JP2007088464A5 - - Google Patents
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- Publication number
- JP2007088464A5 JP2007088464A5 JP2006252243A JP2006252243A JP2007088464A5 JP 2007088464 A5 JP2007088464 A5 JP 2007088464A5 JP 2006252243 A JP2006252243 A JP 2006252243A JP 2006252243 A JP2006252243 A JP 2006252243A JP 2007088464 A5 JP2007088464 A5 JP 2007088464A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- permeable substrate
- microspheres
- polymer composition
- polymer matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 14
- 229920000642 polymer Polymers 0.000 claims 13
- 239000000203 mixture Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 9
- 239000011159 matrix material Substances 0.000 claims 6
- 239000004005 microsphere Substances 0.000 claims 6
- 239000006185 dispersion Substances 0.000 claims 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 3
- 239000012530 fluid Substances 0.000 claims 3
- 239000012071 phase Substances 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims 2
- 229920000858 Cyclodextrin Polymers 0.000 claims 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims 2
- 239000002202 Polyethylene glycol Substances 0.000 claims 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 2
- 229920002125 Sokalan® Polymers 0.000 claims 2
- 229920002472 Starch Polymers 0.000 claims 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims 2
- 239000011976 maleic acid Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229920000609 methyl cellulose Polymers 0.000 claims 2
- 239000001923 methylcellulose Substances 0.000 claims 2
- 235000010981 methylcellulose Nutrition 0.000 claims 2
- 239000001814 pectin Substances 0.000 claims 2
- 229920001277 pectin Polymers 0.000 claims 2
- 235000010987 pectin Nutrition 0.000 claims 2
- 229920002401 polyacrylamide Polymers 0.000 claims 2
- 239000004584 polyacrylic acid Substances 0.000 claims 2
- 229920002239 polyacrylonitrile Polymers 0.000 claims 2
- 229920001223 polyethylene glycol Polymers 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 claims 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims 2
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 claims 2
- 239000008107 starch Substances 0.000 claims 2
- 235000019698 starch Nutrition 0.000 claims 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 2
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 230000004927 fusion Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011148 porous material Substances 0.000 claims 1
- 239000006254 rheological additive Substances 0.000 claims 1
- 239000007790 solid phase Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71848905P | 2005-09-19 | 2005-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007088464A JP2007088464A (ja) | 2007-04-05 |
| JP2007088464A5 true JP2007088464A5 (enExample) | 2009-09-17 |
Family
ID=37776011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006252243A Pending JP2007088464A (ja) | 2005-09-19 | 2006-09-19 | 改善された付着性を有する水性研磨パッド及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20070066195A1 (enExample) |
| JP (1) | JP2007088464A (enExample) |
| KR (1) | KR20070032609A (enExample) |
| CN (1) | CN1935461A (enExample) |
| DE (1) | DE102006042674A1 (enExample) |
| FR (1) | FR2890882A1 (enExample) |
| TW (1) | TW200720017A (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7655117B2 (en) | 2005-04-06 | 2010-02-02 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
| US7744732B2 (en) * | 2005-04-06 | 2010-06-29 | Leviton Manufacturing Company, Inc. | Continuous plating system and method with mask registration |
| CN102672630B (zh) | 2006-04-19 | 2015-03-18 | 东洋橡胶工业株式会社 | 抛光垫的制造方法 |
| US7311590B1 (en) * | 2007-01-31 | 2007-12-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to retain slurry on the pad texture |
| JP4943233B2 (ja) * | 2007-05-31 | 2012-05-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| US7635290B2 (en) * | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
| US8182655B2 (en) * | 2007-09-05 | 2012-05-22 | Leviton Manufacturing Co., Inc. | Plating systems and methods |
| TW200927896A (en) * | 2007-12-28 | 2009-07-01 | Iv Technologies Co Ltd | Polishing pad and polishing method |
| TWI360459B (en) * | 2008-04-11 | 2012-03-21 | Bestac Advanced Material Co Ltd | A polishing pad having groove structure for avoidi |
| US8177603B2 (en) * | 2008-04-29 | 2012-05-15 | Semiquest, Inc. | Polishing pad composition |
| US8303375B2 (en) | 2009-01-12 | 2012-11-06 | Novaplanar Technology, Inc. | Polishing pads for chemical mechanical planarization and/or other polishing methods |
| KR20100096459A (ko) * | 2009-02-24 | 2010-09-02 | 삼성전자주식회사 | 화학적 기계적 연마장치 |
| US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
| US11090778B2 (en) | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
| US10722997B2 (en) * | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
| US9073172B2 (en) * | 2012-05-11 | 2015-07-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Alkaline-earth metal oxide-polymeric polishing pad |
| US8888877B2 (en) * | 2012-05-11 | 2014-11-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Forming alkaline-earth metal oxide polishing pad |
| US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
| US9522454B2 (en) * | 2012-12-17 | 2016-12-20 | Seagate Technology Llc | Method of patterning a lapping plate, and patterned lapping plates |
| TWI518176B (zh) * | 2015-01-12 | 2016-01-21 | 三芳化學工業股份有限公司 | 拋光墊及其製造方法 |
| CN107717762A (zh) * | 2017-10-26 | 2018-02-23 | 东莞金太阳研磨股份有限公司 | 一种磨具用的聚酯薄膜基材的处理工艺 |
| CN112423935B (zh) * | 2018-06-29 | 2023-07-21 | 圣戈班磨料磨具有限公司 | 磨料制品及其形成方法 |
| TWI850338B (zh) * | 2019-02-28 | 2024-08-01 | 美商應用材料股份有限公司 | 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法 |
| US11667061B2 (en) * | 2020-04-18 | 2023-06-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming leveraged poromeric polishing pad |
| CN112318363B (zh) * | 2020-11-06 | 2022-03-11 | 万华化学集团电子材料有限公司 | 一种化学机械抛光垫的抛光层及其制备方法 |
| CN113442056B (zh) * | 2021-07-15 | 2022-12-02 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫及其制备方法、半导体器件的制造方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3862074A (en) * | 1971-11-30 | 1975-01-21 | Environmental Enterprises Inc | Aqueous polymeric compositions of nonionic urethane polymer and acrylic polymer |
| JPH0726080B2 (ja) * | 1987-11-30 | 1995-03-22 | サンスター技研株式会社 | 高防錆性付与構造用接着剤 |
| DE4127605A1 (de) * | 1991-08-21 | 1993-02-25 | Hoechst Ag | Haertbare ueberzugsmassen |
| US6379794B1 (en) * | 1992-06-17 | 2002-04-30 | Ppg Industries Ohio, Inc. | Acrylic impregnant for fibers |
| US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5643669A (en) * | 1996-02-08 | 1997-07-01 | Minnesota Mining And Manufacturing Company | Curable water-based coating compositions and cured products thereof |
| US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US6169043B1 (en) * | 1998-06-17 | 2001-01-02 | Milliken & Company | Polyurethane/polyacrylate dispersion coating for airbag fabrics |
| US6354915B1 (en) * | 1999-01-21 | 2002-03-12 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| JP4450337B2 (ja) * | 1999-02-22 | 2010-04-14 | 大日本印刷株式会社 | 化粧シート |
| JP2003516872A (ja) * | 1999-12-14 | 2003-05-20 | ロデール ホールディングス インコーポレイテッド | 高分子又は高分子複合材研磨パッドの製造方法 |
| GB0005612D0 (en) * | 2000-03-09 | 2000-05-03 | Avecia Bv | Aqueous polymer compositions |
| WO2001091975A1 (en) * | 2000-05-31 | 2001-12-06 | Jsr Corporation | Abrasive material |
| US7112121B2 (en) * | 2000-08-30 | 2006-09-26 | Micron Technology, Inc. | Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| AU2001291143A1 (en) * | 2000-10-06 | 2002-04-22 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
| US20020098784A1 (en) * | 2001-01-19 | 2002-07-25 | Saket Chadda | Abrasive free polishing in copper damascene applications |
| US20030104770A1 (en) * | 2001-04-30 | 2003-06-05 | Arch Specialty Chemicals, Inc. | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers |
| US6811470B2 (en) * | 2001-07-16 | 2004-11-02 | Applied Materials Inc. | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
| US6805722B2 (en) * | 2002-10-01 | 2004-10-19 | 3M Innovative Properties Company | Apparatus and method for forming a spiral wound abrasive article, and the resulting article |
| US20040224259A1 (en) * | 2002-12-12 | 2004-11-11 | Shipley Company, L.L.C. | Functionalized polymer |
| US7066801B2 (en) * | 2003-02-21 | 2006-06-27 | Dow Global Technologies, Inc. | Method of manufacturing a fixed abrasive material |
| US6910951B2 (en) * | 2003-02-24 | 2005-06-28 | Dow Global Technologies, Inc. | Materials and methods for chemical-mechanical planarization |
| US6918821B2 (en) * | 2003-11-12 | 2005-07-19 | Dow Global Technologies, Inc. | Materials and methods for low pressure chemical-mechanical planarization |
| US7222011B2 (en) * | 2004-07-23 | 2007-05-22 | General Motors Corporation | Engine and driveline torque transfer device control |
| KR20060099398A (ko) | 2005-03-08 | 2006-09-19 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 수계 연마 패드 및 제조 방법 |
| US20080063856A1 (en) | 2006-09-11 | 2008-03-13 | Duong Chau H | Water-based polishing pads having improved contact area |
-
2006
- 2006-08-11 TW TW095129494A patent/TW200720017A/zh unknown
- 2006-08-14 US US11/504,415 patent/US20070066195A1/en not_active Abandoned
- 2006-09-07 CN CNA2006101517951A patent/CN1935461A/zh active Pending
- 2006-09-12 DE DE102006042674A patent/DE102006042674A1/de not_active Withdrawn
- 2006-09-18 KR KR1020060089922A patent/KR20070032609A/ko not_active Withdrawn
- 2006-09-19 FR FR0653809A patent/FR2890882A1/fr not_active Withdrawn
- 2006-09-19 JP JP2006252243A patent/JP2007088464A/ja active Pending
-
2008
- 2008-04-23 US US12/055,621 patent/US8272922B2/en active Active