KR20070026021A - 연마 패드, 패드 드레싱 평가 방법, 및 연마 기기 - Google Patents

연마 패드, 패드 드레싱 평가 방법, 및 연마 기기 Download PDF

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Publication number
KR20070026021A
KR20070026021A KR1020060079169A KR20060079169A KR20070026021A KR 20070026021 A KR20070026021 A KR 20070026021A KR 1020060079169 A KR1020060079169 A KR 1020060079169A KR 20060079169 A KR20060079169 A KR 20060079169A KR 20070026021 A KR20070026021 A KR 20070026021A
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KR
South Korea
Prior art keywords
pad
polishing
dressing
polishing pad
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060079169A
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English (en)
Korean (ko)
Inventor
다카시 후지타
Original Assignee
가부시키가이샤 도교 세이미쓰
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도교 세이미쓰 filed Critical 가부시키가이샤 도교 세이미쓰
Publication of KR20070026021A publication Critical patent/KR20070026021A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020060079169A 2005-08-30 2006-08-22 연마 패드, 패드 드레싱 평가 방법, 및 연마 기기 Withdrawn KR20070026021A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005250124A JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置
JPJP-P-2005-00250124 2005-08-30

Publications (1)

Publication Number Publication Date
KR20070026021A true KR20070026021A (ko) 2007-03-08

Family

ID=37804914

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060079169A Withdrawn KR20070026021A (ko) 2005-08-30 2006-08-22 연마 패드, 패드 드레싱 평가 방법, 및 연마 기기

Country Status (4)

Country Link
US (1) US20070049168A1 (enExample)
JP (1) JP4756583B2 (enExample)
KR (1) KR20070026021A (enExample)
TW (1) TW200744792A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190017680A (ko) * 2017-08-10 2019-02-20 도쿄엘렉트론가부시키가이샤 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
US10891885B2 (en) 2018-10-30 2021-01-12 Chongqing Advance Display Technology Research Method and test machine platform for quickly searching for common voltage of display panel

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008029725A1 (en) * 2006-09-06 2008-03-13 Nitta Haas Incorporated Polishing pad
JP5194516B2 (ja) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 化学機械研磨装置の管理方法
JP2010149259A (ja) * 2008-12-26 2010-07-08 Nitta Haas Inc 研磨布
JP5898420B2 (ja) 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
TWI511836B (zh) * 2013-05-09 2015-12-11 Kinik Co 化學機械研磨修整器之檢測裝置及方法
JP6010511B2 (ja) * 2013-08-22 2016-10-19 株式会社荏原製作所 研磨パッドの表面粗さ測定方法
TWI551399B (zh) * 2014-01-20 2016-10-01 中國砂輪企業股份有限公司 高度磨料品質之化學機械研磨修整器
WO2016081951A1 (en) * 2014-11-23 2016-05-26 M Cubed Technologies Wafer pin chuck fabrication and repair
EP3334561B1 (en) 2015-08-14 2023-12-20 M Cubed Technologies Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
JP7032307B2 (ja) 2015-08-14 2022-03-08 ツー－シックス デラウェア インコーポレイテッド チャック表面の決定論的な仕上げのための方法
EP3334566B1 (en) 2015-08-14 2021-11-24 M Cubed Technologies Inc. Wafer chuck featuring reduced friction support surface
US10792778B2 (en) 2015-08-14 2020-10-06 M Cubed Technologies, Inc. Method for removing contamination from a chuck surface
WO2017146743A1 (en) * 2016-02-27 2017-08-31 Intel Corporation Pad surface roughness change metrics for chemical mechanical polishing conditioning disks
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
JP7169769B2 (ja) * 2017-08-10 2022-11-11 東京エレクトロン株式会社 基板裏面研磨部材のドレッシング装置及びドレッシング方法
CN109420973B (zh) * 2017-09-05 2020-11-17 联华电子股份有限公司 晶片研磨盘与其使用方法
CN108500843B (zh) * 2018-04-04 2020-01-14 河南科技学院 一种用于固结磨料研抛垫的磨料射流自适应修整方法
JP6713015B2 (ja) * 2018-04-13 2020-06-24 株式会社大気社 自動研磨システム
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
JP6822518B2 (ja) * 2019-05-14 2021-01-27 株式会社Sumco 研磨パッドの管理方法及び研磨パッドの管理システム
US12186855B2 (en) * 2019-06-19 2025-01-07 Kuraray Co., Ltd. Polishing pad, method for manufacturing polishing pad, and polishing method
CN114454256B (zh) * 2022-01-08 2023-10-13 奥士康科技股份有限公司 一种提升pcb钻咀研磨寿命的管控方法
CN115890473A (zh) * 2022-12-15 2023-04-04 西安奕斯伟材料科技有限公司 抛光设备及抛光垫检测方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417050A (ja) * 1990-05-10 1992-01-21 Mitsubishi Electric Corp ワンチップマイクロコンピュータ
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
US6090475A (en) * 1996-05-24 2000-07-18 Micron Technology Inc. Polishing pad, methods of manufacturing and use
JPH10100062A (ja) * 1996-09-26 1998-04-21 Toshiba Corp 研磨パッド及び研磨装置
US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
JPH11151662A (ja) * 1997-11-18 1999-06-08 Asahi Chem Ind Co Ltd 研磨布
US6331137B1 (en) * 1998-08-28 2001-12-18 Advanced Micro Devices, Inc Polishing pad having open area which varies with distance from initial pad surface
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
JP2001223190A (ja) * 2000-02-08 2001-08-17 Hitachi Ltd 研磨パッドの表面状態評価方法及びその装置とそれを用いた薄膜デバイスの製造方法及びその製造装置
US6517414B1 (en) * 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
KR100432781B1 (ko) * 2001-03-22 2004-05-24 삼성전자주식회사 연마패드의 측정장치 및 방법
US6796879B2 (en) * 2002-01-12 2004-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Dual wafer-loss sensor and water-resistant sensor holder
JP4102081B2 (ja) * 2002-02-28 2008-06-18 株式会社荏原製作所 研磨装置及び研磨面の異物検出方法
JP3793810B2 (ja) * 2002-07-09 2006-07-05 独立行政法人国立高等専門学校機構 研削工具の砥面状態検査方法
US7442113B2 (en) * 2003-04-23 2008-10-28 Lsi Corporation Visual wear confirmation polishing pad
US20040230335A1 (en) * 2003-05-13 2004-11-18 Gerding David W. System for capturing shape data for eyeglass lenses, and method for determining shape data for eyeglass lenses
GB2402941B (en) * 2003-06-09 2007-06-27 Kao Corp Method for manufacturing substrate
JP4206318B2 (ja) * 2003-09-17 2009-01-07 三洋電機株式会社 研磨パッドのドレッシング方法及び製造装置
US20050135979A1 (en) * 2003-12-18 2005-06-23 Steve Gootter Device for deodorizing a sink drain and method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190017680A (ko) * 2017-08-10 2019-02-20 도쿄엘렉트론가부시키가이샤 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
US10891885B2 (en) 2018-10-30 2021-01-12 Chongqing Advance Display Technology Research Method and test machine platform for quickly searching for common voltage of display panel

Also Published As

Publication number Publication date
JP2007067110A (ja) 2007-03-15
TW200744792A (en) 2007-12-16
US20070049168A1 (en) 2007-03-01
JP4756583B2 (ja) 2011-08-24

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Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20060822

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid