CN1935461A - 具有改进的粘着性的水基抛光垫及其制造方法 - Google Patents

具有改进的粘着性的水基抛光垫及其制造方法 Download PDF

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Publication number
CN1935461A
CN1935461A CNA2006101517951A CN200610151795A CN1935461A CN 1935461 A CN1935461 A CN 1935461A CN A2006101517951 A CNA2006101517951 A CN A2006101517951A CN 200610151795 A CN200610151795 A CN 200610151795A CN 1935461 A CN1935461 A CN 1935461A
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CN
China
Prior art keywords
polishing pad
polishing
polymer matrix
water
cellulose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006101517951A
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English (en)
Chinese (zh)
Inventor
C·H·杜昂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROHM AND HAAS ELECTRONIC MATER
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROHM AND HAAS ELECTRONIC MATER filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN1935461A publication Critical patent/CN1935461A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNA2006101517951A 2005-09-19 2006-09-07 具有改进的粘着性的水基抛光垫及其制造方法 Pending CN1935461A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71848905P 2005-09-19 2005-09-19
US60/718,489 2005-09-19

Publications (1)

Publication Number Publication Date
CN1935461A true CN1935461A (zh) 2007-03-28

Family

ID=37776011

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006101517951A Pending CN1935461A (zh) 2005-09-19 2006-09-07 具有改进的粘着性的水基抛光垫及其制造方法

Country Status (7)

Country Link
US (2) US20070066195A1 (enExample)
JP (1) JP2007088464A (enExample)
KR (1) KR20070032609A (enExample)
CN (1) CN1935461A (enExample)
DE (1) DE102006042674A1 (enExample)
FR (1) FR2890882A1 (enExample)
TW (1) TW200720017A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103386653A (zh) * 2012-05-11 2013-11-13 罗门哈斯电子材料Cmp控股股份有限公司 碱土金属氧化物-聚合物抛光垫
CN103386655A (zh) * 2012-05-11 2013-11-13 罗门哈斯电子材料Cmp控股股份有限公司 形成碱土金属氧化物抛光垫
CN107717762A (zh) * 2017-10-26 2018-02-23 东莞金太阳研磨股份有限公司 一种磨具用的聚酯薄膜基材的处理工艺
CN112423935A (zh) * 2018-06-29 2021-02-26 圣戈班磨料磨具有限公司 磨料制品及其形成方法
CN113442056A (zh) * 2021-07-15 2021-09-28 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法

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US7655117B2 (en) 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
CN102672630B (zh) 2006-04-19 2015-03-18 东洋橡胶工业株式会社 抛光垫的制造方法
US7311590B1 (en) * 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
TW200927896A (en) * 2007-12-28 2009-07-01 Iv Technologies Co Ltd Polishing pad and polishing method
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
US8177603B2 (en) * 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
TWI518176B (zh) * 2015-01-12 2016-01-21 三芳化學工業股份有限公司 拋光墊及其製造方法
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad
CN112318363B (zh) * 2020-11-06 2022-03-11 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法

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US20020098784A1 (en) * 2001-01-19 2002-07-25 Saket Chadda Abrasive free polishing in copper damascene applications
US20030104770A1 (en) * 2001-04-30 2003-06-05 Arch Specialty Chemicals, Inc. Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
US6811470B2 (en) * 2001-07-16 2004-11-02 Applied Materials Inc. Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
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US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US6918821B2 (en) * 2003-11-12 2005-07-19 Dow Global Technologies, Inc. Materials and methods for low pressure chemical-mechanical planarization
US7222011B2 (en) * 2004-07-23 2007-05-22 General Motors Corporation Engine and driveline torque transfer device control
KR20060099398A (ko) 2005-03-08 2006-09-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 수계 연마 패드 및 제조 방법
US20080063856A1 (en) 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103386653A (zh) * 2012-05-11 2013-11-13 罗门哈斯电子材料Cmp控股股份有限公司 碱土金属氧化物-聚合物抛光垫
CN103386655A (zh) * 2012-05-11 2013-11-13 罗门哈斯电子材料Cmp控股股份有限公司 形成碱土金属氧化物抛光垫
CN103386653B (zh) * 2012-05-11 2016-12-28 罗门哈斯电子材料Cmp控股股份有限公司 碱土金属氧化物‑聚合物抛光垫
CN103386655B (zh) * 2012-05-11 2016-12-28 罗门哈斯电子材料Cmp控股股份有限公司 形成碱土金属氧化物抛光垫
TWI572644B (zh) * 2012-05-11 2017-03-01 羅門哈斯電子材料Ｃｍｐ控股公司 鹼土金屬氧化物－聚合質硏磨墊
CN107717762A (zh) * 2017-10-26 2018-02-23 东莞金太阳研磨股份有限公司 一种磨具用的聚酯薄膜基材的处理工艺
CN112423935A (zh) * 2018-06-29 2021-02-26 圣戈班磨料磨具有限公司 磨料制品及其形成方法
CN113442056A (zh) * 2021-07-15 2021-09-28 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法
CN113442056B (zh) * 2021-07-15 2022-12-02 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法

Also Published As

Publication number Publication date
TW200720017A (en) 2007-06-01
US20080188163A1 (en) 2008-08-07
KR20070032609A (ko) 2007-03-22
US20070066195A1 (en) 2007-03-22
DE102006042674A1 (de) 2007-03-22
JP2007088464A (ja) 2007-04-05
US8272922B2 (en) 2012-09-25
FR2890882A1 (fr) 2007-03-23

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication