JP2007080994A5 - - Google Patents

Download PDF

Info

Publication number
JP2007080994A5
JP2007080994A5 JP2005264896A JP2005264896A JP2007080994A5 JP 2007080994 A5 JP2007080994 A5 JP 2007080994A5 JP 2005264896 A JP2005264896 A JP 2005264896A JP 2005264896 A JP2005264896 A JP 2005264896A JP 2007080994 A5 JP2007080994 A5 JP 2007080994A5
Authority
JP
Japan
Prior art keywords
solid
state
power receiving
main body
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005264896A
Other languages
English (en)
Japanese (ja)
Other versions
JP5219331B2 (ja
JP2007080994A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005264896A priority Critical patent/JP5219331B2/ja
Priority claimed from JP2005264896A external-priority patent/JP5219331B2/ja
Priority to US11/517,588 priority patent/US7825575B2/en
Publication of JP2007080994A publication Critical patent/JP2007080994A/ja
Publication of JP2007080994A5 publication Critical patent/JP2007080994A5/ja
Application granted granted Critical
Publication of JP5219331B2 publication Critical patent/JP5219331B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2005264896A 2005-09-13 2005-09-13 固体素子デバイスの製造方法 Expired - Lifetime JP5219331B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005264896A JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法
US11/517,588 US7825575B2 (en) 2005-09-13 2006-09-08 Solid-state element device and light-emitting apparatus using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005264896A JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2007080994A JP2007080994A (ja) 2007-03-29
JP2007080994A5 true JP2007080994A5 (enExample) 2008-03-21
JP5219331B2 JP5219331B2 (ja) 2013-06-26

Family

ID=37883661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005264896A Expired - Lifetime JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法

Country Status (2)

