關係作為說明，但並非用以限定本發明之圍， 熟習此項技術者當知此特性亦可轉換成剪切力與剪切速率 之關係’或是黏度與固定剪切速率之施加時間之關係來表 ❹達。 承上述右研磨墊組成物的流體混合物是處於貯存狀 態，在製造研磨墊的過程只要施加高於過渡剪切速率的攪 摔’即可減少流體混合物的黏度，以便於使流體混合物經 由聚合反應固化成型為研磨墊，例如是在模具中成型。由 於添加物彼此間被流變特性改變劑構成之網狀 離，因此添加物能均句分布於研磨墊之高分子基材内所= 變特f生改變劑構成之網狀結構除了減少添加物因密度差異 巾產生懸浮或沈降外，更可減少添加制彼此聚集开^成團 塊(agglomeration)的機會。換句話說，相較於相同添加量之 添加物，但無流變特性改變劑所形成之研磨墊，本發明之 研磨墊中不同區域之密度具有較小的密度變異，及具有較 少添加物團塊於本發明之研磨墊中。 /上述研磨墊之組成物可屬單液型(single-liqUid type)反 應系統’或屬雙液型(dual_iiquid type；)或多液型細秦叫咖 ，)反應系統中的其中之一混合物。另外，上述組成物亦 可包括觸媒或鍊延長劑(chain extender)等成份，當為熟知 13 200927896 24952twf.doc/d ，領域之雜人騎壯，餘林 成研磨墊的細㈣可包括將其表面平整 研t 了 另可選擇在研磨層的研磨面上形成溝槽或表面圓=磨】於 :ΓΪ:形成可固定於研磨台上之固定層，另亦可選擇 於研磨層及S1定層中另形成—較軟之支樓層等程 〇 最後所完成之研磨墊如圖1Α至圖1C。舉例來說如 ，1A所不’在研磨墊11〇的組成物中，由於流變特性改 巧臉會在高分子基材·a巾軸驗結構，因此低 ，度添加物UM(如微細巾空球)可,瑪勻分散在最後所完 此之研磨塾110中。如圖1B所示，當研磨塾12()的組成 物是使用高密度添加物1〇6(如氧化飾研磨顆粒)時，藉由流 ^寺性改變劑^㈣在高分子基材觸b t形成的網狀結 才’亦可以使面密度添加物1〇6均勻分散在最後所完成之 研磨塾120中。同樣地，如圖lc所示，當研磨墊13〇的 組成物中同時包括低密度添加物職與高密度添加物 l〇6c時，流變特性改變劑1〇2c可在高分子基材綱c中形 成、’周狀結構，可以使低密度添加物1〇4c與高密度添加物 1〇6c均勻分散在最後所完成之研磨墊130中。 另一方面，本發明所提出之研磨方法，適於用以研磨 基底。首先’提供由上述研磨塾組成物所形成的研磨墊。 接著，對基底施加一壓力以將其壓置於研磨墊上。然後， 對基底及研磨墊提供一相對運動，以移除基底的部分表 面’來達到平坦化之效果。 由於研磨墊具有分布均勻的組成物，因此使用本發明 200927896 24952twf.doc/d 之研磨方法可以獲得較佳的研磨效果。此外，本發明之 磨方法還可選擇性地於研磨過程中供應研聚或溶液，使此 研磨方法成為化學機械研磨製程。 综上所述’本發明之研磨墊可以使其組成物維持在均 勻分散的狀態，進而使研磨墊的均勻性得以改善。而使用 此種具有均勻分布組成物的研磨墊進行研磨方法，可有助 於得到較佳的研磨效果。 〇 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範圍内，當可作些許之更動愈潤飾， 因此本發明之保護範圍當視後附之申請專利範圍^界定者 為準。 【圖式簡單說明】 圖1A至圖1C分別是依照本發明一實施例之研磨墊的 剖面示意圖。 圖2所繪示為本發明之研磨墊組成物中加入流變特性 改變劑後在不同剪切速率下的黏度變化曲線圖。 【主要元件符號說明】 100a、l〇〇b、100c :高分子基材 102a、102b、102c :流變特性改變劑 104、l〇4c :低密度添加物 106、106c :高密度添加物 110、120、130 :研磨塾 210 :過渡剪切速率 15Research Systems, INC). The non-reactive gas is, for example, carbon dioxide, dry air, nitrogen or argon. The blowing agent includes an inorganic blowing agent and an organic blowing agent of 24952 twf.doc/d 200927896. The inorganic foaming agent is, for example, water, and the organic foaming agent is, for example, acrylic, butyl, pentane, methylene chloride, nitriding gas carbide (such as HCFC-22, HCFC-141b#) or hydrofluorination. (such as HFC_134a, HFC-365mfc, HFC-227ea, HFC-245fa, etc.). The density of the southern density additive is between about 1.2 and 8.0 g/cm3. The high-density additive is, for example, abrasive particles, which may be alumina particles, fumed or colloidal (c〇u〇idal) oxidation; g-particles, cerium oxide particles, ceramic particles, diamond particles or other suitable The particles are ground to form a fixed abrasive polishing pad having abrasive particles added to the polymer substrate. The rheological property changing agent has a structure selected from the group consisting of hydrogen bonding, association, spatial orientation and a combination thereof, and the rheological property changing agent can form a network structure in the polymer substrate to add The matter is evenly distributed. Further, the rheological property modifier has a property of causing the composition of the polishing pad to have a high viscosity at a state higher than a transient shear rate and a viscosity lower than a state at which the transition shear rate is lower. In detail, the rheological property modifier and the polymer substrate precursor fluid can have pseudoplasticity, thixotropy, or thixotropy by interaction between structures. It can help to increase the viscosity of the fluid at rest, and the rheological property modifier can thus adjust the rheological properties and viscosity of the fluid. The rheological property modifier may also be referred to as a thickner, an anti-settling agent, a rheology modifier, or a rheological additive (rhe〇i〇gicai additive). Or a thixotropic agent. The rheological property change agent of the abrasive crucible of the present invention and the composition thereof can be classified into two types: an inorganic rheological property modifier and an organic rheological property modifier. The above-described inorganic rheological property modifier and organic rheological property modifier will be separately described below. The following description is intended to describe the present invention in order to enable those skilled in the art to practice, but to limit the composition of the inorganic rheological property change agent inorganic rheological property modifier of the present invention. Including an oxide having a ruthenium