JP2006114861A5 - - Google Patents

Download PDF

Info

Publication number
JP2006114861A5
JP2006114861A5 JP2005024182A JP2005024182A JP2006114861A5 JP 2006114861 A5 JP2006114861 A5 JP 2006114861A5 JP 2005024182 A JP2005024182 A JP 2005024182A JP 2005024182 A JP2005024182 A JP 2005024182A JP 2006114861 A5 JP2006114861 A5 JP 2006114861A5
Authority
JP
Japan
Prior art keywords
polishing
polished
substrate
pressure
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005024182A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006114861A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005024182A priority Critical patent/JP2006114861A/ja
Priority claimed from JP2005024182A external-priority patent/JP2006114861A/ja
Priority to TW094129205A priority patent/TW200613092A/zh
Priority to PCT/JP2005/016063 priority patent/WO2006022452A2/en
Priority to US11/661,141 priority patent/US20070254558A1/en
Publication of JP2006114861A publication Critical patent/JP2006114861A/ja
Priority to US11/797,480 priority patent/US20070205112A1/en
Publication of JP2006114861A5 publication Critical patent/JP2006114861A5/ja
Pending legal-status Critical Current

Links

JP2005024182A 2004-08-27 2005-01-31 研磨装置及び研磨方法 Pending JP2006114861A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005024182A JP2006114861A (ja) 2004-09-14 2005-01-31 研磨装置及び研磨方法
TW094129205A TW200613092A (en) 2004-08-27 2005-08-26 Polishing apparatus and polishing method
PCT/JP2005/016063 WO2006022452A2 (en) 2004-08-27 2005-08-26 Polishing apparatus and polishing method
US11/661,141 US20070254558A1 (en) 2004-08-27 2005-08-26 Polishing Apparatus and Polishing Method
US11/797,480 US20070205112A1 (en) 2004-08-27 2007-05-03 Polishing apparatus and polishing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004267379 2004-09-14
JP2005024182A JP2006114861A (ja) 2004-09-14 2005-01-31 研磨装置及び研磨方法

Publications (2)

Publication Number Publication Date
JP2006114861A JP2006114861A (ja) 2006-04-27
JP2006114861A5 true JP2006114861A5 (enExample) 2008-03-13

Family

ID=36383091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005024182A Pending JP2006114861A (ja) 2004-08-27 2005-01-31 研磨装置及び研磨方法

Country Status (1)

Country Link
JP (1) JP2006114861A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5117163B2 (ja) * 2007-10-29 2013-01-09 コバレントマテリアル株式会社 ワイヤソーによるワーク切断方法
JP5495508B2 (ja) * 2008-05-23 2014-05-21 日揮触媒化成株式会社 研磨用粒子分散液およびその製造方法
US10308851B2 (en) 2013-12-19 2019-06-04 Klingspor Ag Abrasive particle and abrasive exhibiting high grinding performance
ES2798323T3 (es) 2014-06-18 2020-12-10 Klingspor Ag Partícula abrasiva multicapa
JP7002350B2 (ja) * 2018-01-23 2022-01-20 日揮触媒化成株式会社 セリア系複合中空微粒子分散液、その製造方法及びセリア系複合中空微粒子分散液を含む研磨用砥粒分散液

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003080457A (ja) * 2001-09-07 2003-03-18 Ebara Corp 切削工具及びその製造方法

Similar Documents

Publication Publication Date Title
US5692950A (en) Abrasive construction for semiconductor wafer modification
TWI235690B (en) Arrangement and method for conditioning a polishing pad
US20100186479A1 (en) Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
JP6082654B2 (ja) 研削方法
JP2014050959A5 (enExample)
JPH03234467A (ja) スタンパの金型取付面の研磨方法およびその研磨機
RU2009144762A (ru) Способ и аппарат для образования нескольких микроканалов
JPH08227867A (ja) 研磨方法および研磨装置
JP2010064220A5 (enExample)
CN110208197B (zh) 小尺寸及不规则样品的制样方法
KR20160003905A (ko) 화학 기계적 연마 장치 및 그 방법
EP1905542B1 (en) Method of determining the number of active abrasive grains on a conditioning disk
TW201114550A (en) Apparatus and method for precision edge finishing
JP2010105147A (ja) コンディショニングディスクの摩擦係数を測定する装置および方法
JP2006114861A5 (enExample)
CN109794850B (zh) 具有多用途复合窗口的抛光垫
JPH09131660A (ja) 半導体製造装置及び方法
JP2005001059A (ja) 研磨用積層体
CN213382325U (zh) 一种地砖切割辅助工具
CN205915536U (zh) 一种压式双丝杆调节的手动按压切磨一体机
JP7294794B2 (ja) パッド摩耗インジケータを有する研磨パッド
CN115625591B (zh) 一种准确控制磨抛深度的磨抛设备
JP2004014999A (ja) Ｃｍｐ研磨装置及び研磨方法
JP2004001227A5 (enExample)
KR20180078071A (ko) 금속시료 내마모성 테스트 장치