TW200744792A - Polishing pad, pad dressing evaluation method, and polishing apparatus - Google Patents

Polishing pad, pad dressing evaluation method, and polishing apparatus

Info

Publication number
TW200744792A
TW200744792A TW095131781A TW95131781A TW200744792A TW 200744792 A TW200744792 A TW 200744792A TW 095131781 A TW095131781 A TW 095131781A TW 95131781 A TW95131781 A TW 95131781A TW 200744792 A TW200744792 A TW 200744792A
Authority
TW
Taiwan
Prior art keywords
pad
polishing
polishing pad
dressing
evaluation method
Prior art date
Application number
TW095131781A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Fujita
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200744792A publication Critical patent/TW200744792A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW095131781A 2005-08-30 2006-08-29 Polishing pad, pad dressing evaluation method, and polishing apparatus TW200744792A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005250124A JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置

Publications (1)

Publication Number Publication Date
TW200744792A true TW200744792A (en) 2007-12-16

Family

ID=37804914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131781A TW200744792A (en) 2005-08-30 2006-08-29 Polishing pad, pad dressing evaluation method, and polishing apparatus

Country Status (4)

Country Link
US (1) US20070049168A1 (enExample)
JP (1) JP4756583B2 (enExample)
KR (1) KR20070026021A (enExample)
TW (1) TW200744792A (enExample)

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US8337282B2 (en) 2006-09-06 2012-12-25 Nitta Haas Incorporated Polishing pad
JP5194516B2 (ja) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 化学機械研磨装置の管理方法
JP2010149259A (ja) * 2008-12-26 2010-07-08 Nitta Haas Inc 研磨布
JP5898420B2 (ja) 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
TWI511836B (zh) * 2013-05-09 2015-12-11 Kinik Co 化學機械研磨修整器之檢測裝置及方法
JP6010511B2 (ja) * 2013-08-22 2016-10-19 株式会社荏原製作所 研磨パッドの表面粗さ測定方法
TWI551399B (zh) * 2014-01-20 2016-10-01 中國砂輪企業股份有限公司 高度磨料品質之化學機械研磨修整器
EP3221750A1 (en) 2014-11-23 2017-09-27 M Cubed Technologies Wafer pin chuck fabrication and repair
WO2017030841A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Method for removing contamination from a chuck surface
EP3334564B1 (en) 2015-08-14 2023-11-15 M Cubed Technologies Inc. Method for deterministic finishing of a chuck surface
EP3334566B1 (en) 2015-08-14 2021-11-24 M Cubed Technologies Inc. Wafer chuck featuring reduced friction support surface
WO2017030874A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
WO2017146743A1 (en) * 2016-02-27 2017-08-31 Intel Corporation Pad surface roughness change metrics for chemical mechanical polishing conditioning disks
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
JP7169769B2 (ja) * 2017-08-10 2022-11-11 東京エレクトロン株式会社 基板裏面研磨部材のドレッシング装置及びドレッシング方法
KR102570853B1 (ko) * 2017-08-10 2023-08-25 도쿄엘렉트론가부시키가이샤 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
CN109420973B (zh) * 2017-09-05 2020-11-17 联华电子股份有限公司 晶片研磨盘与其使用方法
CN108500843B (zh) * 2018-04-04 2020-01-14 河南科技学院 一种用于固结磨料研抛垫的磨料射流自适应修整方法
JP6713015B2 (ja) * 2018-04-13 2020-06-24 株式会社大気社 自動研磨システム
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
CN109410806A (zh) 2018-10-30 2019-03-01 重庆先进光电显示技术研究院 一种快速寻找显示面板的公共电压的方法及测试机台
JP6822518B2 (ja) * 2019-05-14 2021-01-27 株式会社Sumco 研磨パッドの管理方法及び研磨パッドの管理システム
KR102674356B1 (ko) * 2019-06-19 2024-06-11 주식회사 쿠라레 연마 패드, 연마 패드의 제조 방법 및 연마 방법
CN114454256B (zh) * 2022-01-08 2023-10-13 奥士康科技股份有限公司 一种提升pcb钻咀研磨寿命的管控方法
CN115890473A (zh) * 2022-12-15 2023-04-04 西安奕斯伟材料科技有限公司 抛光设备及抛光垫检测方法

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US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
JPH11151662A (ja) * 1997-11-18 1999-06-08 Asahi Chem Ind Co Ltd 研磨布
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US6517414B1 (en) * 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
KR100432781B1 (ko) * 2001-03-22 2004-05-24 삼성전자주식회사 연마패드의 측정장치 및 방법
US6796879B2 (en) * 2002-01-12 2004-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Dual wafer-loss sensor and water-resistant sensor holder
JP4102081B2 (ja) * 2002-02-28 2008-06-18 株式会社荏原製作所 研磨装置及び研磨面の異物検出方法
JP3793810B2 (ja) * 2002-07-09 2006-07-05 独立行政法人国立高等専門学校機構 研削工具の砥面状態検査方法
US7442113B2 (en) * 2003-04-23 2008-10-28 Lsi Corporation Visual wear confirmation polishing pad
US20040230335A1 (en) * 2003-05-13 2004-11-18 Gerding David W. System for capturing shape data for eyeglass lenses, and method for determining shape data for eyeglass lenses
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JP4206318B2 (ja) * 2003-09-17 2009-01-07 三洋電機株式会社 研磨パッドのドレッシング方法及び製造装置
US20050135979A1 (en) * 2003-12-18 2005-06-23 Steve Gootter Device for deodorizing a sink drain and method therefor

Also Published As

Publication number Publication date
US20070049168A1 (en) 2007-03-01
JP2007067110A (ja) 2007-03-15
KR20070026021A (ko) 2007-03-08
JP4756583B2 (ja) 2011-08-24

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