hydroxide OH-OH on the surface. Further, the amount of the hydroxyl group per unit surface area of the inorganic rheological property modifier is between 〇·5 M-〇H/nm2 to 2 M^)H/nm2. The above surface having an oxide of the hydroxyl group m 〇 h is, for example, a compound represented by a knife type MxOy, wherein the lanthanum is selected from the group consisting of ruthenium, aluminum, titanium, hammer, strontium, magnesium, calcium, and combinations thereof. . In the case of (4), the Ministry of Economics will take the money to test (_QH) to form a sterol group (1-,), a hydrogen bond will be formed between the bases of the group, resulting in a network structure, and (2) suspension or sedimentation. The additive can be used in the polishing pad and the layered material in the ί-实关巾, and the (4) sex changing agent also includes the i body and the second layer: the case may be magnesium magnesium citrate (MgSi〇3). Magnesium citrate is added: the hydrogen oxy group has a hydroxyl group (the float or sedimentation is added to the surface of the hydrogen bond), and the organic rheological property is changed by the addition of the second mill structure ^^^^^ 200927896 24952twf.doc/d The organic rheological property modifier can be mainly divided into an emulsifier, a swelling emulsion, a polyurethane thickener and a hydrophobic modified poly-four. The emulsifier includes a cationic emulsifier, an anionic emulsifier and a nonionic emulsifier. Preferably, a nonionic emulsifier is used. The nonionic emulsifier is a fatty acid ester selected from the group consisting of ethanol, ethylene glycol, polyethylene glycol, propylene glycol, glycerin, polyglycerin, sorbitol, pentaerythritol, glycerol, a group consisting of sucrose, 0 fatty amines and fatty amines, polyglycerol ethers and polypropylene glycol oxime. The above polyglycerol ethers may be polyglycerol ethers 〇f fatty acid esters' It is, for example, glycerides or s〇rbit〇l esters. The swelling type emulsion is, for example, a hydrophobically modified alkali swellable emulsion (HASE). The hydrophobically modified alkali swellable emulsion (HASE) is a kind Association of synthetic A little agent, it has an inspective effect. That is, the hydrophobic modified swelling type emulsion (HASE) under alkaline conditions, its molecular chain will expand, and form a network structure 'so it has an increase 〇 Polyurethane thickeners are, for example, hydrophobically modified ethoxylated polyurethane rheology modifiers (HEUR). Hydrophobically modified ethoxylated polyurethane rheology modifiers (HEUR) are a combination of synthetic thickening Agent, and its appearance is aerosol-like and easy to disperse, usually used in solvent-free systems. Hydrophobically modified ethoxylated polyurethane rheology modifier (HEUR) is a polyethylene glycol-based low molecular weight polymer. , which usually contains different lengths of polyglycidyl glyceride units linked via amino amic acid, and whose ends are hydrophobic groups. Therefore, nonionic hydrophobically modified ethoxylated polyurethane rheology modifier (HEUR) It is not necessary to form a network structure in the fluid under the environment of 24952twf.doc/d 200927896, and the hydrophobic connection can be restored. Hydrophobic modified polyether and the above hydrophobic modified swelling emulsion (HASE) and hydrophobic modification Rheology modification of ethoxylated polyurethane (HEUR) has similar characteristics. The hydrophobic group of the hydrophobically modified polyether can prevent desorption and have a association, so that a network structure can be formed to achieve a thickening effect. In addition, the organic rheological property modifier It may also be a long-chain compound having a polar g-energy group, wherein such a compound is selected from the group consisting of a brewing amine compound, an amine compound, a carbon quinone diamine compound, a urethane compound, and a combination thereof. Wherein the average molecular weight of such compounds is between about 5,000 and 500,000, for example between 5 and 200,000. For example, a compound containing a polar functional group can use a B YK® series product (b γκ-chemie) as a rheological property modifier, for example, BYK®-41 is a urea/amino phthalate component, and Βγκ@ The addition of _41〇 to the fluid can be achieved by spatially orienting the side-shaped fine structure, thereby achieving suspension or sedimentation of the additive, so that the additive can be uniformly distributed in the polishing pad and its composition. '' ❹ Next, a method of applying the composition of the above polishing pad to form a polishing crucible will be explained. The method described in the present invention is only for the purpose of explaining in detail the characteristics which will be produced when the polishing pad of the present invention is formed, so as to be implemented by the present invention, but is not intended to limit the scope of the present invention. The dry figures are respectively the cross-section of the polishing pad according to the present invention - the 'IIS change IS' is a graph showing the viscosity change of the rheological modified forest at the shear rate of the polishing pad composition of the present invention. This mouth is the same as the molecular substrate precursor fluid, the additive and the rheology 200927896 24952 twf.doc / d property change agent 'and stir it to form a fluid mixture of the polishing pad composition. The 'polymer substrate precursor flow system is selected from the group consisting of esters, ethers, urethanes, post-acids, carbonates, aerylates, butadiene. Butadiene, or other suitable thermosetting resin or thermoplastic resin. The additive is selected from the group consisting of low density additives, high density additives, and combinations thereof. The rheological property modifier is selected from the group consisting of inorganic rheological property modifiers or organic rheological properties modifiers as described above. In one embodiment, the rheological property modifying agent has a structure selected from the group consisting of hydrogen bonding, association, spatial orientation, and combinations thereof. Further, as shown in FIG. 2, the rheological property changing agent has a low viscosity at a state in which the fluid mixture is applied above a transition shear rate 210, and a high viscosity in a state lower than the transition shear rate 210. Specifically, for example, the viscosity of the fluid mixture below 21 过渡 at this transitional shear rate is more than twice or even 5 times the viscosity of the transition shear rate 210. After agitation above the transition shear rate 210, the additive and flow & modifier can be evenly distributed throughout the fluid mixture. After the agitation is stopped, the rheological enthalpy of the rheology-modifying agent or the high viscosity of the fluid mixture can reduce the suspension of the low-density additive in the upper layer and reduce the density of the additive to the lower layer. Therefore, the additive can remain evenly distributed in the fluid mixture during storage of the composition or in the formation of the granulated granules. In one embodiment, the transition shear rate is between 5 and 20, and the fluid mixture is below this transitional shear rate (eg, the viscosity of the soil or soil is above the transition shear rate (eg, It is more than U times the degree of 10 () degrees. In particular, the range of the transitional shear rate is 12 200927896 24952twf.doc / d will vary depending on the amount of the composition or the size of the tank, but The shear rate provided by the scrambling equipment commonly used in the industry usually reaches more than 1000 rpm, so the transitional shear rate can be easily exceeded. The above-mentioned flow _ change (4) causes the rheological change of the dragon to change, The relationship of the rates is illustrative, but is not intended to limit the scope of the present invention. It is known to those skilled in the art that this property can also be converted into the relationship between shear force and shear rate' or the application time of viscosity and fixed shear rate. The relationship between the fluid mixture of the above right polishing pad composition is in a storage state, and the viscosity of the fluid mixture can be reduced by applying a stirring force higher than the transitional shear rate during the process of manufacturing the polishing pad. Make flow The bulk mixture is solidified into a polishing pad by polymerization, for example, molding in a mold. Since the additives are separated from each other by a rheological property changing agent, the additive can be uniformly distributed on the polymer substrate of the polishing pad. In addition to reducing the additive's suspension or sedimentation due to the difference in density, the mesh structure of the internal variable = can reduce the chance of adding agglomeration to each other. In other words, Compared to the same additive amount of additive, but without the rheological property modifier, the density of different regions in the polishing pad of the present invention has a smaller density variation, and has less additive agglomerates. In the polishing pad of the invention. The composition of the above polishing pad may be a single-liq Uid type reaction system or a dual-type (dual_iiquid type) or a multi-liquid type fine Qin called coffee, in the reaction system. One of the mixtures. In addition, the above composition may also include a catalyst or a chain extender and the like. When it is known as 13 200927896 24952 twf.doc/d, the field of the miscellaneous rider, the Yu Lincheng polishing pad fine (four) may include The surface is flattened. Alternatively, a groove or surface circle may be formed on the polishing surface of the polishing layer. 磨: a fixed layer that can be fixed on the polishing table, or an abrasive layer and S1 Another layer is formed in the layer - the softer branch level is equal to the last completed polishing pad as shown in Fig. 1 to Fig. 1C. For example, if the 1A does not 'in the composition of the polishing pad 11〇, the rheological property is changed, the face will be in the polymer substrate, and the structure is low, and the additive UM (such as a micro towel) Empty ball), Ma is scattered in the last grinding 塾 110. As shown in FIG. 1B, when the composition of the polishing crucible 12() is a high-density additive 1〇6 (such as an oxidized abrasive particle), it is touched on the polymer substrate by a flow-changing agent (4). The formed networked knot can also uniformly disperse the areal density additive 1〇6 in the final finished crucible 120. Similarly, as shown in FIG. 1c, when the composition of the polishing pad 13〇 includes both the low-density additive and the high-density additive l〇6c, the rheological property changing agent 1〇2c can be used in the polymer substrate. The formation of a 'circumferential structure' in c allows the low density additive 1〇4c and the high density additive 1〇6c to be uniformly dispersed in the last completed polishing pad 130. In another aspect, the polishing method of the present invention is suitable for use in grinding a substrate. First, a polishing pad formed of the above-described abrasive enamel composition is provided. Next, a pressure is applied to the substrate to press it onto the polishing pad. Then, a relative movement is provided to the substrate and the polishing pad to remove a portion of the surface of the substrate to achieve a planarization effect. Since the polishing pad has a uniformly distributed composition, a preferred grinding effect can be obtained by the grinding method of the present invention 200927896 24952 twf.doc/d. Further, the grinding method of the present invention can selectively supply the grinding polymerization or solution during the grinding process, making the grinding method a chemical mechanical polishing process. As described above, the polishing pad of the present invention can maintain its composition in a uniformly dispersed state, thereby improving the uniformity of the polishing pad. The use of such a polishing pad having a uniformly distributed composition for the grinding method can contribute to a better grinding effect. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make a little more change without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figs. 1A to 1C are schematic cross-sectional views showing a polishing pad according to an embodiment of the present invention, respectively. Fig. 2 is a graph showing the viscosity change at different shear rates after adding a rheological property modifier to the polishing pad composition of the present invention. [Explanation of main component symbols] 100a, l〇〇b, 100c: polymer base material 102a, 102b, 102c: rheological property change agent 104, l4c: low density additive 106, 106c: high density additive 110, 120, 130: grinding 塾 210: transition shear rate 15