JP2007067110A5 - - Google Patents

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Publication number
JP2007067110A5
JP2007067110A5 JP2005250124A JP2005250124A JP2007067110A5 JP 2007067110 A5 JP2007067110 A5 JP 2007067110A5 JP 2005250124 A JP2005250124 A JP 2005250124A JP 2005250124 A JP2005250124 A JP 2005250124A JP 2007067110 A5 JP2007067110 A5 JP 2007067110A5
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JP
Japan
Prior art keywords
pad
dressing
polishing
polishing pad
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005250124A
Other languages
English (en)
Japanese (ja)
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JP2007067110A (ja
JP4756583B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2005250124A priority Critical patent/JP4756583B2/ja
Priority claimed from JP2005250124A external-priority patent/JP4756583B2/ja
Priority to KR1020060079169A priority patent/KR20070026021A/ko
Priority to US11/466,489 priority patent/US20070049168A1/en
Priority to TW095131781A priority patent/TW200744792A/zh
Publication of JP2007067110A publication Critical patent/JP2007067110A/ja
Publication of JP2007067110A5 publication Critical patent/JP2007067110A5/ja
Application granted granted Critical
Publication of JP4756583B2 publication Critical patent/JP4756583B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005250124A 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置 Expired - Fee Related JP4756583B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005250124A JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置
KR1020060079169A KR20070026021A (ko) 2005-08-30 2006-08-22 연마 패드, 패드 드레싱 평가 방법, 및 연마 기기
US11/466,489 US20070049168A1 (en) 2005-08-30 2006-08-23 Polishing pad, pad dressing evaluation method, and polishing apparatus
TW095131781A TW200744792A (en) 2005-08-30 2006-08-29 Polishing pad, pad dressing evaluation method, and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005250124A JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置

Publications (3)

Publication Number Publication Date
JP2007067110A JP2007067110A (ja) 2007-03-15
JP2007067110A5 true JP2007067110A5 (enExample) 2009-01-08
JP4756583B2 JP4756583B2 (ja) 2011-08-24

Family

ID=37804914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005250124A Expired - Fee Related JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置

Country Status (4)

Country Link
US (1) US20070049168A1 (enExample)
JP (1) JP4756583B2 (enExample)
KR (1) KR20070026021A (enExample)
TW (1) TW200744792A (enExample)

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US8337282B2 (en) 2006-09-06 2012-12-25 Nitta Haas Incorporated Polishing pad
JP5194516B2 (ja) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 化学機械研磨装置の管理方法
JP2010149259A (ja) * 2008-12-26 2010-07-08 Nitta Haas Inc 研磨布
JP5898420B2 (ja) 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
TWI511836B (zh) * 2013-05-09 2015-12-11 Kinik Co 化學機械研磨修整器之檢測裝置及方法
JP6010511B2 (ja) * 2013-08-22 2016-10-19 株式会社荏原製作所 研磨パッドの表面粗さ測定方法
TWI551399B (zh) * 2014-01-20 2016-10-01 中國砂輪企業股份有限公司 高度磨料品質之化學機械研磨修整器
EP3221750A1 (en) 2014-11-23 2017-09-27 M Cubed Technologies Wafer pin chuck fabrication and repair
WO2017030841A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Method for removing contamination from a chuck surface
EP3334564B1 (en) 2015-08-14 2023-11-15 M Cubed Technologies Inc. Method for deterministic finishing of a chuck surface
EP3334566B1 (en) 2015-08-14 2021-11-24 M Cubed Technologies Inc. Wafer chuck featuring reduced friction support surface
WO2017030874A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
WO2017146743A1 (en) * 2016-02-27 2017-08-31 Intel Corporation Pad surface roughness change metrics for chemical mechanical polishing conditioning disks
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
JP7169769B2 (ja) * 2017-08-10 2022-11-11 東京エレクトロン株式会社 基板裏面研磨部材のドレッシング装置及びドレッシング方法
KR102570853B1 (ko) * 2017-08-10 2023-08-25 도쿄엘렉트론가부시키가이샤 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
CN109420973B (zh) * 2017-09-05 2020-11-17 联华电子股份有限公司 晶片研磨盘与其使用方法
CN108500843B (zh) * 2018-04-04 2020-01-14 河南科技学院 一种用于固结磨料研抛垫的磨料射流自适应修整方法
JP6713015B2 (ja) * 2018-04-13 2020-06-24 株式会社大気社 自動研磨システム
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
CN109410806A (zh) 2018-10-30 2019-03-01 重庆先进光电显示技术研究院 一种快速寻找显示面板的公共电压的方法及测试机台
JP6822518B2 (ja) * 2019-05-14 2021-01-27 株式会社Sumco 研磨パッドの管理方法及び研磨パッドの管理システム
KR102674356B1 (ko) * 2019-06-19 2024-06-11 주식회사 쿠라레 연마 패드, 연마 패드의 제조 방법 및 연마 방법
CN114454256B (zh) * 2022-01-08 2023-10-13 奥士康科技股份有限公司 一种提升pcb钻咀研磨寿命的管控方法
CN115890473A (zh) * 2022-12-15 2023-04-04 西安奕斯伟材料科技有限公司 抛光设备及抛光垫检测方法

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US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
JPH11151662A (ja) * 1997-11-18 1999-06-08 Asahi Chem Ind Co Ltd 研磨布
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JP3793810B2 (ja) * 2002-07-09 2006-07-05 独立行政法人国立高等専門学校機構 研削工具の砥面状態検査方法
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US20040230335A1 (en) * 2003-05-13 2004-11-18 Gerding David W. System for capturing shape data for eyeglass lenses, and method for determining shape data for eyeglass lenses
GB2402941B (en) * 2003-06-09 2007-06-27 Kao Corp Method for manufacturing substrate
JP4206318B2 (ja) * 2003-09-17 2009-01-07 三洋電機株式会社 研磨パッドのドレッシング方法及び製造装置
US20050135979A1 (en) * 2003-12-18 2005-06-23 Steve Gootter Device for deodorizing a sink drain and method therefor

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