TWI412428B - - Google Patents

Info

Publication number
TWI412428B
TWI412428B TW098137727A TW98137727A TWI412428B TW I412428 B TWI412428 B TW I412428B TW 098137727 A TW098137727 A TW 098137727A TW 98137727 A TW98137727 A TW 98137727A TW I412428 B TWI412428 B TW I412428B
Authority
TW
Taiwan
Prior art keywords
dresser
pad
rpm
pressure
combination
Prior art date
Application number
TW098137727A
Other languages
English (en)
Chinese (zh)
Other versions
TW201024029A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/346,264 external-priority patent/US7749050B2/en
Application filed filed Critical
Publication of TW201024029A publication Critical patent/TW201024029A/zh
Application granted granted Critical
Publication of TWI412428B publication Critical patent/TWI412428B/zh

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW098137727A 2008-12-30 2009-11-06 Pad conditioner dresser TW201024029A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/346,264 US7749050B2 (en) 2006-02-06 2008-12-30 Pad conditioner dresser

Publications (2)

Publication Number Publication Date
TW201024029A TW201024029A (en) 2010-07-01
TWI412428B true TWI412428B (enExample) 2013-10-21

Family

ID=42500494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098137727A TW201024029A (en) 2008-12-30 2009-11-06 Pad conditioner dresser

Country Status (2)

Country Link
CN (1) CN101767315B (enExample)
TW (1) TW201024029A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343562A (zh) * 2011-08-14 2012-02-08 上海合晶硅材料有限公司 延长抛光布垫使用寿命的方法
CN104742008B (zh) * 2013-12-27 2017-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法及化学机械研磨装置
KR102581481B1 (ko) * 2016-10-18 2023-09-21 삼성전자주식회사 화학적 기계적 연마 방법, 반도체 소자의 제조 방법, 및 반도체 제조 장치
TWI716207B (zh) * 2019-11-27 2021-01-11 國家中山科學研究院 多震動源研磨腔體
CN113547449B (zh) * 2021-07-30 2022-06-10 河南科技学院 一种具有自退让性的固结磨粒化学机械抛光垫及其制备方法和应用
CN114734372A (zh) * 2022-03-28 2022-07-12 北京烁科精微电子装备有限公司 一种晶圆研磨方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010000753A1 (en) * 1997-09-02 2001-05-03 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
TW200641986A (en) * 2005-05-26 2006-12-01 Applied Materials Inc Smart conditioner rinse station

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010000753A1 (en) * 1997-09-02 2001-05-03 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
TW200641986A (en) * 2005-05-26 2006-12-01 Applied Materials Inc Smart conditioner rinse station

Also Published As

Publication number Publication date
CN101767315B (zh) 2012-07-04
CN101767315A (zh) 2010-07-07
TW201024029A (en) 2010-07-01

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