JP4756583B2 - 研磨パッド、パッドドレッシング評価方法、及び研磨装置 - Google Patents

研磨パッド、パッドドレッシング評価方法、及び研磨装置 Download PDF

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Publication number
JP4756583B2
JP4756583B2 JP2005250124A JP2005250124A JP4756583B2 JP 4756583 B2 JP4756583 B2 JP 4756583B2 JP 2005250124 A JP2005250124 A JP 2005250124A JP 2005250124 A JP2005250124 A JP 2005250124A JP 4756583 B2 JP4756583 B2 JP 4756583B2
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Japan
Prior art keywords
pad
dressing
polishing
color
polishing pad
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Expired - Fee Related
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JP2005250124A
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English (en)
Japanese (ja)
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JP2007067110A5 (enExample
JP2007067110A (ja
Inventor
隆 藤田
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Priority to JP2005250124A priority Critical patent/JP4756583B2/ja
Priority to KR1020060079169A priority patent/KR20070026021A/ko
Priority to US11/466,489 priority patent/US20070049168A1/en
Priority to TW095131781A priority patent/TW200744792A/zh
Publication of JP2007067110A publication Critical patent/JP2007067110A/ja
Publication of JP2007067110A5 publication Critical patent/JP2007067110A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2005250124A 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置 Expired - Fee Related JP4756583B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005250124A JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置
KR1020060079169A KR20070026021A (ko) 2005-08-30 2006-08-22 연마 패드, 패드 드레싱 평가 방법, 및 연마 기기
US11/466,489 US20070049168A1 (en) 2005-08-30 2006-08-23 Polishing pad, pad dressing evaluation method, and polishing apparatus
TW095131781A TW200744792A (en) 2005-08-30 2006-08-29 Polishing pad, pad dressing evaluation method, and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005250124A JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置

Publications (3)

Publication Number Publication Date
JP2007067110A JP2007067110A (ja) 2007-03-15
JP2007067110A5 JP2007067110A5 (enExample) 2009-01-08
JP4756583B2 true JP4756583B2 (ja) 2011-08-24

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ID=37804914

Family Applications (1)

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JP2005250124A Expired - Fee Related JP4756583B2 (ja) 2005-08-30 2005-08-30 研磨パッド、パッドドレッシング評価方法、及び研磨装置

Country Status (4)

Country Link
US (1) US20070049168A1 (enExample)
JP (1) JP4756583B2 (enExample)
KR (1) KR20070026021A (enExample)
TW (1) TW200744792A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020185641A (ja) * 2019-05-14 2020-11-19 株式会社Sumco 研磨パッドの管理方法及び研磨パッドの管理システム

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US8337282B2 (en) 2006-09-06 2012-12-25 Nitta Haas Incorporated Polishing pad
JP5194516B2 (ja) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 化学機械研磨装置の管理方法
JP2010149259A (ja) * 2008-12-26 2010-07-08 Nitta Haas Inc 研磨布
JP5898420B2 (ja) 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
TWI511836B (zh) * 2013-05-09 2015-12-11 Kinik Co 化學機械研磨修整器之檢測裝置及方法
JP6010511B2 (ja) * 2013-08-22 2016-10-19 株式会社荏原製作所 研磨パッドの表面粗さ測定方法
TWI551399B (zh) * 2014-01-20 2016-10-01 中國砂輪企業股份有限公司 高度磨料品質之化學機械研磨修整器
EP3221750A1 (en) 2014-11-23 2017-09-27 M Cubed Technologies Wafer pin chuck fabrication and repair
WO2017030841A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Method for removing contamination from a chuck surface
EP3334564B1 (en) 2015-08-14 2023-11-15 M Cubed Technologies Inc. Method for deterministic finishing of a chuck surface
EP3334566B1 (en) 2015-08-14 2021-11-24 M Cubed Technologies Inc. Wafer chuck featuring reduced friction support surface
WO2017030874A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
WO2017146743A1 (en) * 2016-02-27 2017-08-31 Intel Corporation Pad surface roughness change metrics for chemical mechanical polishing conditioning disks
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
JP7169769B2 (ja) * 2017-08-10 2022-11-11 東京エレクトロン株式会社 基板裏面研磨部材のドレッシング装置及びドレッシング方法
KR102570853B1 (ko) * 2017-08-10 2023-08-25 도쿄엘렉트론가부시키가이샤 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
CN109420973B (zh) * 2017-09-05 2020-11-17 联华电子股份有限公司 晶片研磨盘与其使用方法
CN108500843B (zh) * 2018-04-04 2020-01-14 河南科技学院 一种用于固结磨料研抛垫的磨料射流自适应修整方法
JP6713015B2 (ja) * 2018-04-13 2020-06-24 株式会社大気社 自動研磨システム
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
CN109410806A (zh) 2018-10-30 2019-03-01 重庆先进光电显示技术研究院 一种快速寻找显示面板的公共电压的方法及测试机台
KR102674356B1 (ko) * 2019-06-19 2024-06-11 주식회사 쿠라레 연마 패드, 연마 패드의 제조 방법 및 연마 방법
CN114454256B (zh) * 2022-01-08 2023-10-13 奥士康科技股份有限公司 一种提升pcb钻咀研磨寿命的管控方法
CN115890473A (zh) * 2022-12-15 2023-04-04 西安奕斯伟材料科技有限公司 抛光设备及抛光垫检测方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020185641A (ja) * 2019-05-14 2020-11-19 株式会社Sumco 研磨パッドの管理方法及び研磨パッドの管理システム

Also Published As

Publication number Publication date
US20070049168A1 (en) 2007-03-01
TW200744792A (en) 2007-12-16
JP2007067110A (ja) 2007-03-15
KR20070026021A (ko) 2007-03-08

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