Country Link
US (1) US7825575B2 (enExample)
JP (1) JP5219331B2 (enExample)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI321857B (en) * 2006-07-21 2010-03-11 Epistar Corp A light emitting device
JP5104490B2 (ja) * 2007-04-16 2012-12-19 豊田合成株式会社 発光装置及びその製造方法
US7781779B2 (en) * 2007-05-08 2010-08-24 Luminus Devices, Inc. Light emitting devices including wavelength converting material
WO2009031684A1 (ja) * 2007-09-07 2009-03-12 Asahi Glass Company, Limited ガラス被覆発光素子及びガラス被覆発光装置
DE102008005345A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Halbleiterbasiertes Bauelement, Aufnahme für ein halbleiterbasiertes Bauelement und Verfahren zur Herstellung eines halbleiterbasierten Bauelements
JP4796031B2 (ja) * 2007-09-28 2011-10-19 パナソニック株式会社 車両前照灯光源および車両前照灯
US8946987B2 (en) * 2007-11-07 2015-02-03 Industrial Technology Research Institute Light emitting device and fabricating method thereof
CN101855735A (zh) * 2007-11-19 2010-10-06 松下电器产业株式会社 半导体发光装置及半导体发光装置的制造方法
JP5302533B2 (ja) * 2007-11-30 2013-10-02 パナソニック株式会社 発光装置
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP2010129615A (ja) * 2008-11-25 2010-06-10 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP5146356B2 (ja) * 2009-02-24 2013-02-20 豊田合成株式会社 発光装置及びその製造方法
CN102576796B (zh) * 2009-09-25 2015-07-01 海洋王照明科技股份有限公司 半导体发光器件及其封装方法
CN102510803A (zh) * 2009-09-25 2012-06-20 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
CN102481762A (zh) * 2009-09-25 2012-05-30 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
WO2011035475A1 (zh) * 2009-09-25 2011-03-31 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
EP2481574B1 (en) * 2009-09-25 2017-05-31 Ocean's King Lighting Science & Technology Co., Ltd. Luminescent glass, producing method thereof and luminescent device
CN102548757A (zh) * 2009-09-25 2012-07-04 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
JP2013506010A (ja) * 2009-09-25 2013-02-21 海洋王照明科技股▲ふん▼有限公司 発光ガラス及びその製造方法、並びに発光装置
WO2011035482A1 (zh) * 2009-09-25 2011-03-31 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
JP5330306B2 (ja) * 2010-03-30 2013-10-30 豊田合成株式会社 発光装置
US8545083B2 (en) 2009-12-22 2013-10-01 Sumita Optical Glass, Inc. Light-emitting device, light source and method of manufacturing the same
KR20110087579A (ko) * 2010-01-26 2011-08-03 삼성엘이디 주식회사 Ｌｅｄ 모듈과 이를 구비하는 백라이트 유닛
JP5287747B2 (ja) * 2010-01-29 2013-09-11 豊田合成株式会社 線状光源装置
JP2011187587A (ja) * 2010-03-05 2011-09-22 Seiko Instruments Inc 発光デバイス
JP5786278B2 (ja) * 2010-04-07 2015-09-30 日亜化学工業株式会社 発光装置
US8723409B2 (en) 2010-04-07 2014-05-13 Nichia Corporation Light emitting device
EP2632868A1 (en) 2010-10-28 2013-09-04 Corning Incorporated Phosphor containing glass frit materials for led lighting applications
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
JP5661552B2 (ja) * 2010-12-24 2015-01-28 シチズンホールディングス株式会社 半導体発光装置及びその製造方法
KR101766299B1 (ko) * 2011-01-20 2017-08-08 삼성전자 주식회사 발광소자 패키지 및 그 제조 방법
US8754440B2 (en) * 2011-03-22 2014-06-17 Tsmc Solid State Lighting Ltd. Light-emitting diode (LED) package systems and methods of making the same
JP2012212733A (ja) 2011-03-30 2012-11-01 Toyoda Gosei Co Ltd 発光装置
JP5703997B2 (ja) * 2011-06-29 2015-04-22 豊田合成株式会社 発光装置
JP2014525146A (ja) 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US9240530B2 (en) * 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
WO2013148783A1 (en) 2012-03-30 2013-10-03 Corning Incorporated Bismuth borate glass encapsulant for led phosphors
WO2013168037A1 (en) * 2012-05-08 2013-11-14 Koninklijke Philips N.V. Remote phosphor and led package
JP2013258209A (ja) * 2012-06-11 2013-12-26 Nitto Denko Corp 封止シート、発光ダイオード装置およびその製造方法
JP6205894B2 (ja) 2012-07-04 2017-10-04 日亜化学工業株式会社 発光装置用パッケージ成形体およびそれを用いた発光装置
TW201415681A (zh) * 2012-10-08 2014-04-16 Lextar Electronics Corp 壓模式發光裝置及其製造方法
KR101977278B1 (ko) * 2012-10-29 2019-09-10 엘지이노텍 주식회사 발광 소자
US10017849B2 (en) 2012-11-29 2018-07-10 Corning Incorporated High rate deposition systems and processes for forming hermetic barrier layers
US9202996B2 (en) * 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates
CN103050606A (zh) * 2013-01-11 2013-04-17 华南师范大学 一种高显色指数大功率led封装结构及其制造方法
WO2014159894A1 (en) * 2013-03-14 2014-10-02 Corning Incorporated Led lighting devices
CN106195924B (zh) * 2013-06-08 2019-05-03 深圳光峰科技股份有限公司 一种波长转换装置及其制作方法、相关发光装置
CN105637061A (zh) 2013-08-05 2016-06-01 康宁股份有限公司 发光的涂层和装置
JP6152801B2 (ja) * 2014-01-21 2017-06-28 豊田合成株式会社 発光装置及びその製造方法
WO2015138495A1 (en) * 2014-03-11 2015-09-17 Osram Sylvania Inc. Light converter assemblies with enhanced heat dissipation
DE102015107593A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Leuchtmittel
WO2017023502A1 (en) 2015-08-03 2017-02-09 Koninklijke Philips N.V. Semiconductor light emitting device with reflective side coating
DE102016114474A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden Bauelement
KR20180083011A (ko) * 2017-01-11 2018-07-20 삼성디스플레이 주식회사 광원 유닛, 이를 포함하는 표시 장치 및 표시 장치의 제조 방법
JP7035338B2 (ja) * 2017-05-22 2022-03-15 日本電気硝子株式会社 接合体の製造方法
KR102872847B1 (ko) * 2018-12-27 2025-10-20 덴카 주식회사 형광체 기판, 발광 기판 및 조명 장치
EP3905347B1 (en) * 2018-12-27 2024-02-21 Denka Company Limited Light-emitting substrate, and lighting device
EP3905348B1 (en) * 2018-12-27 2024-01-24 Denka Company Limited Light-emitting substrate, and lighting device
CN113228313B (zh) 2018-12-27 2025-01-07 电化株式会社 荧光体基板、发光基板以及照明装置
JP7425750B2 (ja) 2018-12-27 2024-01-31 デンカ株式会社 蛍光体基板、発光基板及び照明装置
US11367812B2 (en) * 2019-06-05 2022-06-21 Ferro Corporation Layered phosphor in glass
JP7437419B2 (ja) * 2019-12-25 2024-02-22 デンカ株式会社 灯具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2681861A (en) * 1950-12-12 1954-06-22 Westinghouse Electric Corp Glass for embedding zinc sulfide phosphors
JP3769872B2 (ja) * 1997-05-06 2006-04-26 ソニー株式会社 半導体発光素子
JP3536693B2 (ja) * 1998-11-24 2004-06-14 セイコーエプソン株式会社 半導体記憶装置及びその製造方法
JP2003051622A (ja) * 2001-08-07 2003-02-21 Rohm Co Ltd 白色系半導体発光装置
TW518771B (en) * 2001-09-13 2003-01-21 United Epitaxy Co Ltd LED and the manufacturing method thereof
TW558775B (en) * 2002-06-27 2003-10-21 Solidlite Corp Package of compound type LED
EP1627178B1 (en) * 2003-05-05 2018-11-07 GE Lighting Solutions, LLC Led-based light bulb
JP4259198B2 (ja) * 2003-06-18 2009-04-30 豊田合成株式会社 発光装置用波長変換部の製造方法及び発光装置の製造方法
CN100511732C (zh) * 2003-06-18 2009-07-08 丰田合成株式会社 发光器件
DE102004034166B4 (de) * 2003-07-17 2015-08-20 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
JP2005223222A (ja) * 2004-02-06 2005-08-18 Toyoda Gosei Co Ltd 固体素子パッケージ
JP4363217B2 (ja) * 2004-02-19 2009-11-11 日亜化学工業株式会社 アルカリ土類金属ホウ酸塩蛍光体及びそれを用いた発光装置

