JP2007080994A5 - - Google Patents

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Publication number
JP2007080994A5
JP2007080994A5 JP2005264896A JP2005264896A JP2007080994A5 JP 2007080994 A5 JP2007080994 A5 JP 2007080994A5 JP 2005264896 A JP2005264896 A JP 2005264896A JP 2005264896 A JP2005264896 A JP 2005264896A JP 2007080994 A5 JP2007080994 A5 JP 2007080994A5
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solid
state
power receiving
main body
glass
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JP2005264896A
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JP5219331B2 (ja
JP2007080994A (ja
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Priority to US11/517,588 priority patent/US7825575B2/en
Publication of JP2007080994A publication Critical patent/JP2007080994A/ja
Publication of JP2007080994A5 publication Critical patent/JP2007080994A5/ja
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JP2005264896A 2005-09-13 2005-09-13 固体素子デバイスの製造方法 Expired - Fee Related JP5219331B2 (ja)

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Application Number Priority Date Filing Date Title
JP2005264896A JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法
US11/517,588 US7825575B2 (en) 2005-09-13 2006-09-08 Solid-state element device and light-emitting apparatus using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005264896A JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法

Publications (3)

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JP2007080994A JP2007080994A (ja) 2007-03-29
JP2007080994A5 true JP2007080994A5 (enExample) 2008-03-21
JP5219331B2 JP5219331B2 (ja) 2013-06-26

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JP (1) JP5219331B2 (enExample)

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US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
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JP7035338B2 (ja) * 2017-05-22 2022-03-15 日本電気硝子株式会社 接合体の製造方法
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