TW201024029A - Pad conditioner dresser - Google Patents
Pad conditioner dresser Download PDFInfo
- Publication number
- TW201024029A TW201024029A TW098137727A TW98137727A TW201024029A TW 201024029 A TW201024029 A TW 201024029A TW 098137727 A TW098137727 A TW 098137727A TW 98137727 A TW98137727 A TW 98137727A TW 201024029 A TW201024029 A TW 201024029A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- dresser
- pad
- rpm
- pressure
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims abstract description 170
- 239000002245 particle Substances 0.000 claims abstract description 134
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000000126 substance Substances 0.000 claims abstract description 30
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 230000003746 surface roughness Effects 0.000 claims description 43
- 238000009966 trimming Methods 0.000 claims description 17
- 230000002829 reductive effect Effects 0.000 claims description 12
- 230000003750 conditioning effect Effects 0.000 claims description 8
- 238000002310 reflectometry Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 36
- 239000000463 material Substances 0.000 description 23
- 239000002002 slurry Substances 0.000 description 20
- 238000005520 cutting process Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- 230000008859 change Effects 0.000 description 7
- 239000010432 diamond Substances 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000007792 addition Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 235000002566 Capsicum Nutrition 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000006002 Pepper Substances 0.000 description 1
- 235000016761 Piper aduncum Nutrition 0.000 description 1
- 235000017804 Piper guineense Nutrition 0.000 description 1
- 244000203593 Piper nigrum Species 0.000 description 1
- 235000008184 Piper nigrum Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000011326 mechanical measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002311 subsequent effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/346,264 US7749050B2 (en) | 2006-02-06 | 2008-12-30 | Pad conditioner dresser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201024029A true TW201024029A (en) | 2010-07-01 |
| TWI412428B TWI412428B (enExample) | 2013-10-21 |
Family
ID=42500494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098137727A TW201024029A (en) | 2008-12-30 | 2009-11-06 | Pad conditioner dresser |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101767315B (enExample) |
| TW (1) | TW201024029A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI716207B (zh) * | 2019-11-27 | 2021-01-11 | 國家中山科學研究院 | 多震動源研磨腔體 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343562A (zh) * | 2011-08-14 | 2012-02-08 | 上海合晶硅材料有限公司 | 延长抛光布垫使用寿命的方法 |
| CN104742008B (zh) * | 2013-12-27 | 2017-03-22 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法及化学机械研磨装置 |
| KR102581481B1 (ko) * | 2016-10-18 | 2023-09-21 | 삼성전자주식회사 | 화학적 기계적 연마 방법, 반도체 소자의 제조 방법, 및 반도체 제조 장치 |
| CN113547449B (zh) * | 2021-07-30 | 2022-06-10 | 河南科技学院 | 一种具有自退让性的固结磨粒化学机械抛光垫及其制备方法和应用 |
| CN114734372A (zh) * | 2022-03-28 | 2022-07-12 | 北京烁科精微电子装备有限公司 | 一种晶圆研磨方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6191038B1 (en) * | 1997-09-02 | 2001-02-20 | Matsushita Electronics Corporation | Apparatus and method for chemical/mechanical polishing |
| US7210981B2 (en) * | 2005-05-26 | 2007-05-01 | Applied Materials, Inc. | Smart conditioner rinse station |
-
2009
- 2009-11-06 TW TW098137727A patent/TW201024029A/zh unknown
- 2009-11-19 CN CN2009102226209A patent/CN101767315B/zh not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI716207B (zh) * | 2019-11-27 | 2021-01-11 | 國家中山科學研究院 | 多震動源研磨腔體 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101767315B (zh) | 2012-07-04 |
| CN101767315A (zh) | 2010-07-07 |
| TWI412428B (enExample) | 2013-10-21 |
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