Similar Documents

Publication Publication Date Title
JP2007080994A5 (enExample)
JP4805347B2 (ja) 発光ダイオード・クラスタ・ランプ
US8197097B2 (en) Light source unit and lighting system
KR100998480B1 (ko) 열전달/발산 모듈을 구비한 반도체 발광 장치
TW200802975A (en) Light emitting diode package having anodized insulation layer and fabrication method therefor
JP4752795B2 (ja) 照明器具用の光源装置
TW200746475A (en) Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
RU2011109198A (ru) Светоизлучающее устройство
JP2007525713A5 (enExample)
TW201413156A (zh) 整合發光二極體式照明設備
CN104025323B (zh) 用于发光二极管的热管理
WO2008105428A1 (ja) 発光装置
TW201105898A (en) Luminous module and lighting apparatus
CN102800784A (zh) 光发射装置及使用该装置的照明设备
TW201307721A (zh) 用於發光二極體照明系統之熱管理子系統、包括熱管理子系統之發光二極體照明系統及／或其製造方法
CN104180202A (zh) Led灯芯和包含其的led球泡灯
US20150155427A1 (en) Method of manufacturing lighting device
JP2007305703A (ja) 発光装置
JP4604819B2 (ja) 発光装置
TWI550232B (zh) 照明裝置及組裝照明裝置的方法
WO2013117168A1 (zh) 发光二极管球泡灯及其制造方法
CN104638091B (zh) Led玻璃基板
JP2013020813A (ja) 電球
KR20100099520A (ko) 조명 장치
JP2013118289A (ja) Ｌｅｄ発光装置